As electronic devices become more advanced and power-dense, the need for efficient thermal management and high-performance electronics has become increasingly critical. One solution to these challenges is the use of Aluminum Nitride Ceramic PCBs.
Unlike traditional PCB substrates, Aluminum Nitride Ceramic PCBs offer exceptional thermal conductivity, dielectric properties, and mechanical strength. These unique properties make them well-suited for high-power, high-frequency electronic applications and have led to their adoption in the aerospace, defense, and telecommunications industries.
In this article, we will delve deeper into the properties and advantages of Aluminum Nitride Ceramic PCBs. We will also discuss their limitations and challenges and explore future developments in this exciting field. Understanding the potential of Aluminum Nitride Ceramic PCBs can pave the way for their widespread use in many high-performance electronic applications to come.
Definition of AlN Ceramic PCB
Aluminium Nitride Ceramic, also known as AlN, is a type of ceramic in which AlN is the primary crystallization phase. The ALN crystal compound is covalently bonded with ALN4 as a uni-structure and belongs to the hexagonal crystal structure. It has a chemical composition of AL 65.81%, N34.19%, a density of 3.261g/cm³, and appears white or grey-white in color. The crystal unit is a single, clear entity, and its sublimation temperature at normal tension is about 2450℃.
AlN ceramic is a high-temperature resistant material with an expansion rate of (4.0-6.0) X 10(-6)/℃. The thermal conductivity of AlN can reach 180 W/mK, which is 5-8 times greater than that of AL2O3. This makes it capable of withstanding temperatures as high as 2200℃.
Additionally, AlN ceramic possesses superior anti-corrosion properties, making it a highly desirable material in the field of ceramics.
Aluminum Nitride (AlN) is the leading ceramic substrate currently available in the market, thanks to its excellent thermal conductivity (180 W/mK) and its properties as a robust dielectric material with very low expansion (CTE). Due to these properties, AlN is the preferred material for packaging or substrate for housing high-power LEDs, ICs, sensors, circuits, and other components.
Manufacturing Processes of Aluminum Nitride Ceramic PCBs
The fabrication processes of aluminum nitride ceramic PCBs may involve the following steps:
● Designing the PCB layout: The first step involves designing the layout of the PCB using computer-aided design (CAD) software.
● Substrate preparation: The aluminum nitride ceramic substrate is prepared by cutting or shaping it to the desired size, using diamond cutting tools.
● Surface preparation: The substrate surface is cleaned and polished to remove any impurities and to improve the adhesion of the metal layers.
● Deposition of metal layers: Thin layers of metal, such as copper, are deposited onto the surface of the ceramic substrate using techniques such as sputtering, physical vapor deposition (PVD), or electroless plating.
● Photolithography: A layer of photoresist is applied to the metal layer to create a pattern, which is then exposed to ultraviolet light through a photomask. The unexposed areas of the photoresist are then removed using a chemical etchant, leaving the desired pattern on the metal layer.
● Etching: The exposed metal layer is then etched away using a chemical solution, leaving only the desired copper traces and pads.
● Drilling: Holes are drilled in the substrate using laser drilling or mechanical drilling techniques to create vias.
● Plating: A thin layer of metal is deposited onto the walls of the vias using electroplating, forming a conductive path between the two sides of the substrate.
● Solder mask and silkscreen: A layer of solder mask and a silkscreen layer are applied to protect the copper traces and to label the components.
● Assembly: The components are then mounted onto the PCB, and the board is tested for functionality.
● Final inspection and packaging: The finished PCB is inspected for defects and packaged for shipment.
Aluminum Nitride ( AlN ) PCB Ceramic Properties
Aluminum nitride is a type of ceramic material that primarily consists of AlN (Aluminum Nitride) as its crystalline phase. This ceramic material exhibits exceptional mechanical properties, with its flexural strength surpassing that of ceramics like Al2O3 and BeO. Additionally, it can be sintered with normal pressure. Ceramics made of aluminum nitride offer superior physical properties such as bulk resistivity, dielectric constant, dielectric strength, and dielectric loss. These ceramics also possess remarkable characteristics in light transmission.
● Aluminum nitride (AlN) powder is a material of great purity characterized by small particle size and high activity. This material is widely used in the production of aluminum nitride ceramics which possess superior thermal conductivity. AlN ceramics substrates have high thermal conductivity, relatively low expansion coefficient, and excellent resistance to high temperature, chemicals, and dielectric loss. These substrates are ideal for large-scale heat sinks in integrated circuits as well as packaging material.
● AlN ceramics are novel materials with exceptional hardness superior to traditional alumina. They are highly wear-resistant and can only be utilized in applications that require extreme wear due to their high price.
● The resistance of AlN ceramics to heat, melting erosion, and thermal shock makes them a suitable option for the production of Al vaporizers, GaAs crystal crucibles, magnets for power-generation devices, and high-temperature turbine corrosion-resistant parts. Additionally, the optical properties of AlN ceramics make them good candidates for infrared windows. The films of aluminum nitride are also used to produce high-frequency piezoelectric components, ultra-large-scale integrated circuit substrates, and many other applications.
● From a chemical perspective, AlN ceramics are highly resistant to acids but are prone to erosion when subjected to alkaline solutions. When exposed to moist air, a thin oxide film is formed on the surface of AlN ceramics. This makes them ideal materials for crucibles or firing molds when melting metallic substances like aluminum, silver, copper, or lead. AlN ceramics possess better characteristics for metallization and can replace toxic beryllium oxide in the electronics industry.
Aluminum oxide (Al2O3) and beryllium oxide (BeO) have been the primary substrate materials used for high-power packaging for many years. However, both materials come with certain disadvantages. Al2O3 has low thermal conductivity and its thermal expansion coefficient does not align with the materials used for the chip. On the other hand, the production of BeO is expensive and the material itself is highly toxic.
Therefore, in terms of cost, performance, and environmental protection, different substrate materials need to be explored to develop powerful LED technology in the future. Aluminum nitride (AlN) is a material that possesses exceptional properties like excellent energy density, outstanding thermal conductivity, low density, and dielectric constant, and no toxicity. Additionally, its expansion coefficient is compatible with Si. This makes it an ideal candidate to replace traditional high-power LED substrate materials and emerge as one of the most promising ceramic substrates in the future.
Advantages of Aluminum Nitride Ceramic PCB
Aluminum Nitride Ceramic PCBs offer several advantages over traditional PCBs. Some of the key benefits include:
● Excellent thermal conductivity – Aluminum nitride ceramics possess exceptional thermal conductivity, which helps dissipate heat efficiently. This property is essential for high-power electronic devices, as it prevents overheating and improves the reliability and longevity of the device.
● Low dielectric constant and loss – Aluminum nitride ceramics have a low dielectric constant and loss, making them ideal for use in high-frequency applications.
● High mechanical strength – The material’s superior mechanical strength and resistance to chemical corrosion makes it highly durable, even in harsh environments.
● Resistance to plasma erosion – Aluminum nitride ceramics have exceptional resistance to plasma erosion, making them useful in aerospace and defense industries.
● Customizable – Aluminum nitride ceramic PCBs can be tailored to meet a wide range of design requirements, resulting in a highly precise and reliable product.
Comparison of Aluminum Nitride Ceramic PCBs with other types of PCBs
● Thermal conductivity: Aluminum nitride ceramic is an excellent thermal conductor, making it ideal for high-power applications. Compared to FR-4 PCBs, which have a thermal conductivity of about 0.3 W/mK, aluminum nitride ceramic PCBs have a thermal conductivity of about 170-200 W/mK.
● Dielectric properties: Aluminum nitride ceramic has a high dielectric constant, which allows for a thinner insulating layer and better signal integrity. It also has a low dielectric loss, which reduces signal attenuation.
● Mechanical strength: Aluminum nitride ceramic has high mechanical strength and stiffness, making it resistant to warping and cracking.
● Chemical resistance: Aluminum nitride ceramic is resistant to most chemicals, including acids and bases, which can corrode other types of PCBs.
● Cost: Although aluminum nitride ceramic PCBs are more expensive than FR-4 PCBs, they are cheaper than other high-performance PCB materials such as PTFE-based materials.
● Limitations: Aluminum nitride ceramic PCBs have certain limitations, including a relatively low electrical conductivity and difficulty in processing due to their hardness. They also require specialized equipment and fabrication techniques, which can limit their availability and increase costs.
Aluminum Nitride Ceramic PCB Raw Materials Specifications
Product Parameters
| (Item) | (Unit) | NC-170 | NC-200 |
| (Color) | – | Gray/Beige | Gray/Beige |
| (Thermal Conductivity) | [@20℃] W/m·k | ≥170 | ≥195 |
| (Bending Strength) | MPa | ＞450 | ＞350 |
| (Surface Roughness) | μm | ＜0.8 | ＜0.8 |
| (Warpage) | ‰ | ＜2.5 | ＜2.5 |
| (Volume Density) | g/cm3 | ≥3.24 | ≥3.24 |
| (Coefficient of Linear Expansion) | [RT-300℃]10-6mm/℃ | 4.6 | 4.6 |
| (Volume Resistance) | 20℃ Ω·cm | ＞10¹³ | ＞10¹³ |
| (Dielectric Constant) | [@1MHz] | 10.6 | 10.6 |
| (Dielectric Loss) | [@1MHz] | 4.6×10-4 | 4.6×10-4 |
| (Dielectric Strength) | （KV/mm) | ≥20 | ≥20 |
Product Size Specification
| Thickness (mm) | Size(inch) | |||||
| 50.8×50.8 | 114.3×114.3 | 120×120 | 140×190 | 254×254 | 300×300 | |
| 0.25 | √ | √ | √ | – | – | – |
| 0.381 | √ | √ | √ | – | – | – |
| 0.5 | √ | √ | √ | √ | – | – |
| 0.635 | √ | √ | √ | √ | √ | √ |
| 1 | √ | √ | √ | √ | √ | √ |
| 1.5 | √ | √ | √ | √ | √ | √ |
| 2 | √ | √ | √ | √ | √ | √ |
JarnisTech is a highly reputable producer of aluminum nitride ceramic PCBs. We have the expertise and resources to fabricate aluminum nitride PCBs tailored to your specific needs. We take pride in our team of experienced and knowledgeable personnel, who are dedicated to delivering the highest quality PCBs for our clients.
We understand that each customer has unique requirements for their aluminum nitride PCBs. Thus, we offer customized solutions to meet your specific needs. With our commitment to quality and excellence, you can rely on us for the best aluminum nitride PCB products in the market.
The Raw Material Properties of the Aluminum Nitride PCB
| Property | Items | Unit | AlN |
| Physical | Color | – | Grey |
| Water absorption | % | 0 | |
| Reflectivity | % | 30* | |
| Electrical | Dielectric Constant (1MHz) | – | 9.0 |
| Dielectric Loss | *10^-3 | 3 | |
| Dielectric strength | MV/m or KV/mm | >19 | |
| Insulation/Volume resistance | Ω·cm | >10^14 | |
| Mechanical | Density after sintering (Bulk density) | g/cm3 | 3.30 |
| Flexural Strength (3 point) | Mpa | 300 | |
| Surface Roughness | μm | 0.3～0.6 | |
| Warpage | % | ≦0.3 | |
| Thermal | Coefficient of Thermal Expansion (CTE) | ppm/°C | 3.16 |
| Coefficient of Thermal Expansion (CTE) RT~500 °C | ppm/°C | 4.02 | |
| Thermal Conductivity (25°C) | W/m‧K | 170 |
NOTE: The information presented in this document is a representation of the commercially available material and is provided solely for comparison purposes. It should not be regarded as an absolute statement of the material’s properties or as a representation of an assertion or warranty for which we take legal responsibility.
It is the user’s responsibility to assess the suitability of the information for its intended purpose and to assume all risks and obligations related to the material’s use. Additionally, users should conduct their own testing to ensure that the material is suitable for its application.
At JarnisTech, we are committed to providing accurate and reliable information about our products to assist our clients in making informed decisions. Please contact us if you have any questions about the properties or characteristics of our materials.
Why Aluminum Nitride Ceramics PCBs Are Widely Used
Aluminum nitride ceramics are widely used in various fields due to their exceptional properties, which include high thermal conductivity, low dielectric constant, low dielectric loss, excellent abrasion resistance, and remarkable resistance to plasma erosion. This material has diverse applications, some of which are:
● Electronics industry – Aluminum nitride ceramics are used in the electronics industry to develop high-performance electronic components such as power modules, IC packages, and high-frequency circuits.
● Aerospace and defense – The material’s exceptional thermal conductivity allows it to be utilized in heat sinks and radar components that need to endure extreme environments.
● Automotive industry – Aluminum nitride ceramics are used for developing components that require high thermal conductivity, such as engine control units, intelligent sensors, and LED lighting devices.
● Medical and healthcare – The material is used in the development of X-ray equipment and other medical devices that require exceptional thermal conductivity, mechanical strength, and electrical insulation.
Experimental Results and Analysis of Aluminum Nitride Ceramic PCBs
Experimental results and analysis of aluminum nitride ceramic PCBs can involve several aspects, including:
● Thermal performance: The high thermal conductivity of aluminum nitride ceramic PCBs can be characterized experimentally by measuring the temperature rise or temperature distribution under various power densities and cooling conditions.
● Electrical performance: The electrical performance of aluminum nitride ceramic PCBs can be evaluated through various measurements, including impedance, insertion loss, and signal delay.
● Mechanical strength: The mechanical properties of aluminum nitride ceramic PCBs, such as hardness, modulus of elasticity, and fracture toughness, can be determined experimentally using methods such as indentation and bending tests.
● Reliability and durability: Several experimental tests, such as thermal cycling, vibration, and mechanical shock tests, can be conducted to evaluate the reliability and durability of aluminum nitride ceramic PCBs.
● Failure analysis: In case of failures, analytical and experimental methods such as SEM, XRD, and EDX can be used to identify the failure mechanisms and to determine the causes of the failure.
The results of these experiments and analyses can provide valuable information for optimizing the design, fabrication, and reliability of aluminum nitride ceramic PCBs, and for exploring their use in new applications.
Aluminum Nitride Ceramic PCB Prototyping Delivery Time and Cost
Cost: The cost of aluminum nitride PCBs is determined by various factors such as dimensions, thickness, color surface finish, layer count (single, double, or multi-layer PCB), and several others. In certain cases, the order quantity can also play a role in determining the final cost. As a leading manufacturer and supplier of aluminum nitride PCBs in China, we offer discounts on bulk orders and OEM services to our clients.
We welcome our customers to email us a Gerber document for an estimate that includes all of the necessary details regarding their specific requirements. Our team at Jarnistech.com is dedicated to providing accurate cost estimates based on our clients’ custom specifications. Please feel free to contact us at your convenience.
Time of Delivery: Typically, a basic FR4 PCB with aluminum can be manufactured and delivered within 5-7 working days. However, the manufacturing process for Nitride Ceramic PCBs involves several intricate steps, which require a longer production period. As a result, the lead time for Ceramic PCBs is between 13 and 15 working days.
At JarnisTech, we understand that some projects require urgent attention, and we offer expedited orders that can be fulfilled within a week to meet our customers’ demands. While we ensure rapid production times, we do not compromise on our quality standards. Our team is committed to providing high-quality PCBs with fast delivery times. If you have any concerns or queries about our lead times, please do not hesitate to get in touch with us. We’re here to assist you.
Why You Should Select Us ?
Our company provides a range of options for aluminum nitride ceramic PCBs, including standard thermal conductivity of equal to or greater than 170W/m·K, as well as ultra-high thermal conductivity exceeding 200W/m·K. We offer a variety of substrate types, such as grinder type and as-fired types, high bending types, high thermal conductivity types, polishing types, laser scribing types, and many more.
In addition to diverse substrate options, we also offer different types of metallization to meet your specific requirements. Our selection includes DPC, DBC, TPC, AMB, thick film, and thin film.
We also pride ourselves on providing ultra-slim options, with a thickness of just 0.10mm. Our commitment to offering a broad range of high-quality products ensures that we can meet the needs of our customers across various industries.
Whether you require aluminum nitride ceramic PCBs with superior thermal conductivity or specific metallization, we are confident that we can provide the solution tailored to your requirements.
Future Developments and Challenges in Aluminum Nitride Ceramic PCBs
Some of the future developments and challenges in Aluminum Nitride Ceramic PCBs are:
● Increasing electrical conductivity: The relatively low electrical conductivity of aluminum nitride ceramic is a limitation for some applications. Researchers are exploring various methods to improve its electrical conductivity, including doping with other materials and incorporating conductive fillers.
● Reducing costs: While the cost of aluminum nitride ceramic PCBs has reduced over the years, it is still higher than some other materials. There is a need to develop more cost-effective manufacturing techniques, while maintaining the material’s desirable properties.
● Improved fabrication techniques: Fabrication of aluminum nitride ceramic PCBs can be challenging due to the material’s hardness and sensitivity to thermal shock. Researchers are working on developing more efficient and reliable fabrication techniques, such as laser machining and hot pressing.
● Better bonding between ceramic and metal layers: Aluminum nitride ceramic and metal layers can delaminate due to the differences in their thermal expansion coefficients. New bonding materials and techniques are being explored to produce stronger and more durable ceramic-metal bonds.
● Expanding applications: Although Aluminum nitride ceramic PCBs have shown significant potential in high-power, high-frequency applications, researchers are exploring its use in other fields. For example, the material’s excellent chemical resistance and biocompatibility make it suitable for use in medical and environmental sensors.
As research continues in this field, the limitations of aluminum nitride ceramic PCBs may be overcome, leading to wider applications and improved performance.
Conclusion
Aluminum Nitride Ceramic PCBs offer several advantages over traditional PCB materials such as high thermal conductivity, excellent dielectric properties, and improved mechanical strength. They are ideal for high-power, high-frequency applications in the military, aerospace, and telecommunications industries. However, the material’s hardness and unique properties also pose some challenges in the manufacturing process, which require specialized equipment and techniques.
Continued research in this field is expected to improve the electrical conductivity, reduce costs, and enhance the mechanical bonding between ceramic and metal layers, leading to further expansion of applications. The experimental results and analysis of aluminum nitride ceramic PCBs provide valuable information for optimizing the design, fabrication, and reliability of these components, making them a promising technology for the future.
As a reputable PCB manufacturer, we are committed to providing the highest quality Aluminum Nitride Ceramic PCBs to our valued customers. We invite you to send your quotation request to [email protected], and we will promptly respond to your inquiry. Thank you for reading our article, and we hope it has helped you gain a better understanding of the benefits of aluminum nitride-based ceramics.
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