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Jarnistech > ITEQ PCB > ITEQ IT-180GN

The demand for high-performance printed circuit board (PCB) substrates continues to grow as electronic manufacturers strive for enhanced functionality, reliability, and miniaturization in their products. ITEQ IT-180GN PCB substrate material stands out as a leading choice for meeting these evolving industry requirements. With its exceptional electrical, thermal, and mechanical properties, ITEQ IT-180GN offers a robust foundation for the development of advanced PCBs. This article delves into the key attributes and benefits of ITEQ IT-180GN, highlighting its significance in empowering electronic manufacturers to achieve superior product performance and quality.

What is ITEQ IT-180GN?

The low-flow prepreg IT-180GN is specifically designed for the production of rigid-flex boards incorporating a metal heatsink. This material offers a high glass transition temperature (Tg) of 175°C, as well as low and consistent resin fluidity, exceptional thermal stability, and resistance to Conductive Anodic Filamentation (CAF). Additionally, it is compatible with lead-free soldering processes. Furthermore, the material demonstrates superior adhesion strength to a wide range of substrates commonly used in the fabrication of rigid-flex and other types of printed circuit boards.

Main Feature of IT-180GN PCB Materials

IT-180GN PCB materials offer a range of exceptional features that make them a preferred choice for various applications.

High glass transition temperature Tg175°:

One notable feature is the high glass transition temperature (Tg) of 175°C. This high Tg value indicates the material’s ability to withstand elevated temperatures without undergoing significant dimensional changes, ensuring long-term reliability and stability in demanding environments.

Low and Uniform Resin Fluidity:

Another key feature is the low and uniform resin fluidity. This characteristic ensures that the material flows consistently during the production process, resulting in uniform and reliable PCBs with predictable performance.

Excellent Thermal Stability:

IT-180GN also exhibits excellent thermal stability, allowing it to maintain its structural integrity even under high-temperature conditions. This feature is crucial for applications that involve heat dissipation or prolonged exposure to elevated temperatures.

Compatible with Lead-free Soldering:

The compatibility with lead-free soldering is another significant advantage of IT-180GN. As the industry moves towards environmentally friendly and RoHS-compliant soldering processes, this material ensures reliable solder joints without compromising performance.

High Technology:

With its high technology capabilities, IT-180GN meets the requirements of advanced PCB designs. It offers precise and reliable performance in complex circuitry, enabling engineers to implement cutting-edge technologies with confidence.

Low Df:

The low dissipation factor (Df) of IT-180GN is another important feature. A low Df indicates minimal energy loss and improved signal integrity, making it suitable for high-frequency applications where signal quality is crucial.

CAF Resistance:

IT-180GN is also resistant to Conductive Anodic Filamentation (CAF), which is a common failure mode in PCBs. Its CAF resistance ensures long-term reliability and prevents performance degradation due to the formation of conductive pathways within the material.


Lastly, IT-180GN is halogen-free, making it an environmentally friendly choice. This feature eliminates the use of harmful halogen compounds, ensuring compliance with environmental regulations and promoting sustainability.

All in all, the main features of IT-180GN PCB materials include high Tg, low and uniform resin fluidity, excellent thermal stability, compatibility with lead-free soldering, high technology capabilities, low Df, CAF resistance, and halogen-free composition. These features collectively make IT-180GN an excellent choice for demanding PCB applications that require reliability, performance, and environmental consciousness.

IT-1 80GN: Performance and Advantages

IT-180GN is an advanced epoxy prepreg that boasts a range of notable features. With its high glass transition temperature (Tg) and halogen-free, phosphorous-containing composition, it offers exceptional performance in demanding applications. Notably, IT-180GN exhibits superior bonding strength when used in conjunction with bonding sheet prepreg, ensuring reliable and robust connections.

One key advantage of IT-180GN is its low powder content, which makes it ideal for punching processing. This characteristic minimizes waste and facilitates efficient manufacturing processes. Additionally, this epoxy prepreg demonstrates highly consistent and uniform flow behavior, ensuring predictable and reliable results during production.

Complementing its excellent flow performance, IT-180GN exhibits outstanding thickness uniformity and flatness. This property is essential for achieving precise and accurate PCB designs. Consequently, it enables PCB engineers to create rigid-flex board configurations with confidence, knowing that the material will contribute to the overall reliability and performance of the finished product.

Therefore, IT-180GN embodies the qualities required for high-quality and high-performance PCB designs. Its combination of high Tg, halogen-free composition, superior bonding strength, low powder content, consistent flow behavior, and excellent thickness uniformity make it an optimal choice for professional PCB engineers seeking reliable and efficient solutions in the field.

ITEQ IT-180GN Vs ITEQ IT-180A PCB Materials

ITEQ IT-180GN and ITEQ IT-180A are both high-performance PCB materials, but they have some differences in their properties and applications.


●High TG (glass transition temperature) substrate.

●Low dielectric constant and dissipation factor.

●Excellent thermal stability and mechanical properties.

●Suitable for high-speed digital applications, automotive electronics, industrial control systems, power electronics, aerospace and defense, and medical devices.

●Provides reliable signal integrity and high-speed data transmission.

●Well-suited for applications requiring high operating temperatures and harsh environmental conditions.

●Offers good thermal reliability and performance in demanding electronic systems.

●Ideal for applications that require high reliability and stability in harsh operating conditions.


●High-performance PCB material with a high TG.

●Low CTE (coefficient of thermal expansion) and good dimensional stability.

●Good thermal conductivity and heat dissipation properties.

●Suitable for high-power applications, LED lighting, automotive electronics, power electronics, and industrial control systems.

●Provides excellent thermal performance and reliability in high-power electronic systems.

●Ideal for applications requiring high thermal conductivity and heat dissipation.

●Well-suited for applications that require high reliability and stability in high-power and high-temperature environments.

Overall, ITEQ IT-180GN is suitable for a wide range of applications that require high thermal stability, reliability, and performance in harsh operating conditions, while ITEQ IT-180A is ideal for applications that require high thermal conductivity, heat dissipation, and dimensional stability in high-power and high-temperature environments. Both materials offer high performance and reliability, but their specific properties make them better suited for different types of electronic applications.

How to Test the Efficiency of ITEQ IT-180GN Laminate?

Testing the efficiency of ITEQ IT-180GN laminate involves evaluating its electrical, thermal, and mechanical properties to ensure it meets the requirements of the intended application. Here are some tests that can be conducted to assess the efficiency of ITEQ IT-180GN laminate:

1. Electrical Testing:

Dielectric Constant (Dk) and Dissipation Factor (Df): Measure the dielectric constant and dissipation factor at different frequencies to ensure the material has stable electrical properties across the desired frequency range.

Insulation Resistance: Conduct insulation resistance tests to evaluate the material’s ability to maintain electrical isolation between conductive elements.

Electrical Strength: Perform high-voltage breakdown tests to determine the electrical strength and insulation capability of the laminate.

2. Thermal Testing:

Glass Transition Temperature (Tg): Determine the Tg of the laminate to ensure it can withstand high-temperature operation without significant degradation of its properties.

Thermal Conductivity: Measure the material’s thermal conductivity to assess its ability to dissipate heat efficiently, which is crucial for high-power applications.

Thermal Coefficient of Expansion (CTE): Evaluate the CTE to understand how the material responds to temperature changes and its dimensional stability.

3. Mechanical Testing:

Peel Strength: Conduct peel strength tests to assess the bond strength between the copper foil and the laminate.

Tensile Strength and Flexural Strength: Measure the material’s tensile and flexural strength to ensure it can withstand mechanical stresses during fabrication and assembly processes.

4. Chemical Resistance Testing:

Chemical Resistance: Assess the material’s resistance to chemicals, solvents, and environmental factors that it may encounter during its lifecycle.

5. Reliability Testing:

Thermal Aging: Subject the laminate to accelerated thermal aging to evaluate its long-term thermal stability and reliability.

Moisture Absorption: Determine the material’s moisture absorption characteristics to assess its reliability in humid environments.

By performing these tests, it is possible to evaluate the electrical, thermal, mechanical, and reliability characteristics of ITEQ IT-180GN laminate and ensure its efficiency for the intended application. Additionally, compliance with industry standards and specifications should be considered during the testing process.

Factors that Affect the Cost of ITEQ 180GN

The factors that can affect the cost of ITEQ IT-180GN PCB laminate include:

1.Thermal and Mechanical Properties:

The specific thermal and mechanical properties of the laminate can influence the cost. Materials with enhanced thermal performance or mechanical strength may be priced higher due to their advanced characteristics.

2.Copper Cladding Type:

The type and thickness of the copper cladding used in the laminate can impact the cost. Higher copper thickness or specialty copper types may result in increased material expenses.

3.Panel Size and Thickness:

The dimensions and thickness of the laminate panels can affect the cost. Larger panel sizes or non-standard thicknesses may lead to higher material costs and potentially impact manufacturing processes.


The volume of ITEQ IT-180GN laminate being purchased can influence the cost. Bulk orders may be eligible for volume discounts, while smaller quantities may have higher unit costs.

5.Dissipation Factor and Dielectric Constant:

The electrical properties of the laminate, such as the dissipation factor and dielectric constant, may affect the cost. Materials with specific electrical characteristics may be priced differently based on their performance.

6.Shipment Cost:

The transportation and logistics costs associated with delivering the laminate to the customer’s location can also impact the overall cost. Factors such as shipping distance, mode of transport, and any special handling requirements can contribute to the total cost.

Applications of ITEQ IT-180GN High TG PCB Substrates

1.High-speed digital applications:

ITEQ IT-180GN high TG PCB substrates are suitable for high-speed digital applications such as data communication, network equipment, and high-speed computing systems. The high thermal stability and low dielectric constant of these substrates ensure reliable signal integrity and high-speed data transmission.

2.Automotive electronics:

ITEQ IT-180GN high TG PCB substrates can be used in automotive electronics where high operating temperatures and thermal stability are essential. These substrates can withstand the harsh operating conditions in automotive environments and provide reliable performance for applications such as engine control units, powertrain systems, and infotainment systems.

3.Industrial control systems:

ITEQ IT-180GN high TG PCB substrates are well-suited for industrial control systems that require high reliability and stability in harsh operating conditions. These substrates can be used in applications such as industrial automation, robotics, and power distribution systems.

4.Power electronics:

ITEQ IT-180GN high TG PCB substrates are suitable for power electronics applications where high operating temperatures and thermal stability are critical. These substrates can be used in power converters, inverters, motor drives, and other power electronic systems.

5.Aerospace and defense:

ITEQ IT-180GN high TG PCB substrates can be used in aerospace and defense applications where high thermal stability, reliability, and performance are essential. These substrates can be used in avionics systems, radar systems, communication systems, and other critical electronic systems in aerospace and defense.

6.Medical devices:

ITEQ IT-180GN high TG PCB substrates can be used in medical devices where high reliability and stability are required. These substrates can be used in applications such as medical imaging equipment, patient monitoring systems, and diagnostic devices.


ITEQ IT-180GN PCB substrate material represents a pivotal advancement in the realm of electronic manufacturing. Its superior electrical characteristics, thermal stability, and mechanical resilience position it as a top-tier solution for enabling the creation of cutting-edge PCB designs. As electronic manufacturers continue to push the boundaries of innovation, ITEQ IT-180GN stands ready to underpin their endeavors with reliability, performance, and efficiency. Embracing ITEQ IT-180GN as the substrate material of choice paves the way for the realization of next-generation electronic devices that excel in functionality, durability, and technological prowess.

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