In the world of printed circuit boards (PCBs), selecting the right material is crucial for achieving optimal performance and reliability. One such material that stands out is the Arlon 45N PCB Material. With its exceptional physical, thermal, electrical, and mechanical properties, the Arlon 45N offers a versatile solution for a wide range of high-performance applications. From its impressive flame retardancy and thermal conductivity to its excellent dimensional stability and electrical insulation capabilities, this material has earned its reputation as a top choice for demanding electronic designs.
This article explores the remarkable properties and advantages of the Arlon 45N PCB Material, showcasing why it is a powerful solution in the PCB industry.
Overview of Arlon 45N PCB Material
Multifunctional Epoxy Laminate & Prepreg
The Arlon 45N PCB Material is a highly regarded and versatile material specifically designed for use in printed circuit boards (PCBs). It is known for its exceptional toughness and impressive glass transition temperature of 175 degrees Celsius, as determined by Differential Scanning Calorimetry (DSC).
This material takes the form of a prepreg system and multifunctional epoxy laminate, making it suitable for various applications that require higher layer counts in multilayer boards. It can be processed using the conventional conditions typically used for FR-4, which ensures ease of integration into existing manufacturing processes.
The Arlon 45N PCB Material finds relevance in a wide range of critical applications, including motherboards, black planes, BGA packaging, multilayer boards with high layer counts, and automotive applications. Its exceptional performance and durability make it an ideal choice for demanding environments and industries.
All in all, the Arlon 45N PCB Material is a multifunctional and reliable solution that offers excellent toughness, a high glass transition temperature, and compatibility with conventional processing conditions. Its versatility and performance make it highly suitable for a range of advanced PCB applications.
Features of Arlon 45N PCB Laminate
The Arlon 45N PCB Material boasts several notable features that contribute to its exceptional performance and suitability for various applications. These features include:
1.Meets IPC4101/26 description and specification:
The material complies with the industry-standard IPC4101/26 specification, ensuring its adherence to recognized quality and performance standards.
2.High Tg by DSC (175°C):
The material has a high glass transition temperature (Tg) of 175 degrees Celsius, as determined by Differential Scanning Calorimetry (DSC). This high Tg value indicates its ability to withstand elevated operating temperatures without compromising its structural integrity.
3.Resists barrel cracking and inner layer copper cracking during fabrication:
The Arlon 45N PCB Material exhibits excellent resistance to barrel cracking and inner layer copper cracking, common issues that can occur during the fabrication process. This resistance ensures the integrity of the PCB and reduces the risk of failure.
4.Resistant to Measling and Solder shock Defects:
The material is highly resistant to measling, a phenomenon characterized by the formation of small cracks on the surface of the PCB. It also withstands solder shock, which refers to the stress placed on the material during the soldering process. This resistance minimizes the occurrence of defects and enhances the reliability of the PCB.
The material meets the UL-94 VO flammability rating, indicating that it has excellent flame retardant properties. This enhances safety and reduces the risk of fire hazards.
The Arlon 45N PCB Material is compliant with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives. This compliance ensures that the material is free from harmful substances and environmentally friendly.
7.Suitable for most Lead-Free applications:
The material is compatible with lead-free soldering processes, making it suitable for use in applications requiring compliance with lead-free regulations.
Performance Characteristic of Arlon 45N
The Arlon 45N PCB Material offers a range of desirable properties across various aspects. Here is a summary of its key properties:
Flammability rating of V0: The material has excellent flame retardancy, meeting the V0 rating, which indicates high resistance to ignition and self-extinguishing properties.
Thermal conductivity of 0.25 W/mk: This indicates that the material has a moderate ability to conduct heat, which can be beneficial for dissipating heat generated by electronic components.
Density of about 1.85 g/cm3: The material has a relatively high density, indicating its solid and robust nature.
Water absorption of 0.1%: The low water absorption rate signifies the material’s resistance to moisture-related issues and dimensional stability.
Glass transition temperature (Tg) of 175 degrees Celsius: This is the temperature at which the material transitions from a rigid to a more flexible state and is an important parameter for determining the maximum operating temperature of the PCB.
Expansion along the Z-axis of 2.4% (50-260 degrees Celsius): This indicates the material’s ability to expand or contract in response to temperature changes, which is crucial for preventing thermal stress and maintaining dimensional stability.
Coefficient of Thermal Expansion (CTE) of 14-16 ppm/C (X, Y axis): This parameter represents the material’s dimensional change in response to temperature variations and is essential for ensuring reliability in different temperature environments.
CTE of 200 ppm/C (>Tg) and 55 ppm/C (<Tg) along the Z-axis: These values indicate the material’s different thermal expansion behavior above and below the glass transition temperature.
Dielectric constant between 4.2 and 4.6 at 1 MHz: This parameter describes the material’s ability to store electrical energy and is crucial for determining signal integrity and impedance control.
Volume resistivity of 2.6 × 107 MΩ-cm (C96/35/90) and 3.3 × 107 MΩ-cm (E24/125): These values represent the material’s resistance to electrical current flow and indicate its ability to insulate and prevent leakage.
Dissipation factor of 0.025 at 1 MHz: This parameter describes the material’s ability to dissipate electrical energy as heat and is important for minimizing signal loss and maintaining electrical performance.
Electrical strength of 1500 kV/mm: This indicates the material’s ability to withstand high voltages without breakdown, making it suitable for high-voltage applications.
Arc resistance of 65 seconds: This parameter measures the material’s ability to withstand the formation and propagation of an electrical arc.
Surface resistivity of 2.9 × 107 MΩ (E24/125) and 4.0 × 104 MΩ (C96/35/90): These values represent the material’s resistance to electrical current flow across its surface.
Poisson’s Ratio of 0.2: This parameter describes the material’s lateral contraction when subjected to axial strain.
Young’s Modulus of 2.8 (CD/MD): This represents the material’s stiffness or rigidity.
Peel strength with respect to copper of 8 N/mm after thermal stress, at elevated temperatures, and after process solutions: This parameter indicates the adhesive strength between the material and copper, ensuring the integrity of the PCB during various manufacturing and operating conditions.
These properties collectively make the Arlon 45N PCB Material suitable for demanding applications that require flame retardancy, thermal management, dimensional stability, electrical insulation, and mechanical strength.
Arlon 45N PCB Material: Typical Applications
The Arlon 45N PCB Material is well-suited for a variety of applications that require high performance and durability. Some typical applications include:
1. Automotive Under-hood applications: The material’s toughness and ability to withstand high temperatures make it suitable for use in automotive under-hood applications. These include engine control modules, powertrain systems, and other components that are exposed to harsh conditions.
2. Backplanes and Mother Boards: The Arlon 45N PCB Material is commonly used in the fabrication of backplanes and motherboards. Its high Tg and resistance to cracking ensure the reliability and longevity of these critical components in various electronic devices.
3. Ball Grid Array (BGA) Packaging: BGA packaging is widely used in electronics manufacturing, and the Arlon 45N PCB Material is an excellent choice for BGA substrates. Its high Tg and resistance to solder shock defects make it ideal for this application.
4. High layer count Multi-Layer Boards (MLBs): The material’s compatibility with high layer count MLBs makes it a preferred choice for applications that require complex circuitry and advanced functionality. It can handle the higher layer counts and provide the necessary performance and reliability.
These are just a few examples of the typical applications where the Arlon 45N PCB Material excels. Its versatility, reliability, and ability to withstand challenging conditions make it suitable for a wide range of advanced PCB applications.
How to handle Arlon 45N In PCB Manufacturing?
The recommended process conditions for working with the Arlon 45N PCB Material are as follows:
1. Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide on inner layers. Adjust the dwell time in the oxide bath to ensure a uniform coating. This step ensures proper surface treatment and preparation of the inner layers.
2. Bake inner layers in a rack for 60 minutes at 225°F – 250°F (107°C- 121°C) immediately prior to lay-up. This step helps to remove any residual moisture and improve the adhesion of the material during lamination.
3. Vacuum desiccate the prepreg for 8 – 12 hours prior to lamination. This step ensures that the prepreg is free from moisture and contaminants, which can affect the lamination process and the overall quality of the PCB.
a)Pre-vacuum for 30 minutes. Pre-vacuuming helps to remove any trapped air or gases from the stack-up, ensuring proper lamination and adhesion.
b) Control the heat rise to 8°F-12°F (4.5°C- 6.5°C) per minute between 210°F and 300°F (100°C and 150°C). This gradual temperature increase helps to prevent thermal stress and minimize the risk of delamination.
c) Product temperature at the start of cure should be 360°F (180°C). This is the target temperature for the curing process.
d) Cure time at temperature is 90 minutes. This duration ensures sufficient time for the material to cure and achieve the desired mechanical and electrical properties.
e) Cool down under pressure at ≤12°F/min (6°C/min). This controlled cooling rate helps to prevent thermal shock and maintain the integrity of the PCB.
Following these recommended process conditions will help ensure optimal performance and reliability when working with the Arlon 45N PCB Material. It is important to note that specific process conditions may vary depending on the equipment, materials, and manufacturing requirements. Therefore, it is always recommended to consult the manufacturer’s guidelines and perform thorough testing to determine the best process conditions for your specific application.
The Arlon 45N PCB Material truly lives up to its reputation as a high-performance solution for modern electronic designs. With its exceptional flame retardancy, thermal conductivity, dimensional stability, electrical insulation, and mechanical strength, it offers a winning combination of properties that meet the rigorous demands of today’s applications. Whether it’s for aerospace, automotive, telecommunications, or any other industry, the Arlon 45N provides the reliability, performance, and versatility that engineers and designers seek. Embracing this remarkable material opens up a world of possibilities for pushing the boundaries of electronic design. When it comes to unleashing the full potential of your PCBs, the Arlon 45N is the ideal choice.