We are pleased to offer you our exceptional range of RO4450F, known for its remarkable quality. With our extensive experience in the industry, we are confident in our ability to meet your specific requirements.
At our company, we prioritize strict adherence to international guidelines and maintain rigorous quality control measures. This ensures that our products consistently meet the highest standards of quality.
RO4450F is a superior board material suitable for high-frequency applications, particularly in industries such as communications and 5G networks. Its performance and reliability make it an ideal choice for demanding applications in these fields.
Rest assured, we have a comprehensive inventory of all the PCBs you may need. Feel free to inquire about your specific requirements, and we will promptly assist you.
Transparency is a core value at JarnisTech when it comes to the construction of RO4450F PCBs. If desired, we can arrange for third-party inspections or provide you with a Certificate of Conformity to ensure the highest level of confidence in our products.
We are committed to delivering our products swiftly and efficiently. Please don’t hesitate to reach out to us today to explore how we can fulfill your PCB needs.
What is RO4450F?
The Rogers RO4450F is a dielectric material that is effectively combined with FR4 cores and prepreg to enhance the quality and performance of traditional FR4 multilayer designs.
Furthermore, within the same line of dielectrics, glass-reinforced hydrocarbon/ceramic laminates have been utilized in layers where superior materials are required to meet the demands of RF, microwave frequency, dielectric constant (DK), or high-speed signal applications. In less critical signal layers, FR-4 cores and prepreg are still commonly used.
If you have any further inquiries or require clarification regarding this specific laminate, we encourage you to reach out to us through our social media channels. Additionally, if you require immediate assistance, please do not hesitate to call us. We are always available and ready to provide prompt support and guidance.
Properties, Advantages and Application of Rogers Ro4450F Laminates
Rogers Ro4450F is a high-frequency circuit material developed by Rogers Corporation, a world leader in advanced materials for high-frequency printed circuit boards (PCBs). These laminates are engineered to meet the stringent requirements of RF/microwave applications, providing excellent electrical performance and thermal stability.
Dielectric Constant (Dk): It features a stable dielectric constant of approximately 3.48, which is critical for maintaining signal integrity in high-frequency circuits.
Thermal Conductivity: The thermal conductivity of Rogers Ro4450F is higher than standard FR-4 materials, offering enhanced heat dissipation capabilities.
Low Loss Tangent: Rogers Ro4450F exhibits a low loss tangent, ensuring minimal signal loss during transmission.
Thermal Coefficient of Dielectric Constant (TCDk): It exhibits an excellent TCDk, providing stability over a range of temperatures.
Glass Transition Temperature (Tg): The Tg of Rogers Ro4450F is approximately 280°C, ensuring the material’s stability under high temperatures.
Low Z-Axis Expansion: It has low z-axis expansion for plated through-hole reliability in multilayer boards.
Improved Signal Integrity: The stable dielectric constant and low loss tangent help maintain signal integrity in high frequency and high-speed digital applications.
Thermal Stability: The high Tg and low TCDk provide excellent thermal stability, which is crucial in high-power applications.
Ease of Processing: Rogers Ro4450F laminates are easily processed using standard epoxy/glass (FR-4) fabrication procedures, which can potentially reduce manufacturing costs.
Multi-Layer Capable: The low Z-axis expansion makes it suitable for use in multilayer PCBs, offering improved reliability.
Lead-Free Solder Compatible: The material is compatible with lead-free solder processes, making it suitable for use in environmentally friendly applications.
Due to their superior high-frequency performance and thermal stability, Rogers Ro4450F laminates are ideally suited for a range of applications, including:
Cellular Base Station Antennas: These require stable, low-loss materials to ensure reliable signal transmission and reception.
Power Amplifiers: The high Tg and thermal conductivity of Rogers Ro4450F make it suitable for use in power amplifiers that generate substantial heat.
Automotive Radar Systems: The stable dielectric constant and low loss tangent make these laminates ideal for use in automotive radar systems, which operate at high frequencies.
Microwave Components: These include filters, couplers, and other components that require materials with excellent high-frequency performance.
Satellite Communications Systems: These systems often require materials with excellent thermal stability and low signal loss.
High-Speed Digital Designs: These may include server, router, and switch PCBs, where signal integrity is a top priority.
It’s important to note that while Rogers Ro4450F laminates offer numerous advantages, their selection should depend on the specific requirements of the application, including frequency, power levels, environmental conditions, and cost considerations. Always consult with a materials specialist or engineer when selecting materials for high-frequency applications.
What is Material Composition and Structure of Rogers 4450F Laminates?
Rogers 4450F laminates are composed of various materials that work together to provide the desired electrical and mechanical properties. The material composition and structure of Rogers 4450F laminates typically include the following components:
The core component of Rogers 4450F laminates is a specialized dielectric material. It is designed to exhibit excellent electrical properties, such as low loss, high insulation resistance, and consistent dielectric constant (Dk) over a wide frequency range.
Rogers 4450F laminates may incorporate reinforcement materials to enhance mechanical strength and dimensional stability. Glass fibers or other reinforcing materials can be used to provide added structural integrity and rigidity to the laminate.
Copper foil is commonly used as the conductive layer in the laminate. It provides the necessary electrical conductivity for the circuitry and allows for the efficient transmission of signals.
Prepreg is a resin-impregnated reinforcement material used to bond the copper layers and the dielectric material. It acts as an adhesive layer during the lamination process, ensuring proper adhesion between the various components of the laminate.
The surface finish is applied to the exposed copper surfaces to protect them from oxidation and facilitate solderability. Common surface finishes used in Rogers 4450F laminates include solder mask, OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and immersion tin.
Rogers 4450F laminates are typically used in multilayer PCB (Printed Circuit Board) designs. The layer stackup refers to the arrangement and sequence of the copper and dielectric layers within the laminate. The specific layer stackup configuration can be customized to meet the requirements of the application.
The precise composition and structure of Rogers 4450F laminates may vary depending on the specific product grade and manufacturer. It is essential to consult the datasheet or technical documentation provided by Rogers Corporation or the laminate manufacturer for detailed information about the material composition and structure of Rogers 4450F laminates.
Key Considerations When Using Rogers RO4450F Laminates
When using Rogers RO4450F laminates, there are several key factors to consider to ensure optimal performance and successful implementation. These considerations include:
Frequency and Signal Integrity: RO4450F laminates are designed for high-frequency applications. Consider the frequency range of your circuit and ensure that the dielectric properties of RO4450F, such as its low loss and stable dielectric constant (Dk), meet your signal integrity requirements.
Thermal Management: Evaluate the thermal characteristics of RO4450F laminates, including the glass transition temperature (Tg) and coefficient of thermal expansion (CTE). These properties determine the laminate’s ability to withstand and dissipate heat, especially in applications with high power or thermal stress.
Design Flexibility: Consider the design flexibility offered by RO4450F laminates, including their compatibility with standard FR4 processing. This allows for ease of integration with existing PCB manufacturing processes and facilitates efficient production.
Material Thickness and Layer Stackup: Determine the appropriate material thickness and layer stackup configuration for your specific application. This consideration depends on factors such as impedance control, board thickness requirements, and the number of signal and power layers needed.
Mechanical Strength and Stiffness: Evaluate the mechanical properties of RO4450F laminates, including their stiffness and structural integrity. Consider whether additional reinforcement materials or specific layer configurations are necessary to meet the mechanical requirements of your application.
Environmental and Safety Compliance: Verify that RO4450F laminates comply with relevant environmental regulations, such as RoHS (Restriction of Hazardous Substances). This ensures that the laminates are free from harmful substances and environmentally friendly.
Supplier and Manufacturing Support: Choose a reputable supplier who can provide technical support and expertise in working with RO4450F laminates. Ensure that the supplier offers reliable quality control, consistent material performance, and prompt customer service.
By considering these factors, you can make informed decisions when selecting and utilizing Rogers RO4450F laminates, leading to successful and reliable applications in high-frequency and high-performance electronic circuits.
Rogers RO4450F Vs Fr4 PCB Laminates
Rogers RO4450F and FR4 PCB laminates are both widely used in the electronics industry, but they have different characteristics and are suitable for different applications. Here are some key factors to consider when comparing RO4450F laminates to FR4 laminates:
RO4450F: RO4450F laminates have a low loss tangent, which enables them to maintain excellent signal integrity at high frequencies. They offer a stable dielectric constant (Dk) over a wide frequency range, making them suitable for high-frequency applications.
FR4: FR4 laminates have a relatively higher loss tangent and the Dk can vary more significantly with frequency. They are better suited for lower frequency applications.
RO4450F: RO4450F laminates are designed for high-frequency applications, typically ranging from GHz to multi-GHz frequencies. They excel in applications involving RF/microwave circuits, high-speed digital circuits, and wireless communication systems.
FR4: FR4 laminates are commonly used in applications with lower frequency requirements, typically up to a few hundred MHz. They are widely used in consumer electronics, power electronics, and general-purpose PCBs.
RO4450F: RO4450F laminates have a higher glass transition temperature (Tg) than FR4 laminates, typically above 280°C. This makes them more suitable for applications involving high temperatures or elevated thermal stress.
FR4: FR4 laminates have a lower Tg, typically around 130-180°C. While they can handle moderate temperatures, they may not be suitable for high-temperature environments.
RO4450F: RO4450F laminates offer excellent mechanical strength and stiffness, making them suitable for applications requiring structural integrity and dimensional stability.
FR4: FR4 laminates provide good mechanical strength and are widely used in various applications, including those with less stringent mechanical requirements.
RO4450F: RO4450F laminates are generally more expensive than FR4 laminates due to their specialized properties and manufacturing processes.
FR4: FR4 laminates are cost-effective and widely available, making them a popular choice for general-purpose PCBs and applications with lower frequency and performance requirements.
It’s important to evaluate the specific requirements of your application and the trade-offs between performance, cost, and other factors when choosing between RO4450F and FR4 laminates. Consulting with PCB manufacturers or material suppliers can provide further guidance based on your project’s needs.
Key Differences Between Rogers RO4450F and Other High Frequency PCB Laminates
There are a few key differences between Rogers RO4450F laminates and other common high frequency PCB materials:
Dielectric Constant – RO4450F has a dielectric constant of 3.52, which is quite low for a high frequency material. This allows for tighter trace spacing and helps control impedance. Other RF materials like FR4 (4.5) and GETEK (4.0) have higher dielectric constants.
Loss Tangent – RO4450F has a very low loss tangent of 0.0037. This results in much lower signal loss, especially at high frequencies. Other RF materials tend to have higher loss tangents.
Thermal Conductivity – RO4450F has excellent thermal conductivity of 0.71 W/mK in the z-axis. This allows it to dissipate heat very efficiently from high power circuits. Other RF materials like polyimide have poorer thermal conductivity.
Moisture Absorption – RO4450F absorbs very little moisture (0.04%) compared to FR4 (0.2%) or other high frequency laminates. This makes it very dimensionally stable.
HF Signal Integrity – The combination of low loss tangent, low Dk, and low moisture absorption gives RO4450F exceptional high frequency signal integrity. Materials like GETEK and polyimide can’t quite match it.
Cost – RO4450F is more expensive than FR4 but comparable in cost to other premium RF materials. The increased performance makes it worthwhile for demanding RF designs.
All in All, RO4450F is an exceptional high frequency laminate that offers a unique combination of electrical, thermal, and mechanical properties ideal for RF circuit boards. Its only downside is cost.
How to Choose a Reliable Rogers RO4450F PCB Manufacturer?
Here are some tips for choosing a reliable Rogers RO4450F PCB manufacturer:
●Look for manufacturers that specialize in producing high-frequency and RF/microwave PCBs. Rogers RO4450F is designed for high frequency applications so you want a manufacturer experienced with these types of boards.
●Make sure they have experience working with Rogers materials specifically. Rogers boards require special handling and processes that generic PCB manufacturers may not have.
●Ask about their quality certifications. Look for ISO 9001 and AS9100 certifications which indicate compliance with rigorous quality standards.
●Inquire about their capabilities – things like layer count limits, minimum trace widths and spacing, impedance tolerance, etc. More capable manufacturers will be able to produce more complex Rogers boards.
●Ask for referrals or customer testimonials. Reputable Rogers PCB manufacturers should be able to provide references from satisfied customers.
●Evaluate their testing and inspection capabilities. Rogers boards often require electrical testing like impedance testing. Make sure the manufacturer has these capabilities in-house.
●Consider lead times and costs. Lead times can be longer for Rogers boards so factor this in. Get quotes from several manufacturers to compare costs.
●Check out their customer service and technical support. You want a manufacturer who can provide good support during the design and manufacturing process.
Doing thorough research and due diligence will help you find a Rogers PCB manufacturer that can reliably produce quality boards for your high frequency application.
Why Choose Us Become Your RO4450F PCB Supplier
We take pride in being experts in Rogers laminates and prepregs, and we are delighted to introduce ourselves as such. Many of our valued clients rely on our RO4450F laminates for their most complex applications, and we assure you that you will receive defect-free multilayer boards from JarnisTech.
Our Bondply product is comparable to Rogers’ RO4000 series, offering excellent Dk control that translates into exceptional performance in Plated Through Hole assembly. With a Tg (glass transition temperature) positioned at over 280 degrees Celsius, it ensures reliability even under high-temperature conditions. Additionally, it is UL 94 V-O flame retardant, ensuring safety in its usage. Moreover, it is compatible with FR4 processing, enabling faster time-to-market for your products.
Rest assured that our RO4450F PCBs comply with RoHS regulations, making them environmentally friendly. They are well-suited for typical digital circuit projects as well as backhaul radio requirements. If you have any specific concerns or require detailed information about the product, we can promptly provide it to you via email.
Our commitment to quality is demonstrated through our rigorous testing processes. All of our products undergo E-testing and AOI testing, ensuring that any board coming from our factory is free from errors.
Furthermore, our RO4450F PCBs not only offer cost-effectiveness but also durability. We provide a high-quality and cost-effective solution to meet your PCB needs.
Exceptional customer service is another aspect we prioritize. We genuinely care about you and your purchase, and we are available 24/7 to offer experienced guidance in PCB design or layout if needed. Our customer service representatives are trained to communicate clearly and courteously, ensuring a positive experience for you.
It is worth noting that our staff has an average tenure of over ten years with us, exemplifying their expertise and dedication to our company.
Rogers 4450F laminates stand out as a premier material choice for high frequency and microwave printed circuit boards. The synergistic combination of electrical, thermal, and mechanical properties in 4450F facilitate exceptional performance at microwave frequencies.
The low dielectric loss tangent enables circuits with minimal signal degradation, even at frequencies up to 50+ GHz. The stable dielectric constant allows reliable impedance control for controlled-impedance traces. Thermal conductivity in the z-axis dissipates heat efficiently from high power circuits.
Moreover, the dimensional stability from low moisture absorption maximizes reliability of multilayer boards. Add to that a TCE well matched to copper and high Tg for process tolerance. For designers pursuing miniaturized, high frequency systems, Rogers 4450F enables smaller wavelengths and trace dimensions.
In short, the balanced properties of this advanced laminate provide the highest speed, lowest loss, superb signal and power integrity, and most consistent performance across operating conditions. While cost is higher than FR4, the value realized in terms of electrical performance, reliability, and design flexibility makes 4450F an unparalleled choice for today’s cutting-edge microwave and millimeter-wave applications.