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Via Filled and Via in Pad

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Printed Circuit Board Via In Pad Via Filled

What Is a via in Pad

During PCB design, a via is a pad with a plated hole connecting copper tracks from a single layer to another.

Multi-layer PCBs that are high-density may have blind vias that can only be seen on one surface or buried vias that can not be seen on both, typically referred to as micro vias.

Definication of via Filling

As we know, vias are copper-plated holes which connect two or more layers of a PCB.

Filling via is a unique PCB manufacturing process that is used to close selectively and completely via holes using epoxy.

It is possible for a PCB designer to need a via filled in a variety of circumstances.

Via-in-Pad (VIP) Technology

As the trend continues to increase for the miniaturization of electronic devices and the use of more precise pitched devices, vias are becoming highly sought-after because they are effective solutions for the electrical connection between traces in various layers of printed circuit boards. Vias are classified into three primary kinds through-hole Vias and Blind Buried Vias. Each performs various functions and attributes that contribute to the overall performance of PCBs and even electronic devices.

Via-in-pad (VIP) technology refers to vias placed below a component’s contact pad, specifically the BGA pad, which has higher pitch arrays. In terms of the technology, VIP can lead to vias that are covered in a layer of plating or hiding under a BGA pad and requires PCB makers to connect vias with the resin prior to applying copper plating to the via in order to make it invisible.

JarnisTech manufactures custom Via-in-Pad PCBs that have the lowest Cost.
As per JarnisTech’s electronics PCB fabrication capacities and facilities, below is a form of our requirements for vias on pads.

ParametersStandard SpecialStandard FabSpecial Fab
FillingIPC4761 Type VIIIPC4761 Type VIINone
Min. Diameter0.2MM0.15MM0.1MM
Min. Pad0.4MM0.35MM0.3MM
Max.Drill Diameter0.5MM0.4MM
Max.Pad Diameter0.7MM0.6MM
Min.Feature Pitch(Fp)0.6MM0.55MM0.5MM
Aspect Ratio Of Via1:121:121:10
Aspect Ratio Of Blind Via1:11:11:1

VIP Technology Has the Following Advantages Over Blind Vias and Buried Vias

● Suitable for BGAs with fine pitch.
● Increasing PCB density and saving space;
● Better performance with thermal control, which is beneficial in heat dissipation.
● Resolving the limitations of high-speed designs, such as low inductance.
● Flat surface shared with an attachment for a component;
● Making PCB footprints smaller and routing more efficiently and effectively;

Due to these advantages via in pad, it is frequently used for small-sized PCBs, particularly ones that have limited space for BGAs, and is focused on the transfer of heat and high-speed designs. While through that are blind or buried vias can be advantageous for increasing density and PCB space-saving, when it comes to the management of heat and high-speed design components involved via in pad is the most efficient option. When considering cost, different projects will have different prices. Therefore, if you have vias in your project but you are unable to determine which kind, reach our engineers for a solution that is optimal.

At present, JarnisTech can manufacture vias that have an aspect ratio of 12:1 for vias through-holes and 1:1 for by-pass vias that are buried or blind, and we are constantly making improvements each day. For more information about via/via-in-pad technology, inform us by posting a message on this page. Our engineering team will respond to you as soon as possible.

You have two options when it comes to PCB via fill.. You can choose either a fill that is conductive or a non-conductive fill. Which option has the most advantages and disadvantages? Is there a reason why one is more appealing to you than the other?

Conductive via Fill

If you decide to line your vias in conductive epoxy, the most common choice is between the silver-coated copper epoxy matrices from the Tatsuto AE3030 epoxy as well as CB100 from DuPont CB100. Both provide electrical and thermal conductivity after curing. The DuPont fill has a greater particulate size and higher final coefficient of thermal expansion (CTE) and has a long-standing reputation as a highly efficient conductive epoxy fill.

Via Fill Non-conductive

PCB Non-Conductive Via In Pad(VIP)

If you’re looking for non-conductive epoxy to use to fill your via it is usually one of the Peters PP2795 epoxies. But, an alternative that has been popular in the past few times has been San-Ei-Kagaku PHP-900 epoxy. Both of them should be able to meet the basic requirements for an epoxy that is non-conductive.

Conductive Vs. Non-conductive via Fill

Via fill non-conductive, or via-in-pad it is epoxy filled. While the walls of the via have copper and are fully formed but they need to be filled. Utilizing vacuum suction and squeegee, the liquid is applied to the surface and moved through the via, and the substance is then set within the hole. The process that is used to fill holes with conductive materials. is made the same way, except the epoxy is conducting component, for instance, silver.

When using the via-in-pad method, most often the vias are filled up with a non-conductive epoxy that is then cured down until they are flat enough to be able to touch the surface of the board and then cap-plated. The via is still electrically sound and can be considered to belong in component land. Additionally, there are conductive fillers to choose from in the event that heat dissipation is of concern. These epoxies can be applied similarly to the ones used in the past, but the distinction is that they are made up of silver or other conductive materials.

Conventional Vias vs. Via-in-Pad PCB Design

Solder masks can be used as a plugging material to stop the solder from getting trapped in the via cavity. This is a standard technique. For VIP structures, it is necessary to have a fully filled via cavity to prevent the outgassing and entrapment of air. Additionally, you’ll require a perfectly flat surface to connect BGAs of fine pitch securely.

Manufacturing options that you can choose to use to make VIPs are mechanically drilled, plated, and non-conductive epoxy-filled methods and laser-ablated and fully copper-filled via-in-pad processes.

Selecting Your PCB via Fill

So, how do you pick the right PCB via fill? For the most part, you’ll use a non-conductive epoxy. This is due to the fact that non-conductive epoxies typically offer the best CTE match to the laminate material surrounding it. The structure will expand and contract to the laminate as it gets cooler and warmer, thus reducing the risk of stress fractures and failure.

Can you tell me why you would ever use a conductive via fill? You would choose a Conductive epoxy when conductivity is crucial, such as when you’re filling a thermal via that primary purpose is to dissipate heat. Using conductor epoxy to fill a via transfer thermal energy more efficiently. Therefore, it is a good choice for thermal vias to rapidly and efficiently transfer energy away from the surface.

It is also possible to find conducive epoxy via fills in older PCB designs because that is the fill type that has always been used on those boards–Since before nonconductive epoxies were appreciated for their benefits.

Since of its name, some people might assume that a via filled with non-conductive epoxy cannot transmit electrical signals to the other side of the board. If were true, this would defeat the purpose of a plated via.Non-conductive epoxy fills copper plated vias, in fact, the electrical signals is always transmitted through the copper. It doesn’t transmit through the epoxy, but it does not hinder transmission.

Looking for the Right PCB Design for Your Applications

There is no need to fret about finding the correct kind of circuit or the perfect layout when you buy PCB from JarnisTech Company. We’re experts on everything there is that you need to know regarding printed circuit boards, and we’ll be able to help you locate PCBs that are suited to the specific requirements of your industry and your company. For more details, contact JarnisTech today.

When Should We Using via In Pad

With traditional routing methods, sub-0.5mm pitch component packages will cause errors due to trace width, annular rings, and size limitations. For components with a small pitch, it is only routing them using capped vias in pads that can allow the routing of the circuit board to be as compact as possible.

It also makes routing simpler for complicated BGA or LGA packages, as well as be capped with in pads. It also allows components like bypass capacitors must be placed as close as they can be while minimizing the surface routing to ensure that parasitic inductance is minimized.

Additionally, the routes to ground and power planes are comparatively short and will work to reduce EMF emissions from high-frequency designs.

Vias in thermal pads have an impact on the way heat is managed. In general, surface-mount components come with thermal pads that attach to an electronic circuit board. Therefore, In order to increase copper surface area for heat release, you should drop vias through the board to the other side

Via in Pad Application for SMD Pad

●  Resin Plugs the Vias and Copper Plating Flattens Them

It is in compliance with the smaller BGA by using a pad.

The initial process involves filling the via with conductive or non-conductive material, then plating the via to the surface, which creates an even, solderable surface;

They are utilized in pad designs , where it is possible to mount the component on the via or connect the solder joint until it reaches the via for the connection.

●  Microvias and Vias in Pad Plated Over

A microvia is an opening that is smaller than 0.15mm in accordance with IPC. It could be a via ( connected to the aspect ratio ). However, typically, the microvia is thought of as blind vias between two layers.

The majority of PCB manufacturers drill microvias with lasers, but some use mechanical drill bits, which are slower. However, the holes are neat and well-cut cut.

Microvia cooper fill is an electrochemical process that is used to create the multilayer PCB manufacturing process. Therefore, it is also referred to as capped vias.

While the procedure isn’t easy but it is possible to make HDI PCBs, and most PCB makers will receive the copper filling for microvias.

Solder Mask Is Used to Plug the Via

It’s free and compliant using large solder pads for SMD;

Standard LPI solder mask processes cannot form fill vias without exposing copper in the barrel. In general, it is possible to place UV or thermally curable epoxy solder masks into the holes in order to plug them following the second screen print.

It is also known by the term via plugging. Via plugging is the process used to fill holes in via using the sclerosis material in order to prevent the air from leakage when testing boards or to protect the components close to the surface of the board from being shorted.

Frequently Asked Questions (FAQs) Regarding Our via Filled and via in Pad Process

Here are some short questions and answers about Via Filled and Via in Pad. Please send us an email at [email protected] if you have any questions.

What Is via Plugging in PCB

PCB Via Plugging

Via plugging refers to a procedure that involves vias being completely filled with resin or sealed by the use of a solder mask.

The vias that are filled with conductive material help to transport a lot in current from one end of the PCB board to the next.

Can You Put a Via on a Pad

A via in pad is a design practice that involves placing a via in a copper landing pad for a component.

As compared to standard PCB routing, the pads allow a design to utilize smaller pitch component sizes, which further reduces the size of the PCB overall.

What Exactly Is Via-in Pad Plated Over(VIPPO)

Via-in-pad-plated over(VIPPO) style is a technique that allows for a solder mask to be soldered and then soldering in-pad vias using a tiny cross-section.

After plating copper and then filling with epoxy the hole that has been filled is then capped by the copper pad.

Electronic components are then attached directly to the VIPPO pad.

What Is a Thermal Via

Thermal vias are holes in a surface-mounted heating source on the circuit board which allows heat transfer.

Simple vias and via-in-pads can result in a significant reduction in resistance to heat.

The size and location of thermal vias have an impact directly on thermal resistance.

Should Vias Be Tented

Vias that are located near SMT pads must also be secured.

This prevents this solder paste from getting absorbed into the via and causing an unsound solder joint.

Vias are secured to stop solder paste from leaking into the via.


The benetifs of the via-in-pad were tremendous. Circuit boards created using this technique had fewer layers, more land for routing, reduced heat of components and greater surface to bond. This process has improved with the advancement of technology employed. So, more compact spaced surface mount devices (SMDs), smaller ball grid arrays (BGAs), and reduced density without losing functionality are just a few reasons we like this technology.

We hope that this paper can help you with selecting the right designs. Please email us with any additional concerns.

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