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Arlon 25N

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Arlon 25N PCB Board

Arlon 25N PCB materials have emerged as a leading choice for high-frequency applications, delivering exceptional performance and reliability. With its unique properties and advantages, Arlon 25N offers engineers a versatile solution for achieving enhanced signal integrity and stability in electronic designs. In this article, we will explore the key features and benefits of Arlon 25N, compare it with other high-quality high-frequency PCB substrates, and discuss its applications across various industries.

Arlon 25N PCB Materials: Introduction

Arlon 25N is a type of composite material specifically engineered for use in microwave and RF multilayer printed circuit boards. It is composed of woven fiberglass reinforced with a ceramic filler. The combination of a non-polar thermoset resin system and a controlled-expansion ceramic filler results in several advantageous properties.

One of the key benefits of Arlon 25N is its low dielectric constant and low loss, which contribute to improved signal stability across a wide range of temperatures. Additionally, it exhibits a low Thermal Coefficient of Dielectric Constant (TCEr), further enhancing its suitability for applications requiring consistent signal performance in varying ambient temperatures.

Designed for integration into multilayer packages, Arlon 25N offers prepregs that possess identical chemical composition and physical properties as their copper-clad laminates. This uniformity ensures a homogeneous finished package, optimizing signal integrity throughout the circuit.

The exceptional characteristics of Arlon 25N, including its low dielectric constant (Er), low loss, low TCEr, and excellent physical stability, make it an ideal choice for wireless and digital applications. It finds applications in cellular telephones, down converters, low noise amplifiers, antennas, and other advanced circuit designs.

In terms of processing, Arlon 25N materials can be handled using standard techniques employed for high-temperature thermoset-based printed circuit board substrates. This compatibility simplifies the manufacturing process, allowing for seamless integration of Arlon 25N into existing production workflows for high-temperature PCBs.

Features of Arlon 25N

The key features of Arlon 25N are as follows:

1. Low Loss Ceramic-Filled Thermoset Resin: Arlon 25N utilizes a thermoset resin system that is filled with ceramic particles. This combination results in a composite material that exhibits low loss characteristics. Low loss is crucial in applications where signal integrity is paramount, as it minimizes the attenuation of signals passing through the material.

2. Tight Dielectric Tolerance Control: Arlon 25N offers precise control over its dielectric constant, ensuring that it meets stringent design requirements. The dielectric constant, also known as the relative permittivity, determines the material’s ability to store electrical energy. By maintaining tight tolerance control, Arlon 25N enables accurate and predictable electrical performance in microwave and RF circuits.

3. Excellent Dimensional Stability: Arlon 25N demonstrates remarkable dimensional stability, meaning it retains its shape and size under varying environmental conditions. This stability is crucial in multilayer printed circuit boards where multiple layers of materials are stacked and subjected to temperature fluctuations. The dimensional stability of Arlon 25N helps maintain the structural integrity and electrical performance of the PCB over time.

4. Excellent Price/Performance Ratio: Arlon 25N offers an outstanding balance between performance and cost-effectiveness. While providing desirable electrical properties and stability, it also offers competitive pricing, making it an attractive choice for PCB design engineers. The excellent price/performance ratio of Arlon 25N ensures that the material meets the functional requirements of the application without imposing excessive manufacturing costs.

These features collectively make Arlon 25N a reliable and cost-effective choice for microwave and RF multilayer printed circuit boards, particularly in applications where low loss, dimensional stability, and precise electrical performance are critical.

Arlon 25N: Benefits

Arlon 25N offers several benefits that contribute to enhanced performance and reliability in electronic applications:

1.Greater Signal Integrity:

The low loss properties of Arlon 25N ensure minimal signal attenuation, resulting in improved signal integrity. This is crucial for high-frequency applications where maintaining signal quality is paramount to prevent data loss or distortion.

2.Wider Eye Patterns:

Arlon 25N enables wider eye patterns, which refers to the opening of the eye diagram in high-speed digital communication systems. Wider eye patterns indicate improved signal quality and increased tolerance to noise and distortion, leading to more robust and reliable data transmission.

3.Excellent Dimensional Stability:

Arlon 25N exhibits exceptional dimensional stability, meaning it maintains its shape and size even under varying environmental conditions. This stability is essential for multilayer printed circuit boards, as it helps prevent warping or distortion that could negatively impact electrical performance or cause assembly issues.

4.Utilizes Standard FR-4 Processes:

Arlon 25N is compatible with standard FR-4 (Flame Retardant 4) processes commonly used in the production of printed circuit boards. This compatibility ensures easy integration into existing manufacturing workflows, reducing the need for specialized equipment or processes.

5.Excellent Thermal Properties:

Arlon 25N offers excellent thermal properties, allowing it to effectively dissipate heat generated by active components or high-power applications. Efficient thermal management is vital for maintaining the reliability and longevity of electronic devices, as it helps prevent overheating and component failure.

By providing greater signal integrity, wider eye patterns, dimensional stability, compatibility with standard processes, and excellent thermal properties, Arlon 25N contributes to the overall performance and reliability of electronic circuits and devices. It is well-suited for applications requiring high-frequency signal transmission, high-speed digital communication, and effective heat dissipation.

Challenges and Disadvantages of Using Arlon 25N

While Arlon 25N offers various advantages and benefits, there are some challenges and disadvantages that engineers may encounter when using this material for PCB substrates. These include:

1. Cost: Arlon 25N may have a higher cost compared to standard FR-4 materials commonly used in PCB manufacturing. The enhanced performance and specialized properties of Arlon 25N contribute to its higher price point. Designers need to consider the cost implications and evaluate whether the benefits outweigh the increased expense for their specific application.

2. Limited Availability: Arlon 25N may have limited availability compared to more widely used PCB materials. This can sometimes result in longer lead times and potential supply chain challenges. Designers need to plan accordingly and ensure a reliable supply source for their production requirements.

3. Processing Complexity: While Arlon 25N can utilize standard FR-4 processes, there may still be some additional considerations during fabrication. The specialized properties of Arlon 25N, such as its low loss and thermal characteristics, may require adjustments to manufacturing processes or specialized equipment. This can add complexity to the production process and may require collaboration with experienced PCB manufacturers.

4. Material Handling and Compatibility: Arlon 25N, like any specialized material, may require specific handling procedures and precautions during fabrication. Designers and manufacturers need to ensure they have the necessary knowledge and expertise to handle the material properly to prevent any damage or compromised performance.

5. Design Constraints: The unique properties of Arlon 25N may introduce certain design constraints. For example, the material’s low loss characteristics may require wider trace widths or specific impedance control techniques. Designers need to be aware of these constraints and adapt their designs accordingly to maximize the benefits of Arlon 25N.

Despite these challenges, Arlon 25N remains a valuable choice for applications that demand high-performance PCB substrates. By carefully considering the specific requirements of the project and collaborating closely with experienced manufacturers, engineers can mitigate these challenges and leverage the benefits of Arlon 25N effectively.

Typical Applications of Arlon 25N PCB Substrates

Arlon 25N PCB substrates find typical applications in various electronic devices and systems that require high-performance circuit boards. Some of the common applications include:

1.Cellular Base Station Antennas:

Arlon 25N is well-suited for cellular base station antennas, where it provides reliable signal transmission and stability. Its low loss and excellent dimensional stability make it ideal for high-frequency applications in wireless communication systems.

2.Power Amplifiers:

Power amplifiers require robust and efficient PCB circuit boards to handle high-power signals. Arlon 25N’s low loss properties, along with its ability to dissipate heat effectively, make it suitable for power amplifier applications, ensuring reliable signal amplification and minimizing signal degradation.

3.Down Converters:

Arlon 25N is well-suited for down converters, which are essential components in wireless communication systems. Its low loss characteristics help maintain signal integrity during the conversion process, ensuring accurate and reliable signal reception and processing.

4.High-Speed Backplanes:

Backplanes serve as the backbone of high-speed data transmission systems, such as servers, data centers, and telecommunications equipment. Arlon 25N’s wide eye patterns and excellent signal integrity make it an ideal choice for high-speed backplanes, enabling reliable and efficient data transmission at elevated frequencies.

By utilizing Arlon 25N PCB substrates in these applications, designers can benefit from its low loss, excellent dimensional stability, and compatibility with high-frequency and high-speed circuitry. These properties contribute to improved signal performance, reduced signal degradation, and enhanced overall reliability of the electronic systems.

Compare with Other High Quality High Frequency PCB Substrates Materials

Arlon 25N is just one of several high-quality high-frequency PCB substrate materials available in the market. Let’s compare Arlon 25N with some other commonly used materials:

1. Rogers RO4000 Series: Rogers Corporation offers a range of high-frequency PCB substrate materials under the RO4000 series. These materials, like Arlon 25N, feature low loss and excellent high-frequency performance. They are known for their consistent electrical properties, tight dielectric constant control, and high dimensional stability. Rogers materials are widely used in applications such as aerospace, defense, and telecommunications.

2. Taconic TLY Series: Taconic’s TLY series is another popular choice for high-frequency PCB substrates. These materials offer low loss, excellent dimensional stability, and consistent electrical performance. Taconic materials are known for their ease of processing and compatibility with standard fabrication techniques. They are commonly used in applications such as wireless communication systems, automotive radar, and satellite communications.

3. Isola IS680: Isola’s IS680 is a high-performance PCB substrate material designed for high-frequency applications. It offers low loss, excellent signal integrity, and good thermal performance. IS680 materials provide high reliability and superior electrical performance in demanding environments. They are commonly used in applications such as base station antennas, satellite communication systems, and automotive radar.

When comparing these materials to Arlon 25N, it is important to evaluate their specific properties, such as dielectric constant, loss tangent, thermal conductivity, dimensional stability, and processing compatibility. The suitability of a particular material depends on the specific requirements of the application, including frequency range, power levels, thermal management needs, and cost considerations.


Arlon 25N PCB materials provide engineers with a powerful tool for optimizing high-frequency performance in electronic designs. With its low loss, excellent dimensional stability, and compatibility with standard processing techniques, Arlon 25N proves to be a reliable and cost-effective choice.

Whether it’s for cellular base station antennas, power amplifiers, down converters, or high-speed backplanes, Arlon 25N demonstrates its value by delivering greater signal integrity, wider eye patterns, and excellent thermal properties. As the demand for high-frequency applications continues to grow, Arlon 25N remains at the forefront, empowering engineers to push the boundaries of electronic design.

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