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Jarnistech > High TG PCB > TG130 PCB
TG130 PCB Boards

When starting as a beginner in electronic design, we was primarily focused on understanding circuit boards, their types, and the processes involved in their manufacturing, assembly, and fabrication. However, even after a decade of experience in the industry, we continually come across new and intricate aspects related to PCBs that require continuous learning and understanding.

In this article, We will provide a comprehensive overview of a critical aspect in PCBs—the significance of standard or low TG130 board thickness. Just as you once sought information on this topic, we believe that reading this piece will prove enlightening for individuals interested in TG130 PCBs and other related standard-size printed circuit boards. Let us now delve into the subject matter, exploring the importance of TG130 board thickness and its implications in PCB manufacturing.

TG130 PCB Circuit Boards

TG130 is a type of printed circuit board (PCB) material. It is a high-quality, reliable, and widely used material in the electronics industry. TG stands for “glass transition temperature,” which refers to the temperature at which the material transitions from a solid state to a softer, more pliable state.

TG130 PCBs are known for their excellent thermal stability and mechanical strength, making them suitable for applications that require durability and reliability. These PCBs offer good electrical insulation and are commonly used in high-temperature environments or applications that generate a significant amount of heat.

Materials Used in TG130 PCB Board Manufacturing

TG130 is a common designation for a type of high-temperature laminate material used in PCB (Printed Circuit Board) manufacturing. TG130 PCB boards are designed to withstand higher operating temperatures compared to standard FR-4 boards. The materials used in the manufacturing of TG130 PCB boards typically include:

Substrate Material:

High-Temperature Laminate: The primary material used in TG130 PCBs is a high-temperature laminate, often composed of a reinforced epoxy resin system. This laminate is specifically engineered to have a higher glass transition temperature (Tg) than standard FR-4 materials.

Reinforcement Materials:

Glass Fiber: Fiberglass is a common reinforcement material used in TG130 PCBs. It provides mechanical strength and dimensional stability to the PCB.

Copper Foil:

Copper foil is used as the conductive material in the PCB. It is typically laminated onto the substrate material and etched to create the desired circuitry.

Prepreg Material:

Prepreg (pre-impregnated) sheets are intermediate layers in the PCB manufacturing process. These sheets consist of resin-impregnated reinforcement materials, such as fiberglass, which are partially cured. Prepregs help bond the layers of the PCB together during the lamination process.

Soldermask and Silkscreen:

Soldermask: A protective layer applied to the PCB surface, usually in green or other colors, to insulate the copper traces and prevent solder bridges during assembly.
Silkscreen: A layer that adds component designators, logos, and other markings on the PCB’s surface to aid in component placement and identification.

Surface Finish:

Surface finish refers to the coating applied to the exposed copper traces on the PCB surface to protect them from oxidation and facilitate soldering. Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservatives), and others.

Features and Benefits of TG130 PCBs

Some key features and benefits of TG130 PCBs include:

1. High thermal resistance: TG130 PCBs can withstand elevated temperatures without losing their mechanical or electrical properties, making them suitable for applications where heat dissipation is crucial.

2. Durability: The material used in TG130 PCBs is highly resistant to mechanical stress, ensuring long-lasting performance and reliability.

3. Good electrical properties: TG130 PCBs provide excellent electrical insulation, ensuring reliable signal transmission and minimizing the risk of short circuits or electrical failures.

4. Compatibility with lead-free processes: TG130 PCBs are compatible with lead-free soldering processes, making them suitable for environmentally friendly manufacturing practices.

5. Cost-effectiveness: TG130 PCBs offer a good balance between performance and cost, making them a popular choice for a wide range of applications.

It’s worth noting that while TG130 is a common and well-known PCB material, there are many other types of materials available, each with its own specific properties and applications. When choosing a PCB material, it’s essential to consider the specific requirements of your project and consult with a PCB manufacturer or expert to ensure the best material selection for your needs.

Key Specifications for Standard TG130 Printed Circuit Boards

Laminate Requirements:

The lamination process for TG130 PCBs is influenced by the board thickness. Typically, TG130 PCBs have an average thickness of 0.5mm. However, customization options are available to adjust the board thickness according to the specific requirements of the TG130 printed circuit board.

Minimum Peel Strength:

Peel strength is a measure of the mechanical strength of a material and is influenced by the thickness range of the finished product. In the case of TG130 PCBs, board raw materials made from fiberglass cloth exhibit superior peel strength characteristics.

Minimum Volume Resistivity:

Volume resistivity refers to the resistance of a material to water molecules. Standard TG130 PCBs typically demonstrate specific class values such as C-96/35/90, higher temperature range E-24/125, and post-humidity conditioning. These class values depend on the choice of board material and thickness.

Minimum Surface Resistivity:

Surface resistivity refers to the resistance between the layers of the PCB. TG130 PCBs have three available classes: C-96/35/90, higher temperature E-24/125, and post-humidity conditioning.

Maximum Moisture:

The maximum moisture absorption of TG130 PCBs is influenced by the board thickness. Different thicknesses will have varying absorption capabilities.

Permittivity and Minimum Arc:

The dielectric constant, which determines the electrical strength, is influenced by the copper thickness on the PCB. These requirements also apply to other standard TG130 board specifications.

Minimum Flexural Strength:

Flexural strength has two aspects: length and cross-direction. The specifications for these aspects vary based on the thickness of the TG130 board, particularly when it exceeds 0.5mm. The flexural strength contributes to the board’s ability to withstand mechanical stress.

Minimum Thermal Stress:

Thermal stress pertains to the temperature requirements of the PCB. It is also dependent on the thickness of the TG130 board. Thicker boards generally exhibit better resistance to thermal stress compared to thinner TG130 PCBs.

When to Used for TG130 in Printed Circuit Board Manufacturing?

TG130 is a type of laminate material commonly used in printed circuit board (PCB) manufacturing. It offers specific characteristics and properties that make it suitable for certain applications. Here are some scenarios in which TG130 is commonly used:

1. General Electronics: TG130 PCBs are widely utilized in various general electronics applications. They offer good thermal performance, mechanical stability, and electrical insulation, making them suitable for a range of electronic devices, including consumer electronics, industrial equipment, and automotive electronics.

2. Low to Medium Complexity Designs: TG130 is often preferred for low to medium complexity PCB designs. Its properties, such as moderate heat resistance and mechanical strength, make it suitable for applications that do not require extreme temperature or high-speed performance.

3. Cost-Effective Solutions: TG130 laminates are relatively cost-effective compared to higher-end materials. If cost is a determining factor, TG130 can provide a balance between performance and affordability.

4. Standard Thickness Requirements: TG130 is commonly used for PCBs with standard thickness requirements. It performs well in typical thickness ranges and is readily available in the market.

5. Non-Critical Applications: If the PCB is intended for non-critical applications where stringent performance requirements are not a priority, TG130 can be a suitable choice. It offers sufficient performance for many standard electronic applications without the need for specialized materials.

It’s important to note that the selection of laminates, including TG130, should be based on the specific requirements of the PCB design, such as operating conditions, signal integrity needs, thermal management, and cost considerations. Consulting us, we can help determine whether TG130 is the appropriate choice for a particular application.

What Are Testing Methods for Tg130 Printed Circuit Boards?

Testing methods for TG130 printed circuit boards (PCBs) typically involve verifying the board’s electrical performance, thermal properties, and overall reliability. Here are some common testing methods for TG130 PCBs:

1. Electrical Testing:

Continuity Testing: Verifies the integrity of electrical connections and checks for any open or short circuits.

Functionality Testing: Ensures that the PCB operates as intended and all components and circuitry are functioning correctly.

Signal Integrity Testing: Analyzes signal quality, impedance matching, and transmission line characteristics to ensure reliable signal transmission.

2. Thermal Testing:

Thermal Cycling: Subjecting the PCB to repeated temperature cycles to assess its ability to withstand thermal stress.

Thermal Shock Testing: Rapidly exposing the PCB to extreme temperature changes to test its resistance to thermal shock.

Thermal Imaging: Using infrared cameras to identify hotspots, thermal gradients, and potential thermal issues on the PCB.

3. Mechanical Testing:

Vibration Testing: Subjecting the PCB to controlled vibrations to assess its mechanical durability and solder joint reliability.

Mechanical Shock Testing: Applying sudden mechanical shocks to the PCB to evaluate its resistance to impact and mechanical stress.

Drop Testing: Simulating accidental drops or impacts to assess the PCB’s structural integrity and component stability.

4. Environmental Testing:

Temperature and Humidity Testing: Exposing the PCB to different temperature and humidity levels to evaluate its performance under varied environmental conditions.

Salt Spray Testing: Subjecting the PCB to a corrosive salt spray to determine its resistance to corrosion.

Contamination Testing: Assessing the PCB’s susceptibility to contaminants such as dust, moisture, or chemicals.

5. Reliability Testing:

Accelerated Life Testing: Simulating extended periods of operation at elevated temperatures and stress levels to evaluate the PCB’s long-term reliability.

HALT (Highly Accelerated Life Testing): Subjecting the PCB to extreme environmental conditions, such as rapid temperature changes and vibration, to identify potential weaknesses and failure points.

It’s important to note that the specific testing methods employed for TG130 PCBs may vary depending on the requirements, industry standards, and the intended application of the PCBs. Manufacturers and testing laboratories may have their own customized testing protocols to ensure the quality and reliability of TG130 PCBs.

Cost Considerations for TG130 Printed Circuit Boards

Several factors can influence the price of a TG130 PCB (or any PCB, for that matter). Here are some key factors that can impact the pricing:

1.Board size and complexity:

The size and complexity of the PCB directly affect the manufacturing process, material usage, and production time. Larger or more intricate PCB designs require more materials and longer production times, which can increase the overall cost.

2.Number of layers:

PCBs can be single-layer, double-layer, or multilayer, with each additional layer adding complexity and cost to the manufacturing process. Multilayer PCBs, including TG130 PCBs, require more materials and involve more intricate fabrication steps, making them generally more expensive than single-layer or double-layer boards.

3.Copper weight:

The thickness of the copper traces on the PCB, often referred to as copper weight, can impact the cost. Higher copper weights require more copper material, leading to increased manufacturing costs.

4.Material selection:

The choice of PCB material can affect the price. While TG130 is a popular and cost-effective material, there are other material options available with varying costs. Some advanced or specialized materials may be more expensive than standard materials.


The quantity of PCBs ordered can influence the price. Typically, larger production quantities result in lower per-unit costs due to economies of scale. Ordering larger volumes can help reduce the price per PCB.

6.Turnaround time:

The required turnaround time for the production of the PCB can affect the price. If you need the PCBs manufactured and delivered quickly, expedited or rush production services may come at an additional cost.

7.Additional features:

Any additional features or requirements, such as special finishes (e.g., gold plating), specific tolerances, impedance control, or complex solder mask designs, can increase the overall price of the TG130 PCB.

8.Supplier and location:

The choice of PCB manufacturer or supplier and their location can impact the pricing. Different manufacturers may have different pricing structures and overhead costs, and the location can affect shipping and logistics expenses.

In Conclusion

The versatility, performance, and reliability of TG130 PCB boards make them a crucial component in the advancement of high-temperature electronic systems across various industries. By harnessing the unique properties of high-temperature laminate materials, TG130 PCBs pave the way for innovation in demanding applications. As technology evolves, the continued exploration and optimization of TG130 PCB technology will undoubtedly contribute to the development of more efficient and robust electronic solutions in the future.

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