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High TG PCB Stack-up

Jarnistech > High TG PCB > High TG PCB Stack-up
Heavy Copper High TG PCB

Designing the stack-up layout for a high TG PCB is a critical step in ensuring the board’s performance, reliability, and manufacturability. A well-planned stack-up layout takes into account factors such as material selection, layer order, signal integrity, thermal management, and manufacturing considerations. By following specific guidelines and best practices, designers can create high-quality high TG PCBs that meet the requirements of high-temperature applications.

Background of High TG PCBs

High TG PCBs, or high glass transition temperature PCBs, are printed circuit boards that are designed to withstand higher temperatures than standard PCBs. The glass transition temperature (Tg) of a PCB refers to the temperature at which the material transitions from a rigid state to a more flexible state. High TG PCBs are typically made using materials with a Tg of 170°C or higher, compared to standard PCBs which have a Tg of around 130-140°C.

High TG PCBs are important in a variety of applications where the PCBs will be exposed to high temperatures, such as in automotive, aerospace, and industrial environments. These PCBs are able to withstand the higher temperatures without deforming or delaminating, ensuring the reliability and longevity of the electronic devices they are used in.

In automotive applications, high TG PCBs are used in engine control units, transmission control units, and other components that are exposed to high temperatures under the hood of a vehicle. In aerospace applications, high TG PCBs are used in avionics systems, radar systems, and other critical electronic components that must perform reliably in extreme temperature conditions.

Overall, high TG PCBs are essential for ensuring the reliability and performance of electronic devices in high temperature environments, making them a crucial component in a wide range of industries.

Importance of Stack-Up in High TG PCBs

The stack-up design of a high TG PCB is crucial for ensuring the performance, reliability, and manufacturability of the circuit board. The stack-up refers to the arrangement of copper layers, insulating layers, and other materials within the PCB. In high TG PCBs, the stack-up must be carefully designed to accommodate the higher temperatures that the board will be exposed to.

Here are some key reasons why the stack-up is important in high TG PCBs:

1. Thermal management: High TG PCBs are designed to withstand higher temperatures, so the stack-up must be designed to efficiently dissipate heat and prevent overheating of components. Proper placement of copper layers and thermal vias can help to manage heat dissipation and prevent hot spots on the board.

2. Signal integrity: The stack-up design can impact the signal integrity of the PCB. Proper layer arrangement and impedance matching are essential for ensuring that signals are transmitted accurately and without interference. High TG materials can help to maintain signal integrity at high temperatures, but the stack-up design plays a critical role in achieving optimal signal performance.

3. Mechanical stability: High TG PCBs are more rigid and less prone to warping or delamination at high temperatures, but the stack-up design can also impact the mechanical stability of the board. Proper layer alignment and material selection are important for ensuring that the board remains stable and reliable under thermal stress.

4. Manufacturing considerations: The stack-up design can also impact the manufacturability of the PCB. Proper layer alignment, material selection, and stack-up configuration are important for ensuring that the board can be manufactured efficiently and reliably. A well-designed stack-up can help to minimize manufacturing issues and ensure consistent quality in high TG PCBs.

In conclusion, the stack-up design is a critical aspect of high TG PCBs, impacting thermal management, signal integrity, mechanical stability, and manufacturability. Careful consideration of the stack-up is essential for designing high-performance, reliable high TG PCBs for demanding applications.

Factors to Consider in High TG PCB Stack-Up

When designing the stack-up for a high TG PCB, there are several important factors to consider to ensure optimal performance, reliability, and manufacturability. Some key factors to keep in mind include:

1. Material selection: High TG PCBs require materials with a high glass transition temperature to withstand elevated temperatures. Selecting the appropriate high TG laminate and prepreg materials is crucial for ensuring the board can withstand the intended operating conditions.

2. Layer count and order: Determine the number of copper layers needed for the design and the order in which they will be stacked. Consider the signal, power, and ground planes, as well as any specific requirements for impedance control or signal integrity.

3. Copper thickness and weight: The thickness and weight of the copper layers can impact the board’s thermal performance, impedance control, and mechanical stability. Select the appropriate copper thickness based on the current-carrying capacity and signal requirements.

4. Thermal management: Consider the placement of thermal vias, heat sinks, and other thermal management techniques to help dissipate heat effectively and prevent overheating of components. Proper thermal management is essential for high TG PCBs operating in high-temperature environments.

5. Signal integrity: Pay attention to the impedance matching, signal routing, and layer arrangement to maintain signal integrity and minimize signal interference. Proper signal routing and layer stack-up can help minimize signal distortion and ensure reliable communication.

6. Mechanical stability: Ensure that the stack-up design provides sufficient mechanical strength and stability to prevent warping, delamination, or other mechanical issues. Proper layer alignment, material selection, and overall board construction are critical for ensuring the board’s mechanical reliability.

7. Manufacturing considerations: Consider the manufacturability of the stack-up design, including the feasibility of fabrication processes such as drilling, plating, and lamination. Optimize the stack-up to minimize manufacturing issues and ensure consistent quality in production.

By carefully considering these factors in the stack-up design of high TG PCBs, designers can create boards that meet the performance requirements, reliability standards, and manufacturing constraints of high-temperature applications. Collaborating with experienced PCB manufacturers and considering industry best practices can help ensure a successful high TG PCB design.

Design Guidelines for High TG PCB Stack-Up

1. Signal Layer Arrangement

– Consider signal integrity requirements when placing signal layers in the stack-up
– Ensure proper spacing between signal layers to minimize crosstalk and interference
– Place high-speed signal layers closer to the reference planes for better signal integrity

2. Power and Ground Plane Placement

– Allocate dedicated power and ground planes for each signal layer to minimize noise
– Place power planes closer to the signal layers to reduce power delivery impedance
– Use multiple ground planes to provide a low impedance return path for high-speed signals

3. Controlled Impedance Routing

– Calculate and maintain controlled impedance traces for high-speed signals
– Use differential pairs for high-speed signals to minimize electromagnetic interference
– Consider signal layer thickness and dielectric constant when designing controlled impedance traces

4. Thermal Via Placement

– Place thermal vias strategically to dissipate heat efficiently from high-power components
– Connect thermal vias to multiple layers for better heat dissipation throughout the PCB
– Use thermal vias in conjunction with thermal relief pads for better thermal management

5. Component Placement

– Place high-power components close to the thermal vias for efficient heat dissipation
– Group components with similar functions together to minimize signal path lengths
– Consider signal integrity and thermal management when placing components on the PCB

Following these design guidelines for high TG PCB stack-up will help ensure optimal performance, reliability, and thermal management of the PCB layout.

Which industry needs to high TG PCB Stackups?

High TG PCB stackups are essential in industries where electronic devices and systems are exposed to high temperatures and harsh operating conditions. Some key sectors that necessitate the use of high TG PCB stackups include:

Automotive: Automotive electronics, such as engine control units, power modules, and infotainment systems, are frequently subjected to elevated temperatures caused by engine heat and under-hood conditions. High TG PCBs guarantee reliable performance and prevent premature failure in these demanding environments.

Industrial: Industrial machinery, automation systems, and power electronics often operate in high-temperature settings found in factories, manufacturing plants, and power generation facilities. High TG PCBs provide thermal stability and a prolonged lifespan in such applications.

Aerospace and Defense: Electronic systems in aircraft, spacecraft, and military equipment endure extreme temperature variations and thermal cycling. High TG PCBs preserve signal integrity and prevent thermal-induced failures in these critical applications.

Telecommunications: High-power telecommunications equipment, including base stations and network switches, generate substantial heat. High TG PCBs aid in effective heat dissipation and ensure reliable operation in high-density, high-power environments.

Medical: Medical devices, such as MRI scanners and surgical lasers, demand high-performance PCBs that can withstand sterilization processes and high temperatures during operation. High TG PCBs meet these stringent requirements and guarantee the safety and reliability of medical equipment.

Other industries that can benefit from high TG PCB stackups include:

Consumer Electronics: High-end gaming consoles, laptops, and smartphones equipped with advanced features and high-power components often generate significant heat. High TG PCBs enhance thermal performance and extend the lifespan of these products.

Renewable Energy: Power inverters and other components in solar and wind energy systems are exposed to high temperatures due to environmental conditions and power conversion processes. High TG PCBs improve system efficiency and reliability in these applications.

Lighting: High-power LED lighting fixtures and streetlights require PCBs capable of withstanding the high temperatures generated by the LED arrays. High TG PCBs ensure optimal light output and longevity.


Designing a high TG PCB stack-up layout requires careful consideration of various factors to ensure optimal performance and reliability. By following the guidelines outlined in this article, designers can create stack-up layouts that meet the thermal requirements, signal integrity standards, and manufacturing constraints of high TG PCBs. Collaborating with experienced PCB manufacturers – JarnisTech and utilizing simulation tools can help validate the stack-up design and optimize the layout for high-temperature applications. By adhering to best practices and design guidelines, designers can develop high-quality high TG PCBs that meet the demands of today’s high-temperature electronic devices.

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