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FR4 Glass Fiber Vs Aluminum Substrate

Jarnistech > Aluminum PCB > FR4 Glass Fiber Vs Aluminum Substrate
FR4 Glass Fiber and Aluminum Substrate

Printed circuit boards (PCBs) are vital components in modern electronics, providing mechanical support and electrical connections between various components. The choice of substrate material significantly impacts the performance and characteristics of a PCB.

In the world of electronic applications, the choice of PCB substrate plays a crucial role in determining the performance, reliability, and suitability of the final product. This article aims to compare the two most common substrate materials used today: FR4 glass epoxy and aluminum. By examining parameters such as electrical performance, thermal conductivity, mechanical strength, ease of manufacturing, and cost, design engineers can make informed decisions when selecting the appropriate substrate for their specific application requirements.

Electrical Performance

Electrical PropertyFR4Aluminum
Dielectric Constant4.2 – 4.63.7
Loss Tangent0.01 – 0.0250.001
Insulation Resistance>1000 MΩ10-25 MΩ
Breakdown Voltage12 kV/mm1.5 kV/mm

Dielectric Constant The dielectric constant of the substrate plays a significant role in influencing various aspects of PCB performance such as impedance control, signal integrity, and crosstalk. Typically, FR4 has a dielectric constant ranging from 4.2 to 4.6 across the signal frequency range. On the other hand, aluminum substrates exhibit a lower dielectric constant of approximately 3.7.

The lower dielectric constant of aluminum offers advantages in terms of allowing tighter trace spacing and routing on outer layers without compromising signal integrity. This makes aluminum a suitable choice for densely populated high-speed digital boards that require precise impedance control.

Loss Tangent The loss tangent of a substrate material indicates the inherent signal loss it introduces. FR4 typically exhibits a loss tangent ranging from 0.01 to 0.025. In contrast, aluminum possesses an exceptionally low loss tangent of 0.001.

The lower loss tangent of aluminum results in reduced signal loss and intersymbol interference. High-speed signals experience less distortion when transmitted over aluminum substrates compared to FR4. Consequently, aluminum substrates can support higher signal frequencies and data rates with improved performance.

Insulation Resistance Insulation resistance measures the ability of a substrate to effectively insulate between conductors or layers carrying different signals. FR4 generally demonstrates an insulation resistance above 1000 MΩ, while aluminum substrates have a significantly lower insulation resistance ranging from 10-25 MΩ.

While the insulation resistance of FR4 is sufficient for most applications, the lower insulation resistance of aluminum substrates renders them unsuitable for high-voltage boards where stronger insulation is required.

Breakdown Voltage Breakdown voltage refers to the maximum voltage that a substrate can withstand before electrical breakdown occurs. FR4 boards typically have a breakdown voltage around 12 kV/mm, whereas aluminum substrates possess a comparatively lower breakdown voltage of 1.5 kV/mm.

The higher breakdown voltage of FR4 boards allows them to safely operate at higher voltages. However, caution must be exercised when using aluminum substrates in scenarios where high potentials may be present between conductors or layers, as their lower breakdown voltage may lead to electrical breakdown.

Thermal Performance

Thermal PropertyFR4Aluminum
Thermal Conductivity0.25 W/mK237 W/mK
CTE14-16 ppm/°C23 ppm/°C
Thermal Cycles Withstood150 (0°C to 100°C)2000+ (0°C to 100°C)
Max Operating Temperature130°C660°C

Thermal Conductivity The thermal conductivity of a substrate is a crucial factor in determining its ability to efficiently conduct heat across the PCB. FR4 exhibits a relatively low thermal conductivity of approximately 0.25 W/mK. Conversely, aluminum possesses an exceptionally high thermal conductivity of 237 W/mK.

The high thermal conductivity of aluminum enables it to rapidly dissipate heat from hot components, making it particularly well-suited for thermal management in high-power boards. In contrast, FR4’s poor thermal conductivity hinders effective heat conduction, leading to localized heating and potential reliability issues.

Coefficient of Thermal Expansion (CTE) The coefficient of thermal expansion (CTE) indicates the extent to which a material’s dimensions change in response to temperature variations. FR4 typically has a CTE ranging from 14 to 16 ppm/°C, while aluminum has a CTE of 23 ppm/°C.

The CTE mismatch between FR4, copper traces, and components can result in thermal stresses during heating and cooling cycles. Aluminum’s CTE closely aligns with that of copper, reducing the potential for thermal stress on interconnects.

Thermal Cycles Withstood Repeated thermal cycling can lead to failures such as solder cracks and delamination due to material expansion and contraction. FR4 is generally capable of withstanding around 150 cycles between 0°C and 100°C. In comparison, aluminum substrates can endure over 2000 such cycles without experiencing failures.

Aluminum’s superior thermal cycling capability makes it highly suitable for applications characterized by frequent thermal load fluctuations, such as those found in the aerospace and automotive industries.

Maximum Operating Temperature The maximum temperature at which a substrate can reliably operate depends on the glass transition temperature for organic materials like FR4 and the melting point for metals like aluminum. FR4 typically has a glass transition temperature of around 130°C, while aluminum boasts a higher melting point of 660°C.

The higher maximum operating temperature rating of aluminum substrates enables them to function in high-temperature environments beyond the capabilities of FR4 boards. This makes aluminum an excellent choice for applications that require operation under elevated temperature conditions.

Mechanical Performance

Mechanical PropertyFR4Aluminum
Flexural Strength275-380 MPa110-350 MPa
Tensile Strength70-80 MPa90-190 MPa
Hardness100-110 (Rockwell)25-50 (Rockwell)
Density1900-2000 kg/m<sup>3</sup>2700 kg/m<sup>3</sup>

Flexural Strength Flexural strength is a measure of a substrate’s ability to withstand bending forces without experiencing damage or failure. FR4 typically exhibits a flexural strength ranging from 275 to 380 MPa. On the other hand, aluminum substrates possess a higher flexural strength, ranging from 110 to 350 MPa depending on the specific alloy.

The higher flexural strength of aluminum provides increased mechanical robustness compared to FR4 substrates.

Tensile Strength Tensile strength refers to a substrate’s ability to withstand pulling or tensile forces before fracturing. FR4 has a relatively low tensile strength, typically ranging from 70 to 80 MPa. In contrast, aluminum exhibits a higher tensile strength, ranging from 90 to 190 MPa depending on the specific alloy.

Aluminum substrates can endure higher pulling or tension forces compared to FR4 substrates.

Hardness Hardness measures a material’s resistance to indentation, scratching, and abrasion. On the Rockwell scale, FR4 typically has a hardness of 100 to 110. Aluminum, on the other hand, possesses a lower hardness ranging from 25 to 50 depending on the specific alloy.
The higher hardness of FR4 provides better resistance against physical damage such as scratches compared to the softer aluminum.

Density Density refers to the mass per unit volume of the substrate material. FR4 has a density ranging from 1900 to 2000 kg/m³. In comparison, aluminum has a higher density of 2700 kg/m³.

The lower density of FR4 offers weight advantages, particularly in weight-sensitive applications such as aerospace and portable electronic devices.

FR4 and Aluminum Manufacturability Comparison

Manufacturing ParameterFR4Aluminum
Max Layer Count>30 layers2-10 layers
Via/Hole FabricationStandard drilling/platingChallenging
Component AssemblyStandard solderingSpecialized processes
Material AvailabilityReadily availableLower, longer lead times

Layer Count In order to meet the demands of complex circuitry and high component density, modern PCBs often utilize multi-layer designs. FR4 boards, widely available from mainstream manufacturers, can support high layer counts of over 30 layers. In contrast, aluminum boards typically have restrictions and are limited to 2 or 4 layers.

While aluminum substrates can adequately accommodate simpler board designs, FR4 offers far greater flexibility for complex multilayer applications.

Via and Hole Fabrication Vias and through-holes on PCBs play a crucial role in interconnecting layers and terminating components. The standard process of drilling and plating holes is easily executed on FR4 boards. However, drilling smooth holes in aluminum can be challenging due to aluminum’s tendency to smear around drill bits.
Mechanical punching and microvia laser drilling techniques can be employed to create holes in aluminum, but these methods come with higher costs. This limitation also restricts the minimum via size achievable on aluminum boards.

Component Assembly Soldering is the primary method used to attach components onto PCBs. The glass transition temperature of FR4 allows it to withstand soldering temperatures with minimal damage. On the other hand, aluminum can dissolve into molten solder or become oxidized at elevated temperatures, necessitating the use of specialized soldering processes.

Aluminum boards may require higher temperature solders and fluxes, as well as protective coatings in pad areas. This adds complexity to the component assembly process compared to FR4 boards.

Material Availability FR4 laminates are manufactured globally in large volumes, ensuring their widespread availability at a low cost. In contrast, aluminum PCB substrates require specialized fabrication processes and have lower availability. It is common to experience lead times of over 8 weeks for aluminum boards.

For prototyping and production ramp-up purposes, FR4 offers a time-to-market advantage over aluminum substrates.

Environmental Performance

Environmental AspectFR4Aluminum
Max Operating Temperature130°C>300°C
Solvent ResistancePoorExcellent
FlammabilityV-0, V-1 ratingsNon-flammable
Outgassing/Vacuum CompatibilityHigh outgassingNegligible outgassing
Moisture AbsorptionHighLow

Operating Temperature Range As previously mentioned, FR4 has a maximum operating temperature of approximately 130°C, while aluminum substrates can withstand temperatures exceeding 300°C.

For applications that require operating temperatures surpassing 130°C, aluminum is the only suitable option. FR4 substrates would not be able to withstand temperatures beyond their glass transition point.

Resistance to Solvents Strong solvents, such as acetone, can cause swelling and mechanical damage to organic substrates like FR4. In contrast, aluminum exhibits excellent chemical resistance and remains unaffected by solvents.

In applications where resistance to solvents is critical, such as in military avionics, aluminum provides a durable substrate that can resist chemical attack.

Flame Retardancy Due to its resin system, FR4 is inherently flammable. However, the addition of flame retardant additives allows FR4 to achieve flame ratings of V-0 and V-1, in accordance with UL 94 standards. Conversely, aluminum is inherently non-flammable and does not require the use of flame retardant additives.

For safety-critical applications, such as in the automotive industry, the use of aluminum substrates eliminates the risk of flammability and the generation of smoke and toxic gases during fires.

Outgassing and Vacuum Compatibility In vacuum environments, organic substrates like FR4 tend to release moisture and other volatile compounds through a process known as outgassing. These compounds can condense on sensitive surfaces, potentially causing issues. Aluminum, on the other hand, exhibits negligible outgassing and is well-suited for space and vacuum applications.

Furthermore, FR4 laminates have a tendency to absorb atmospheric moisture, which can have an impact on electrical performance. Aluminum substrates, however, experience fewer issues with moisture absorption.

Conclusion FR4 vs Aluminum Substrates

Electrical PerformanceModerateExcellent signal integrity
Thermal PerformancePoorExcellent thermal conductivity
Mechanical PerformanceModerate strength and hardnessHigher strength
ManufacturabilityExcellent, well-establishedChallenging
Environmental PerformanceModerate thermal and chemical resistanceExcellent high-temp and chemical resistance
CostLow4X to 8X of FR4

FR4 and Aluminum, Which one Do You Need?

Determining whether you need FR4 or aluminum depends on your specific requirements and the application you have in mind. Here are some factors to consider:

1. Operating Temperature: If your application requires operating temperatures beyond 130°C, aluminum would be the suitable choice as it can withstand temperatures exceeding 300°C. FR4 substrates would not be able to handle such high temperatures.

2. Solvent Resistance: If your application involves exposure to strong solvents, such as acetone, and requires resistance to chemical attack, aluminum would be the better option. FR4 substrates can be damaged and swell when exposed to strong solvents.

3. Flame Retardancy: For safety-critical applications where flammability is a concern, such as the automotive industry, aluminum substrates are preferred as they are inherently non-flammable. FR4 requires the addition of flame retardant additives to achieve flame ratings, but aluminum does not require such additives.

4. Outgassing and Vacuum Compatibility: In vacuum environments or space applications, aluminum is more suitable as it exhibits negligible outgassing. FR4 substrates, on the other hand, tend to release moisture and other volatiles through outgassing, which can cause issues in sensitive environments.

Consider these factors and evaluate your specific requirements to determine whether FR4 or aluminum is the appropriate choice for your application.

In Conclusion

Engineers must carefully evaluate the trade-offs between FR4 and aluminum PCB substrates based on their specific application requirements. While FR4 offers a cost-effective solution with balanced electrical performance and ease of fabrication, aluminum substrates excel in thermal management, signal integrity, and environmental resistance. However, the higher cost of aluminum must be considered. Furthermore, the option of hybrid boards, leveraging the strengths of both substrates, provides an alternative for optimizing PCB performance. As the industry continues to innovate, a wider range of PCB substrate options will become available, enabling designers to further optimize their electronic applications.

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