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Author: <span>Jarnistech</span>

Jarnistech > Articles by: Jarnistech
PCB DFM and PCBA DFA: How Do They Differ?

PCB DFM and PCBA DFA: How Do They Differ?

In contemporary times, the lexicon of electronics hobbyists and novices has seen the increasing use of terms such as DFM (Design for Manufacture), DFA (Design for Assembly), and more broadly, DFX (Design for Excellence). To alleviate any confusion, our aim is to establish the term PCBA Design for Assembly (PCBA DFA) as a prominent concept, […]

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Exploring the Potential of Shengyi SI10US PCB Material

Exploring the Potential of Shengyi SI10US PCB Material

Shengyi SI10US is a highly advanced and versatile PCB base material that offers exceptional thermal, mechanical, and dielectric properties. With its high glass transition temperature, low dielectric constant, low coefficient of thermal expansion, high decomposition temperature, and low dissipation factor, Shengyi SI10US is a reliable choice for various demanding applications. In this article, we will […]

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What Is Substrate-like PCB(SLP)?

What Is Substrate-like PCB(SLP)?

Substrate-like PCBs (SLPs) have emerged as a game-changing technology in the field of PCB design and manufacturing. With their unique characteristics and capabilities, SLPs are transforming the industry by enabling smaller chipsets, accommodating more components in limited space, and offering faster production cycles.  What Is SLP? Substrate-like PCB (SLP) is essentially a high-end HDI board. From […]

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IC Substrate: Enabling Advanced Electronics Integration

IC Substrate: Enabling Advanced Electronics Integration

From 2020 to 2021, there has been a worldwide shortage of integrated circuit (IC) supply, resulting in a heightened importance of ICs. This shortage has driven advancements in miniaturization, low power consumption, intelligence, and high reliability in electronic components. As a result, the integrated circuit industry has witnessed rapid growth in recent years. One crucial […]

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Guide to RF PCB Design and Microwave Material Selection

Guide to RF PCB Design and Microwave Material Selection

The choice of materials plays a pivotal role in the design and performance of RF PCBs. RF (Radio Frequency) circuits operate at high frequencies, demanding specific material properties to ensure optimal signal integrity, impedance control, and overall system performance. In this informative article, we aim to offer a thorough and all-encompassing set of instructions for […]

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Factors Affecting HDI PCB Production Costs

Factors Affecting HDI PCB Production Costs

HDI PCBs are a type of printed circuit board characterized by high-density circuits and microvias created through laser drilling techniques. They are widely used for fine-pitch assembly, and leading HDI PCB manufacturers like JarnisTech offer ultra HDI PCB assembly with a minimum pitch as low as 0.05mm. These advanced PCBs are essential for various applications […]

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The Importance of 3D Printed PCBs in Modern Electronics Production

The Importance of 3D Printed PCBs in Modern Electronics Production

Advancements in technology have led to significant progress in the PCB (Printed Circuit Board) industry, driven by the growing demands within the electronics sector. PCBs play a pivotal role in the efficient functioning of electronic devices, making them an essential component in electronics production. Notably, researchers have embarked on experimental endeavors to explore the potential […]

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4 Ways to Make PCB Prototype for Your Exact Requirements

4 Ways to Make PCB Prototype for Your Exact Requirements

Engineers have successfully integrated PCB prototyping into various design processes to assess the functionality of PCB-based products. This prototyping system proves particularly advantageous in scenarios where post-production failures result in costly rework and redesign. In the realm of industrial design, the creation of new PCB inventions represents valuable intellectual property rights, necessitating careful consideration throughout […]

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