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Jarnistech > ITEQ PCB > ITEQ IT-258GA3
ITEQ IT-258GA3 PCB Board

In the ever-evolving world of electronics, the demand for high-performance and reliable PCB materials continues to grow. Among the leading options available, ITEQ IT-258GA3 PCB materials stand out as a trusted choice for manufacturers seeking excellence. With its exceptional properties and adherence to industry standards, ITEQ IT-258GA3 has become synonymous with cutting-edge technology and uncompromising quality.

Overview of ITEQ IT-258GA3

ITEQ IT-258GA3 is a type of PCB (Printed Circuit Board) material developed by ITEQ, a leading manufacturer in the electronics industry. ITEQ IT-258GA3 is specifically designed for use in various electronic applications, offering a range of desirable properties and characteristics.

ITEQ IT-258GA3 is a halogen-free, medium Tg (>150℃ by DSC) multifunctional epoxy that exhibits exceptional thermal reliability and resistance against Conductive Anodic Filamentation (CAF).The medium Tg ensures enhanced thermal stability and performance, making it suitable for applications that involve higher operating temperatures. This advanced PCB material is specifically designed to meet the rigorous demands of handheld and consumer applications, offering reliable performance even under high-temperature conditions associated with lead-free assembly processes reaching up to 260℃.

Key Features of ITEQ IT-258GA3 PCB Materials

1.Advanced Resin Technology:

ITEQ IT-258GA3 utilizes a medium Tg (glass transition temperature) halogen-free multifunctional epoxy resin with excellent thermal reliability. This industrial-standard material is developed using advanced resin technology, ensuring high performance and reliability. Therefore, ITEQ IT-258GA3 also exhibits excellent thermal reliability, meaning it maintains its structural integrity and electrical performance even under elevated temperatures. This property makes it well-suited for applications that require efficient heat dissipation and prolonged operational lifetimes.

2.Excellent Thermal Resistance:

The halogen-free resin system in ITEQ IT-258GA3 offers exceptional thermal resistance, making it suitable for multiple high-density interconnect (HDI) press cycles. This material maintains its structural integrity and electrical performance even under elevated temperatures.

3.Lead-Free Assembly Compatible:

One notable feature of ITEQ IT-258GA3 is its halogen-free composition. It is formulated without the use of halogenated compounds, which are known to have environmental and health concerns. The halogen-free nature of this material aligns with industry regulations and promotes a safer and more sustainable manufacturing process.

ITEQ IT-258GA3 is compliant with the Restriction of Hazardous Substances (RoHS) directive. It features a low coefficient of thermal expansion (CTE), which is crucial for high thermal reliability requirements. This PCB material is compatible with lead-free assembly processes, allowing for a maximum reflow temperature of 260℃.

4.Friendly Processing and CAF Resistance:

ITEQ IT-258GA3 is designed to be user-friendly during the PCB manufacturing process. It can be easily handled using standard equipment and chemical processes, streamlining the production workflow. Additionally, ITEQ IT-258GA3 demonstrates resistance against Conductive Anodic Filamentation (CAF). CAF is a phenomenon that can occur in PCBs, leading to electrical failures caused by the formation of conductive paths between copper traces. The CAF resistance of ITEQ IT-258GA3 enhances the reliability and longevity of electronic devices, particularly in demanding environments.

5.Available in Variety of Constructions:

ITEQ IT-258GA3 is available in a wide range of constructions, catering to different application requirements. It offers flexibility in terms of copper weights and glass styles, allowing for customization and optimization based on specific design needs.

Overall, ITEQ IT-258GA3 is a high-quality PCB material that offers a balance of electrical, thermal, and mechanical properties. Its medium Tg, halogen-free composition, thermal reliability, and CAF resistance make it a suitable choice for a range of applications, including handheld devices and consumer electronics.

ITEQ IT-258GA3: Applications

ITEQ IT-258GA3 PCB material finds applications in various industries and electronic devices due to its desirable properties and reliability. Here are some common applications where ITEQ IT-258GA3 is well-suited:

1. Smartphones and Cell Phones: ITEQ IT-258GA3 is ideal for the production of PCBs used in smartphones and cell phones. Its thermal reliability, CAF resistance, and compatibility with lead-free assembly processes make it suitable for the compact and high-performance circuitry found in these devices.

2. HDI and Multilayer PCBs: High-Density Interconnect (HDI) and multilayer PCBs often require advanced materials capable of handling complex circuitry and miniaturization. ITEQ IT-258GA3 meets these requirements, making it a suitable choice for applications where space is limited and signal integrity is crucial.

3. PCs and Notebooks: ITEQ IT-258GA3 is well-suited for PCBs used in personal computers (PCs) and notebooks. Its thermal resistance and compatibility with lead-free assembly processes ensure reliable performance even in demanding computing environments.

4. Memory Modules: Memory modules, such as RAM (Random Access Memory) modules, require reliable PCB materials to ensure data integrity and performance. ITEQ IT-258GA3’s thermal reliability and CAF resistance contribute to the long-term stability and functionality of memory modules.

5. LCD Panels: Liquid Crystal Display (LCD) panels used in various electronic devices, including monitors, televisions, and portable devices, can benefit from the use of ITEQ IT-258GA3. Its thermal properties and resistance to CAF contribute to the durability and performance of PCBs used in LCD panels.

6. Game Players: PCBs used in gaming consoles and handheld game players demand materials that can withstand prolonged gaming sessions and high thermal loads. ITEQ IT-258GA3’s thermal reliability and CAF resistance make it suitable for such gaming applications.

7. Servers and Networking: ITEQ IT-258GA3 is applicable to the production of PCBs used in server systems and networking equipment. These high-performance devices require reliable materials that can handle intensive data processing and operate under elevated temperatures.

8. Telecommunications: ITEQ IT-258GA3 is well-suited for telecommunications applications, including base stations, routers, and communication infrastructure. Its thermal reliability and compatibility with lead-free assembly processes ensure consistent performance in telecommunications systems.

These are just a few examples of the wide range of applications where ITEQ IT-258GA3 PCB material can be used. Its properties and characteristics make it a versatile choice for electronic devices across various industries.

ITEQ IT-258GA3: Industrial Approval

ITEQ IT-258GA3 PCB material has obtained industrial approvals that validate its quality and compliance with industry standards. The following approvals are associated with ITEQ IT-258GA3:

1. UL 94 V-0: ITEQ IT-258GA3 has achieved UL 94 V-0 classification. UL 94 is a standard for flammability testing of plastic materials used in various applications. The V-0 rating signifies that ITEQ IT-258GA3 exhibits excellent fire resistance and self-extinguishing properties, making it a safe choice for electronic devices.

2. IPC-4101C Spec / 128: ITEQ IT-258GA3 meets the specifications outlined in IPC-4101C, which is a standard established by the Institute for Printed Circuits (IPC). Spec / 128 refers to the specific configuration or laminate type within the IPC-4101C specification. Compliance with IPC standards ensures consistency and reliability in PCB manufacturing processes.

3. RoHS Compliant: ITEQ IT-258GA3 is compliant with the Restriction of Hazardous Substances (RoHS) directive. RoHS compliance restricts the use of certain hazardous substances, such as lead, mercury, cadmium, and others, in electronic products. The RoHS compliance of ITEQ IT-258GA3 demonstrates its commitment to environmental sustainability and the use of safer materials.

These industrial approvals highlight the adherence of ITEQ IT-258GA3 to stringent quality and safety standards. They provide reassurance to manufacturers and end-users regarding the reliability, safety, and environmental sustainability of ITEQ IT-258GA3 PCB material.

Which Types PCB Board Use ITEQ IT-258GA3 Substrate?

ITEQ IT-258GA3 PCB material can be used as a substrate in various types of PCB boards. Some common types of PCB boards where ITEQ IT-258GA3 can serve as a substrate include:

1.Single-Sided PCBs:

Single-sided PCBs have conductive traces on one side of the substrate. ITEQ IT-258GA3 can be used as the base material for single-sided PCBs, providing excellent thermal reliability and compatibility with lead-free assembly processes.

2.Double-Sided PCBs:

Double-sided PCBs have conductive traces on both sides of the substrate. ITEQ IT-258GA3 can be utilized as the substrate material for double-sided PCBs, allowing for increased circuit density and more complex circuitry.

3.Multilayer PCBs:

Multilayer PCBs consist of multiple layers of conductive traces and insulating layers sandwiched together. ITEQ IT-258GA3 can be employed as the core material in multilayer PCBs, providing thermal reliability, CAF resistance, and compatibility with lead-free assembly processes.

4.High-Density Interconnect (HDI) PCBs:

HDI PCBs are known for their high circuit density and miniaturized components. ITEQ IT-258GA3 can be used as the substrate material in HDI PCBs, enabling the construction of fine-pitch traces and smaller vias.

5.Flexible PCBs:

Flexible PCBs (Flex PCBs) are designed to be flexible and bendable, allowing for unique form factors and applications. ITEQ IT-258GA3 can serve as the substrate material in flexible PCBs, providing thermal reliability and compatibility with lead-free assembly processes while maintaining flexibility.

6.Rigid-Flex PCBs:

Rigid-flex PCBs combine the advantages of rigid and flexible PCBs, allowing for both rigid and flexible sections within the same board. ITEQ IT-258GA3 can be used as the substrate material for the rigid sections of rigid-flex PCBs, offering thermal reliability and compatibility with lead-free assembly processes.

How to Test and Store ITEQ IT-258GA3 PCB Laminates?

Testing and storing ITEQ IT-258GA3 PCB laminates require proper procedures to ensure the material’s quality and reliability. Here are the general steps for testing and storing ITEQ IT-258GA3 PCB laminates:

Testing ITEQ IT-258GA3 PCB Laminates:

1. Visual Inspection: Perform a visual inspection of the laminates to check for any visible defects, such as scratches, cracks, or delamination.

2. Dimensional Measurement: Measure the dimensions of the laminates to ensure they meet the required specifications. Check for any warping or irregularities in shape or size.

3. Dielectric Constant and Dissipation Factor Measurement: Use a suitable testing instrument to measure the dielectric constant and dissipation factor of the ITEQ IT-258GA3 laminates. These electrical properties are critical for the proper functioning of the PCB.

4. Thermal Reliability Testing: Conduct thermal reliability testing to assess the laminates’ performance under elevated temperatures. This can involve subjecting the laminates to thermal cycling or temperature aging tests to evaluate their stability and resistance to thermal stress.

5. Electrical Performance Testing: Test the electrical performance of the ITEQ IT-258GA3 laminates, including impedance, capacitance, and signal integrity, using appropriate equipment and test methods.

Storing ITEQ IT-258GA3 PCB Laminates:

1. Packaging: Ensure that the ITEQ IT-258GA3 laminates are properly packaged to protect them from moisture, dust, and physical damage. Use anti-static packaging materials to prevent static electricity buildup.

2. Environmental Conditions: Store the laminates in a controlled environment with stable temperature and humidity levels. Follow the manufacturer’s recommendations regarding the ideal storage conditions for ITEQ IT-258GA3 laminates.

3. Shelf Life Monitoring: Keep track of the shelf life of the ITEQ IT-258GA3 laminates. Note the manufacturing date and monitor the expiration date to ensure that the laminates are used within their recommended timeframe.

4. Handling: When handling the laminates, use clean gloves to avoid contamination. Avoid bending or flexing the laminates excessively, as this can lead to mechanical stress and potential damage.

5. Inventory Management: Implement a proper inventory management system to track the quantity, location, and usage of ITEQ IT-258GA3 laminates. This helps ensure that older laminates are used before newer ones to minimize the risk of using expired materials.

By following these testing and storage procedures, you can maintain the quality and reliability of ITEQ IT-258GA3 PCB laminates, ensuring their optimal performance in PCB manufacturing processes. It is important to refer to the specific guidelines provided by the manufacturer for detailed instructions on testing and storage.


In the fast-paced world of PCB manufacturing, ITEQ IT-258GA3 PCB materials have emerged as a frontrunner, driving technological advancements and empowering manufacturers to create cutting-edge electronic devices. With its outstanding thermal reliability, resistance to conductive anodic filamentation (CAF), and compliance with industry standards, ITEQ IT-258GA3 ensures the durability, performance, and safety of electronic products. As the demand for high-performance PCB materials continues to soar, ITEQ IT-258GA3 remains a trusted choice for those who prioritize pioneering performance and unwavering reliability.

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