With the progress of electronic devices and their increasing power density the demand for effective thermal management and high performance electronics has become more crucial. As a result one practical approach to tackle these issues is, through the utilization of aluminum nitride (AlN) Ceramic PCBs.
Compared to traditional PCB substrates aluminum nitride ceramic PCBs offer outstanding thermal conductivity, dielectric properties and strong mechanical durability. These distinct qualities make AlN ceramic PCBs well suited for demanding power high frequency electronic uses and they are extensively used in the aerospace, defense and telecommunications sectors.
This article will explore the features and benefits of aluminum ceramic PCB. We will also discuss their limitations and challenges well as look into upcoming advancements in this dynamic area. By recognizing the possibilities of AlN PCB we can facilitate their extensive use, in various cutting edge electronics application down the road.
Definition of AlN Ceramics
Aluminum nitride ceramics, known as AlN ceramics consist of AlN as the crystalline phase. The crystal structures of AlN are bonded covalently with ALN4 as an entity and belong to the hexagonal crystal system. In terms of composition they typically contain 65.81% aluminum and 34.19% nitrogen with a density measuring 3.261 g/cm³. These ceramic generally exhibit an off white appearance with individual crystal units appearing as transparent entities. Their sublimation temperature is 2450℃, under standard atmospheric pressure.
AlN ceramics is a kind of high temperature resistant material, the expansion rate is (4.0-6.0) X 10(-6)/℃, the thermal conductivity of AlN can reach 180W/mK, which is 5-8 times that of AL2O3, and can withstand 2200℃ high temperature.
Additionally, AlN ceramics provide excellent resistance corrosion, make it widely favored in the ceramics industry.
Aluminum nitride is the top ceramic substrate out there right now, mainly because of its excellent thermal conductivity of 180 W/mK and its strong dielectric properties with a really low expansion rate (CTE). These qualities make AlN the go to material for substrates used to encapsulate or house high power LEDs, ICs, sensors, circuits and other components.
Aluminum Nitride PCB Ceramic Properties
Aluminum nitride is a ceramic material with AlN as the primary crystalline phase, known for its superior mechanical properties. In addtion, its bending strength that far exceeds that of Al2O3, BeO and other ceramics. It can be sintered under normal pressure. Aluminum nitride ceramics possess excellent physical properties such as bulk resistivity, dielectric constant, dielectric strength, and dielectric loss. Additionally, they exhibit outstanding characteristics in light transmission.
● Aluminum nitride powder is characterized by high purity, small particle size and high activity, making it highly suitable for the production of aluminum nitride ceramic with exceptional thermal conductivity. Aluminum nitride ceramic substrate provide excellent thermal conductivity, low thermal expansion coefficient, high temperature resistance, chemical corrosion resistance and dielectric loss resistance. These propertie make them an ideal choice for large heat sink and packaging material in integrated circuit.
● Aluminum nitride ceramics represent a new class of materials with hardness significantly exceeding that of traditional alumina. They provide exceptional wear resistance but are expensive, thus primarily utilized in applications demanding extremely high wear resistance.
● Aluminum nitride ceramics possess heat resistance, corrosion resistance, and thermal shock resistance, making them suitable for applications such as Al evaporators, GaAs crystal crucibles, magnets for power generation equipment and high temperature turbine corrosion resistant part. Additionally, their optical properties make them ideal for infrared windows. Aluminum nitride films can also be used to manufacture high frequency piezoelectric components and large scale integrated circuit board.
● Aluminum nitride ceramics are known for their ability to resist acids effectively. They can be vulnerable to erosion when exposed to alkaline solution. When in contact with moist air a thin oxide layer develops on the surface of AlN ceramic making them suitable for applications like crucibles or molds used in metal melting processes. Such as aluminum, silver, copper or lead. Additionally AlN ceramic offer metallization properties and serve as a safe substitute for beryllium oxide, in electronics sector.
Over the years alumina (Al2O3) and beryllium oxide (BeO) have served as the substrate materials for high power packages. Nevertheless these materials come with their drawbacks. Alumina exhibits thermal conductivity and a thermal expansion coefficient that does not align with chip materials. On the hand beryllium oxide despite providing superior thermal performance poses challenges due, to its costly production process and high toxicity levels.
Considering factors like cost, efficiency and environmental protection, the future development of high power LED technology must explore alternative substrate materials. Aluminum nitride ceramics are a ideal candidate due to its excellent energy density, superior thermal conductivity, low density, low dielectric constant and non toxic propertie. Additionally, its thermal expansion coefficient is compatible with silicon, making it a promising replacement for traditional high power LED substrate material and one of the most promising ceramic substrates for future application.
Advantages of Aluminum Nitride Ceramic PCB
Aluminum Nitride ceramic PCB offer several advantage over traditional PCB. Some of the key benefit include:
● Excellent thermal conductivity
● Low dielectric constant and loss
● High mechanical strength
● Resistance to plasma erosion
● Customizable
Comparison of Aluminum Nitride Ceramic PCB with other types of PCB
●Thermal conductivity: Aluminum nitride ceramic PCB exhibit excellent thermal conductivity, making them ideal for high power application . In contrast to FR4 PCB, which typically have a thermal conductivity of about 0.3 W/mK, aluminum nitride ceramic PCB boast a much higher thermal conductivity ranging from 170 to 200 W/mK.
● Dielectric properties: Aluminum nitride ceramic PCB feature a high dielectric constant, enabling thinner insulation layers that enhance signal integrity and minimize dielectric loss, thereby reducing signal attenuation.
● Mechanical strength: Aluminum nitride ceramic PCB boasts high quality mechanical strength and rigidity, made it withstand warping and cracking effectively.
● Chemical resistance: Aluminum nitride ceramic PCB exhibit resistance to most chemicals, including acids and bases, which can corrode other types of PCBs.
● Cost: Although aluminum nitride ceramic PCB are more expensive than FR4 PCB, when pitted against other high performance PCB base material, such as those based on PTFE. They are more cost effective.
● Limitations: Aluminum nitride ceramic PCB have certain limitation. Including relatively low electrical conductivity, high hardness and challenging processing requirement. These factors necessitate specialized equipment and manufacturing techniques, which can limit their availability and increase costs.
Aluminum Nitride Ceramic PCB Raw Materials Specifications
Product Parameters
| (Item) | (Unit) | NC-170 | NC-200 |
| (Color) | – | Gray/Beige | Gray/Beige |
| (Thermal Conductivity) | [@20℃] W/m·k | ≥170 | ≥195 |
| (Bending Strength) | MPa | ＞450 | ＞350 |
| (Surface Roughness) | μm | ＜0.8 | ＜0.8 |
| (Warpage) | ‰ | ＜2.5 | ＜2.5 |
| (Volume Density) | g/cm3 | ≥3.24 | ≥3.24 |
| (Coefficient of Linear Expansion) | [RT-300℃]10-6mm/℃ | 4.6 | 4.6 |
| (Volume Resistance) | 20℃ Ω·cm | ＞10¹³ | ＞10¹³ |
| (Dielectric Constant) | [@1MHz] | 10.6 | 10.6 |
| (Dielectric Loss) | [@1MHz] | 4.6×10-4 | 4.6×10-4 |
| (Dielectric Strength) | （KV/mm) | ≥20 | ≥20 |
Product Size Specification
| Thickness (mm) | Size(inch) | |||||
| 50.8×50.8 | 114.3×114.3 | 120×120 | 140×190 | 254×254 | 300×300 | |
| 0.25 | √ | √ | √ | – | – | – |
| 0.381 | √ | √ | √ | – | – | – |
| 0.5 | √ | √ | √ | √ | – | – |
| 0.635 | √ | √ | √ | √ | √ | √ |
| 1 | √ | √ | √ | √ | √ | √ |
| 1.5 | √ | √ | √ | √ | √ | √ |
| 2 | √ | √ | √ | √ | √ | √ |
JarnisTech stands out as a top notch PCB manufacturer based in China known for our expertise, in crafting premium aluminum nitride PCBs. Our dedicated team of professionals takes great pride in ensuring that our clients receive top tier quality PCBs.
Each customers needs for aluminum nitride PCB are unique which is why we offer tailor made solutions to match your requirements. With our commitment to quality and excellence, you can rely on us to deliver the finest aluminum nitride PCB products on the market.
The Raw Material Properties of the Aluminum Nitride PCB
| Property | Items | Unit | AlN |
| Physical | Color | – | Grey |
| Water absorption | % | 0 | |
| Reflectivity | % | 30* | |
| Electrical | Dielectric Constant (1MHz) | – | 9.0 |
| Dielectric Loss | *10^-3 | 3 | |
| Dielectric strength | MV/m or KV/mm | >19 | |
| Insulation/Volume resistance | Ω·cm | >10^14 | |
| Mechanical | Density after sintering (Bulk density) | g/cm3 | 3.30 |
| Flexural Strength (3 point) | Mpa | 300 | |
| Surface Roughness | μm | 0.3～0.6 | |
| Warpage | % | ≦0.3 | |
| Thermal | Coefficient of Thermal Expansion (CTE) | ppm/°C | 3.16 |
| Coefficient of Thermal Expansion (CTE) RT~500 °C | ppm/°C | 4.02 | |
| Thermal Conductivity (25°C) | W/m‧K | 170 |
NOTE: The detail outlined in this document relate to material that’re currently, on the market and are meant for comparison purposes. It should not be considered an absolute statement of the materials propertie, nor an assertion or warranty of legal liability.
Users are accountable for evaluating the appropriateness of the information for its intended use and taking on all associated risks and responsibilities. Moreover individuals should carry out their examinations to confirm that the material is appropriate, for its intended use.
We are committed to provide reliable details about our product to help our customer make well informed choice. If you have any questions, about the features or qualities of our materials please contact JarnisTech, we will response soon.
Why Aluminum Nitride Ceramics PCB Are Widely Used?
Aluminum nitride ceramic PCB stand out for their traits like high thermal conductivity, low dielectric constant, minimal dielectric loss and remarkable resistance to wear and plasma erosion. These properties make them valuable, across industries. Some notable uses of this material are:
● Electronics industry
● Aerospace and defense
● Automotive industry
● Medical and healthcare
Delivery time and Cost
Delivery
Usually a simple FR4 PCB with aluminum can be. Shipped in about 5 7 business days. On the hand producing nitride ceramic PCBs requires more complex steps leading to a longer manufacturing time. As a result the lead time, for PCBs ranges from 13 to 15 working days.
Cost
The price of aluminum nitride PCBs can vary based on aspects such as size, thickness, coating, color and the number of layers (single, double or multi layer PCB). Additionally the total cost may also be influenced by the quantity ordered. Being a producer and supplier of aluminum nitride PCBs in China we offer discounts, for large orders and cater to our clients with OEM services.
We recommend that our customers send us their Gerber files via email so we can provide them with an estimate that covers all the information about their individual needs. Our team, at JarnisTech.com is committed to giving cost estimates tailored to our clients specific requirements. Please don’t hesitate to reach out to us whenever it suits you.
Why You Should Select Us?
Our company provides choices of aluminum nitride ceramic PCBs featuring standard thermal conductivity of 170 W/m·K or higher along, with ultra high thermal conductivity surpassing 200 W/m·K. We offer a range of substrate variations, including grinder type, as fired types high bending types, high thermal conductivity types polishing types laser scribing types and more.
In addition, we offer a range of substrate options ,such as a various types of metallization to cater to your specific needs. Our choices encompass DPC, DBC, TPC, AMB, thick film and thin film metallization.
We are proud to provide PCB that are only 0.10 mm thick. At the same time, we dedication to delivering a selection of top notch items guarantees that we can fulfill the requirements of our clients, in different sectors.
Whether you require aluminum nitride ceramic PCB with superior thermal conductivity or specific metallization, we are confident that we can offer a solution that meets your needs. Call us now, we will reply you soon.
Future Developments and Challenges in Aluminum Nitride Ceramic PCB
● Increasing electrical conductivity: Aluminum nitride ceramics have a relatively low electrical conductivity, which is a limitation for some application. material engineer are investigating methods to enhance its conductivity. Such as, incorporating additional materials and introducing conductive additives.
● Reducing costs: Though the price of aluminum ceramic PCB has gone down over time it still tends to be more expensive, than certain other materials. It is essential to develop more cost effective manufacturing techniques while preserving the desired properties of the material.
● Improved fabrication techniques: Manufacturing aluminum nitride ceramic PCB presents challenge due to the material’s hardness and susceptibility to thermal shock. Researchers are actively developing more efficient and reliable manufacturing techniques. Including laser processing and hot pressing.
● Better bonding between ceramic and metal layers: Delamination between the aluminum nitride layer and metal layer may occur due to variations, in their thermal expansion coefficients. Researcher are currently investigating bonding materials and technologies to achieve stronger and more durable ceramic and metal bonding.
● Expanding application: Aluminum nitride ceramic PCBs demonstrate significant potential in high power and high frequency applications prompting researchers to explore their potential in various other areas. Their exceptional chemical resistance and biocompatibility render them ideal for use, in medical and environmental sensor technology.
In a Word
Aluminum nitride ceramic PCB provide thermal conductivity, dielectric features and mechanical durability in contrast to conventional materials. This makes them ideal, for applications requiring power and high frequency in the military, aerospace and telecommunications industries. Nonetheless, this PCB base material hardness and unique properties specialized manufacturing equipment and technology.
Ongoing research in this field is set to boost electrical conductivity, cut cost, and improve the bonding between ceramic and metal layer, widening their application scope. The experimental result and analysis of aluminum nitride ceramic PCB offer valuable insights for optimizing their design, manufacturing and reliability, making it this promising technology for the future.
As a reliable PCB manufacturer, we’re dedicated to delivering top quality aluminum nitride ceramic PCB to our valued client. Feel free to request a quote by emailing [email protected], and we’ll get back to you promptly. Thanks for reading our article, we hope it helped you understand the benefits of aluminum nitride ceramics better.
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