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Jarnistech > HDI PCB

JarnisTech, A more 20-year HDI experience PCB manufacturer. Send your HDI design file to [email protected]. Get the best price now!

High-density Interconnect (HDI)

High Density Interconnect (HDI), Printed Circuit Board High-density interconnect circuit boards, also known as HDI circuit boards, have a higher wiring density per area than the traditional printed circuit board. HDI PCBs are described as having one or several of the following: microvias (blind and buried vias), built-up laminates, and high signal performance considerations.

The technology of PCB manufacturing has undoubtedly advanced parallel to our increasing need for compactness and efficiency. As a result, in comparison with conventional boards, HDI boards are more compact and have fewer vias, pads, copper tracks, and spaces.

Engineered with intricate wiring configurations, HDI boards present a solution that results in smaller, lighter PCBs with a reduced layer count. There may even be instances where one HDI board executes the tasks of several traditional PCBs, thereby eliminating the need to manufacture multiple boards

This technology is the fastest growing in the PCB industry,and you can purchase HDI PCB boards from JarnisTech now. Compared to traditional circuit boards, HDI PCBs feature blind vias and buried via holes as well as high circuit density.

HDI Printed Circuit Board Development

The advent of HDI printed circuit boards was a response to the necessity for enhanced performance and computational capacity in increasingly compact parcels, a demand primarily driven by industries such as telecommunications. The mobile phone sector in particular–in their pursuit of more powerful, smaller devices–required a higher volume of circuitry to be densely configured into these compressed packages. However, the trends in Integrated Circuit Technology were another key factor in the development of HDI PCBs. They were able to force people to rethink the way they built printed circuit board layouts and interconnects.

Here are a few important trends in IC technology:

●Shrinking the size of the chip.
●The decreasing size of gates.
●Controlling power dissipation by reducing operating voltages.
●Increasing operating speeds and clock rates ( signal transitions).
●Enhancing gate integration levels ( transistors per unit area, on a chip).

In packaging ICs, the trend has shifted away from low-count peripheral lead frames to surface mount technology. This allows for the placement of interconnecting Pins beneath the entire surface of the IC. The Ball Grid Array (BGA) is one such technology. It places interconnecting pins in a grid-like pattern on the underside side of an IC. The IC packages become more dense as more pins are added. This causes the spacing between the pads and circuit board traces to decrease (known as the pitch). This helps to shrink the electronics’ package size, but it also creates problems and requires changes in the manufacturing process of HDI PCBs.

Other advantages of BGAs include a lower thermal resistance between the devices and the PCB. This allows for lower operating temperatures and a higher transistor density, which helps to maintain acceptable chip operating temperatures. Grid array packaging also has the advantage of shorter interconnecting cables. The shorter leads result in lower inductance, which reduces signal distortion in high-speed circuits and improves overall performance.

The Process of Making HDI PCB

It is difficult to make an HDI PCB. To make an HDI PCB, there are many steps that you need to take. our need to have technician expertise, special equipment, as well as care processes to make an HDI PCB. Some equipment required for manufacturing HDI PCBs includes laser imaging, plugging, sequential lamination cycles and laser drills.

Laser drilling technology is an essential part of making an HDI PCB. A PCB needs to have thin pathways from and to components. This is not possible with traditional acidic methods. Using laser drilling technology, it is efficient to make HDI PCBs, and no problems will arise during their creation. As it contains a beam of light of 20 microns, it can make tiny paths in the board by cutting it through glass and metal slightly.

An HDI PCB represents a more intricate construct compared to a standard PCB due to its tighter pathways and greater quantity of components. Thus, one should use a multilayered design with insulating material. Devices fitted with an HDI PCB are likely to perform better with such a configuration. The culmination of HDI PCB creation is the lamination process, which is typically achieved using a heat roller method. Prior to this step, it’s vital that all layers are stacked appropriately.

High Density Interconnect PCB

Why Choose JarnisTech to Fabrication Your HDI PCB ?

JarnisTech is a high-density interconnect manufacturer of printed circuit boards. We have been in business for over 20 years and believe quality is No1. Combine that with competitive pricing and quick responses, and overseas market development, as well as unmatched flexibility. Contact us now, you will have the perfect a HDI PCB manufacturer, we can to meet all of your HDI PCB requirements.

PCB Materials for HDI Circuit Board Fabrication

JarnisTech has many material options from top manufacturers such as Isola, Nelco, Arlon, Taconic, and Rogers. Laminate options include advanced properties such as:

●  High thermal reliability
●  Ultra-Low Loss
●  High-Speed Digital
●  Halogen-Free
●  RoHS Compliant
●  High-quality Lead-Free Tg

Stacked Microvias or Second Generation Microvias

●  This planar surface is ideal for BGAs (VA in-pad).
●  Allows any layer via technology.
●  Provides solid copper plate, eliminating potential solder voiding.
●  Offers a thermal management solution.
●  Multiple layers allow for increased routing.
●  Provide Router solutions for next-generation apps.
●  Enhances the current carrying capacity.

6 Types of HDI Boards

●  Using Layer pairs are those with coreless construction
●  Using layer pairs are those with alternate coreless constructions
●  those with through vias and buried vias.
●  Those with two or more HDI layers with through vias.
●  From surface to surface those with through vias.
●  Those with passive substrates and no electrical connection.

A PCB with any layer connect is the next technological advancement after the HDI microvia PCB. All electrical connections between individual layers consist only of laser-drilled microvias. This technology has the advantage that all layers can be interconnected. JarnisTech uses laser-drilled microvias that have been electroplated with copper to produce HDI PCBs.

Design Considerations-HDI PCBS

The production of High Density Interconnector (HDI) PCBs entails techniques that are distinct from those employed in crafting other PCB varieties. Presently, it might serve you well to acquaint yourself with various facets of HDI PCB Design Considerations:

Sequential Laminate:

During the lamination process, the core of the PCB is combined with copper and pre-preg layers to make multi-layer PCBs. This is done by applying heat pressure. The required heat and pressure will vary from one board to the next. The PCB manufacturer will drill vias after the lamination phase has been completed. As opposed to other PCB types, HDI boards go through multiple laminations. This sequential lamination process prevents shifting and breaking during drilling.

Via In-pad Production Process:

The process of via-in-pad fabrication involves the precision placement of vias on the expansive lands of your PCB, followed by plating, filling with one among several alternatives, capping, and eventually, an additional plating phase. In the majority of scenarios, via-in-pad necessitates a comprehensive 10- to 12-step process, demanding specialized machinery and proficient technicians. The via-in pad is an excellent choice for HDI PCBs as it simplifies thermal management, reduces space requirements, and provides one of the fastest ways to bypass capacitors in high-frequency designs.

Via Fill Types:

Via fills types should always be compatible with your application and PCB requirements. We use a variety of via-fill materials, including electrochemical plating, nonconductive epoxy, silver-filled and copper-filled. Nonconductive epoxy is the most popular via fill. Nonconductive epoxy is the most common via fill. It should be flush with the land and will sell completely, just like traditional lands. Fills should allow standard vias and microvias to be blinded, buried or drilled. Finally, they must be plated to conceal them underneath SMT lands. Multiple drill cycles are used at precise controlled depths to ensure that the drilling process goes smoothly each time. This level of control is possible only with specialized equipment, which takes a longer time to develop.

HDI Structures:

Multiple layout variations are offered in the realm of HDI PCBs, amongst which the 1-n-1 and 2-n-2 structures are most common. The 1-n-1 PCB depicts the most elemental structure of an HDI printed circuit board composed of a singular layer of high-density interconnected layers, each side of the core demanding one sequential laminate. The more sophisticated 2-n-2 PCB includes dual HDI layers that permit microvias to be arranged in a stacked or staggered formation across layers. The application of copper-filled stacks of microvia structures is predominant in complex designs. While intricate X-n-X level structures can be achieved at a minimal expense, they may not always be constructible. A notable variant is the any-layer HDI, characterized by its dense HDI layout enabling conductors on any layer of the PCB to freely interconnect with laser microvia structures. Such designs are prevalently observed in CPU chips and GPUs in smartphones and several other handheld devices.

Laser Drill Technology:

In any-layer HDI designs, laser microvias are often created using laser drills. These drills can produce a laser of up to 20 microns in diameter that can easily cut through metal and glass. This creates tiny but clean holes. It is possible to create even smaller holes by using materials like uniform glass that have a low dielectric constant.

Contact Imagery and LDI:

Being a top supplier of HDI printed circuit boards means pushing the boundaries. JarnisTech has the ability to deliver finer lines using cutting-edge technology in clean, safe rooms. When it comes to these delicate details, repairs aren’t possible, so they must be done right and with extreme precision the first time. Based on the equipment being checked, we alternate between contact imaging or LDI imagery. LDI is the best option for precise lines and spacing. Despite its limitations, it is able to validate even the most demanding processes and allows for smaller form factors.

HDI Circuit Board

What Factors will Affect HDI PCB Fee?

Type, Amount, Vias, or Microvias: Both the via, microvia, and through-holes that you select for your HDI PCB will have an impact on its cost. This will also affect how many of these features you require. Because they require greater precision, smaller vias are more expensive than larger ones. Adding more vias can increase the cost.

Stackup Height & Number of Layers: Your chosen stack-up configuration greatly influences the costing. Opting for a 2-n-2 high-density PCB layout will invariably increase expenditure. The addition of layers also escalates the cost. The number of layers should be chosen according to the cost-effectiveness and efficiency of the project.

Materials Used: You may have many options for the materials. Core materials can be made from FR4, metal or fiberglass, depending on their application. In addition to ENIG, HASL, immersion tin, immersion silver, immersion gold, you can also choose from a variety of other results. ENIG is the most popular HDI because of its flatness and easy solderability.

The Number of Sequential Laminates: The number of layers and types of via structures determine the number of sequential laminations needed. Even though an increase in laminations may extend processing times and inflate costs, it could also boost product performance and cost-efficiency.

Staggered vs Stack: There may be cost differences between staggered and stacked setups. Stacked vias may be filled with copper while staggered microvias cannot. The project will take longer and require more material to fill the vias.

Pad Size: For cost containment, early determination of your pad size is advisable. Appropriate pad size selection enables you to strategize your design in a more cost-effective and efficient manner.

Turnaround Time: If your request is for a rush, there may be higher costs because of the additional resources needed to complete a rush order. Last-minute circumstances can sometimes occur that are out of your control. However, planning ahead can increase efficiency and reduce costs. JarnisTech provides quick turnaround and fast customer service.

Supplier of PCBs: Your HDI board’s pricing is significantly influenced by your choice of partners. For maximizing cost-effectiveness, it’s prudent to partner with a provider that ensures competitive pricing while efficiently delivering high-caliber products. The preference should always be towards procuring superior quality items once, thereby eliminating the need for any future replacements or repairs.

The Different Types of HDI PCB Stack-ups

1+N+1 – Printed circuit boards contain 1 build-up of high-density interconnect layers.

HDI PCB Stack Up

HDI PCB (1+N+1)


● Copper-filled via.
● This is suitable for BGAs with lower I/O counts.
● Outstanding mounting stability and reliability.
● Surface treatment and material that is qualified for Lead-free processes.
● Microvia, fine line and registration technologies capable of 0.4 mm ball pitch.
● Application: Mobile phone, UMPC. MP3 Player. PMP. GPS. Memory Card.

1+N+1 HDI PCB Structure

HDI PCB Structure

I+N+I (I≥2)–There are two or more layers of high-density interconnections on a printed circuit board. Different layers of microvias can be staggered or stacked.

HDI PCB Stack Up 2 N 2

HDI PCB (2+N+2)


● Copper-filled via.
● Capabilities for thin boards.
● Complex design increase more routing density.
● It is suitable for BGAs with a smaller ball pitch and higher I/O count.
● Signal transmission performance is improved by using lower Dk/Df materials.
● Application: Mobile phones, PDAs, UMPCs, Portable game consoles, DSCs, Camcorders.

I+BN+i (I≥2)-Includes Buried Vias

HDI PCB Stack Up 1 BN 1

Any layer HDI – The layers of a PCB all feature high-density interconnections, which allow conductors on any layer to be freely interconnected using copper-filled stacks of microvias.

ELIC (Every Layer Interconnection)


● Excellent electrical characteristics.
● Copper-filled vias provide greater reliability.
● Every layer via structure maximizes design freedom.
● Cu bump and metal paste technologies are available for extremely thin boards.
● Application: Mobile phone, UMPC and MP3, PMP. GPS, Memory card.

HDI PCB Prototype Delivery Time and Prices


The costing for HDI PCB is influenced by numerous elements wherein the size, thickness, color, and surface finish play vital roles.

Sometimes, the quantity of the HDI PCB may determine its price. In these cases, manufacturers and suppliers may offer discounts to bulk buyers from China.

For a quote, the customer can send a Gerber file to us.

Delivery Time:

In a general, A simple FR4 PCB and Aluminum PCB board can take between 5-7 days to finish. The HDI PCB manufacturing process is complex and takes a long time. HDI PCB delivery takes between 8-12 working days. JarnisTech can accept expedited orders to meet customer requirements. These orders can be processed in as little as one week.

JarnisTech’ HDI PCB Capabilities

PCB SpecificationsHDI PCB Capabilities
PCB Layers4 to 60 layers
High-Density LayersUp to 32 layers
Delivery Time1 day to 4 weeks
Stackup1+N+1, 2+N+2, 3+N+3, 4+N+4
HDI ViaBlind via, Buried via, Staggered via, Stacked via, Skip via
Minimum Laser Drill Diameter0.075mm
Final PCB Thickness0.15mm
Minimum Trace Width/SpaceFlex/rigid-flex PCBs: 1.6mil/1.6mil
Rigid PCBs: 2.5mil/2.5mil
Minimum Mechanical Drill Diameter1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N5, 6+N+6, 7+N+N(with copper filling)
HDI PCB Production Capability5000m² per day
Copper Thickness100μm to 125μm
Solderability>95% (IPC-TM-650 2.4.14)
Surface finishSelective surface finish
HASL: SMD 40µ to 2000µ”, GND 30µ to 800µ”
ENIG: Au 1µ to 5µ”, Ni 80µ to 200µ”
Immersion tin: 0.8µm to 1.2µm
Immersion silver: 0.15µm to 0.45µm
Hard gold plating: Au 1µ to 50µ”, Ni 80µ to 200µ”
Peelable mask: 5mil
Carbon ink: 0.3mil

One-Stop HDI PCB Manufacturing In Stackups Starting At 1+N+1 up to 4+N+4

JarnisTech can manufacture 5000m2 HDI PCBs per day. We provide end-to-end HDI PCB solutions from the initial idea through high-volume production.

HDI PCB manufacturing requires advanced technical knowledge and the most up-to-date equipment to ensure exacting precision.

JarnisTech has multiple facilities in China that offer low-volume/high mix PCB manufacturing. At the same time, we also have high-tech capabilities and advanced equipment. Therefore, we can with demanding requirements for medical, defense, aerospace and commercial applications.

Disadvantage of HDI PCB

Considering the lens of a PCB manufacturer, specific hurdles and limitations are intrinsically attached to the application of High-Density Interconnector (HDI) PCB technology. Acknowledging these possible difficulties and restrictions connected to the exploitation of HDI PCBs is of utmost importance:

●  Technologies are still in development.

●  There are many ways to achieve the same technology (copper filling, drilling).

●  Lower yield.

●  Requires expensive equipment.

●  The reliability of the plated holes is a key factor in limiting HDI PCB. Blind via is limited by its aspect ratio. Aspect ratio is calculated by dividing material thickness by hole PTH diameter.

●  Plating is the main problem. The aspect ratio of blind vias is 1:8 to ensure good hole plating integrity. Advanced values are 1:12. Because of this limitation in aspect ratio, PCB manufacturers use special pre-pregs. Very thin and with the right reaction to laser drilling.

●  HDI multilayers should be constructed with the right materials.

● Standard pre-pregs are made of fiberglass, which is too large challenges for laser drilling. As a result, the glass in pre-pregs alters the laser direction, causing laser via holes to be of mediocre or incorrect shape.

● For via holes it is sensitives. The role of vias during assembly is similar to that of rivets. ROHS places high thermal stress on vias. The vias are stressed by the expansion of material along the z-axis. Reducing via diameter and improving reliability is becoming more common.

2 N 2 Interconnect HDI PCB

What are HDI PCB’s Advantages?

These are the main advantages of HDI circuit boards:

Lower the Cost of PCBs:

If the density of the PCB is greater than eight layers, it will be manufactured by HDI. In addition, the process will be cheaper than traditional complicated lamination.

Increase the Circuit Density:

Traditional circuit boards and parts need to be interconnected through lines and via-hole conductors drawn around the QFP. These circuits must occupy space. Microvia technology hides the wiring needed for interconnection to the next level. Blind holes in the pads connect the pads to the leads at different levels. No fan-in or fan-out wiring is required. To accept additional parts, you can place some pads, such as mini-BGA and CSP small ball bonding, on the outer layer boards. This can increase the circuit board’s density. This new wiring and stacking method is used by many small, high-function wireless handset boards.

Good for the Use of Advanced Assembly Technology:

Because of the size of the through hole and mechanical drilling, traditional drilling technology can’t meet the demands of small parts in thin circuits.

Array packages, CSP (Compound Chip Package) and DCA (Direct Chip Attach) are all examples of the latest high-density IC packaging technologies that designers can incorporate into microvia systems as microvia technology advances.

Higher Electrical Performance and Signal Accuracy:

Micro-hole interconnects able to reduce signal reflection and crosstalk interference between circuits and provide more space for circuit board design. Because of their physical structure, micro-holes can reduce capacitance and inductance, as well as the switching noise during signal transmission.

Higher Reliability:

As the micro-holes are thinner and have a 1:1 aspect ratio, the signal transmission reliability is higher than with ordinary through-holes.

Better Thermal Properties:

The insulating dielectric material in HDI boards has an increased glass transition temperature (Tg), which means it has better thermal characteristics.

Radio frequency interference (RFI), electromagnetic wave interference (EMI), and electrostatic discharge (ESD) can be improved by Circuit board designers can shorten the distance between ground layer and signal layers using microvia technology, thereby reducing radio frequency and electromagnetic wave interference; Additionally, augmenting the volume of ground wires within the circuit will provide a preventive measure against instantaneous discharges arising from static electricity accumulation, hence protecting the integral circuit parts.

Improve Design Efficiency:

With the microvia technology, the circuit can be placed on the inner layer. This allows for more design space and increases efficiency.

If you want to know more information about HDI PCB or HDI capabilities, please visit or directly contact us by email.


HDI PCB comes in different types.

They may differ in design, but they all serve the same purpose. The application you use will determine which type to choose. Let’s see the following types.

Flex HDI

Flexible plastic is the main component of Flex HDI PCB. Flexible plastic allows the board to take on different shapes. This material offers many advantages over rigid boards.

You can bend and move the board easily without damaging the circuits. This board type has one drawback: design and manufacturing are expensive. They have many benefits.

These PCBs can replace the heavy wiring in advanced equipment such as satellites. These PCBs are lightweight and require very little space. They are great for this type of use. It also features multiple designs, such as multilayer or single-sided.


Asides from the number of layers and sides that this HDI PCB has, it also comes in different rigidities. These boards are made of a rigid and solid substrate material like fiberglass. This material prevents HDI boards from being bent. This HDI PCB is found on most desktop towers.

Rigid-flex HDI PCB

It consists of a rigid circuit board attached to a flexible one. Depending on the application, the complexity of the design will vary.

Multilayer HDI PCB

These boards are made up of multiple layers of substrate boards separated by an insulating material. Similar to HDI PCBs that have double sides, vias and through holes can also be used for connecting the board’s electrical circuits. Because they take up less space, multilayer HDI PCBs can be very beneficia. This HDI board type is used in a variety of applications, including medical machinery, computers, handheld devices, and servers.

HDI Board

Q&A From HDI Manufacturing

Q: Can JarnisTech make a PCB with blind and buried vias?
A: Yes. We can make any layer blind with or without cross-buried hole connector PCB. Send your PCB design to and get a quote!
Q: When will I receive a quote?
A: You can get a quote within 24 hours, If  Blind cross buried hole will take 48 hours to quote.
Q: How can you guarantee the quality?
A: JarnisTech has more than 20 years of HDI manufacturing experience. All boards will be tested 100% including flying proble, and Aoi.

Applications of HDI PCBs


The medical industry is seeing a significant impact from the HDI PCB. Because they fit into small devices such as implants, lab and imaging equipment, medical devices are often HDI. Medical equipment is essential in diagnosing and providing life support. Ex: Diagnostic, monitoring equipment and Pacemaker.

The miniaturized camera sizes allow for the observation of the inside of patients and can help to diagnose the problem. Despite the reduction in camera size, the quality of images is not diminished.. These advancements were possible thanks to HDI PCB technology.

Some men find it demoralizing to insert cameras from open ends, but they have been reduced in size with a clearer picture.


Because they are smaller, car manufacturers are attracted to smaller-sized PCBs. The integration of electronic devices into cars has been a major focus for carmakers, especially with the release of futuristic models from companies like Tesla.

Tablets and Smartphones:

All smartphones are HDI PCBs equipped with ELIC (Every Layer Interconnection). HDI PCBs allow for smaller, lighter electronic devices.

Wearable Technology:

HDI has become a major player in the consumer market with the Apple Watch’s launch and other wearable devices such as VR headsets. As its outstanding functionality, wearable technology is rapidly gaining attention from more and more engineers and designers

Gaming Consoles:

As we know, the motherboard of Gaming Consoles is also adapted to HDI PCB boards. There are many gaming consoles, including the Xbox, PlayStation, Nintendo and Wii. Each console has complex functions that allow you to play the games smoothly. HDI ensures that all functionalities are flawless and games run smoothly.

Laptops and PC:

These devices, including laptops and PCs, cannot function without an HDI PCB. These devices can perform many tasks. We can use them to surf watch videos, play game and the internet ,do any digital work and much more. The HDI PCBs connect with the display and mouse. They are also responsible for recognizing keystrokes.

Digital Cameras:

Digital cameras are capable of many important functions, and when they capture pictures, their functions increase further. Without a PCB, how can the process of taking a picture and changing the settings take place? An HDI circuit board is the solution to all problems with digital cameras’ functions.

Military and Aerospace:

HDI can be found in military communications devices as well as other strategic equipment such as missile and defense system systems. Due to HDI boards can withstand extreme conditions and adapt to harsh environmental characteristics, they are ideal for military and aerospace applications.

HDI PCB Market Supply and Demand Analysis

Since the growth of mobile phone manufacturing is causing the demand for HDI PCB boards to increase. China, being a technology-centric nation, stands significant in the global mobile phone manufacturing landscape. With Motorola setting the trend in 2002 by adopting HDI boards for mobile phones, now more than 90% of mobile phone motherboards utilize HDI PCBs.

The growing demand for HDI PCBs cannot be met by China’s HDI PCB manufacturing capacity. The global HDI mobile board production landscape has seen major changes in recent years. Major PCB manufacturers from America and Europe, as well as the well-known AT&S and ASPOCOM mobile phone board manufacturers, continue to supply second-order HDI to Nokia. Most of the HDI production capability has been moved from Europe to Asia, including mobile phone boards. Particularly China, is now the main supplier of HDI boards.


HDI, known as high density interconnect represents a PCB type that is known for its reliability and efficiency. The compact size of HDI enables heat dissipation and enhances signal integrity. This design was created with the aim of meeting consumer demands when it comes to using HDI PCBs. These types of PCBs are commonly utilized in devices like smartphones, computers, laptops and gaming consoles showcasing their extensive use, in todays technology landscape.

JarnisTech is An experienced, professional electronics contract manufacturer. Our core mission is to provide high-quality, high-tech PCB assembly services to our 2000+ clients. This is built on the foundations of high-tech PCB fabrication capabilities such as HDI, RF, hybrid, backplane, rigid-flex, and heavy copper PCB. We will offer the best price and highest quality for your PCB projects.

Call us to get a free quote now