If you are dealing with high-frequency PCB applications, you may find Rogers 3035 to be the ideal solution for your projects. This PCB laminate offers exceptional performance and is particularly well-suited for power amplifiers. Its impressive capabilities make it a sought-after choice for multi-site production, and it has gained global availability due to its outstanding performance in minimum-input minimum-output applications.
At JarnisTech, we take pride in providing reliable manufacturing services for Rogers 3035. Whether you are already familiar with this laminate or seeking detailed information about it, we are here to assist you through this FAQ guide. We understand the importance of having the right PCB laminate for your specific needs, and we are dedicated to helping you make informed decisions. Let’s proceed together and explore the details of this PCB laminate.
What Is RO3035?
Rogers RO3035 circuit materials are specifically designed for high-frequency applications in RF and commercial microwave systems. These materials consist of PTFE composites filled with ceramics, offering excellent mechanical and electrical stability at competitive prices.
One notable feature of these circuit materials is their consistent mechanical properties across different dielectric constants. This allows designers to construct multilayer board designs using materials with varying dielectric constants for individual layers, without encountering reliability or warpage issues.
The dielectric constant of Rogers RO3035 materials remains highly stable even as temperature changes. The materials exhibit a coefficient of thermal expansion (CTE) of 17 ppm/°C in both the X and Y axes, similar to that of copper. This property ensures exceptional dimensional stability and minimizes the risk of bowing and twisting. Moreover, the expansion coefficient helps prevent delamination of the thick metal cladding.
For the Z-axis, the CTE is 24 ppm/°C, providing reliable performance in through-hole plating, even in harsh thermal environments. These laminates can be easily processed into PCBs using standard techniques for PTFE circuit boards, with only minor adjustments.
Overall, Rogers RO3035 circuit materials offer exceptional stability and reliability, allowing designers to achieve optimal performance in high-frequency applications while maintaining cost-effectiveness.
Performance and Application of Rogers Ro3035 Laminates
Rogers Corporation is a prominent player in the specialty material industry, known for its advanced and high-performance laminates. One of their products, the RO3035™ high frequency laminate, is designed to offer exceptional electrical and mechanical stability in demanding environments.
Dielectric Constant: The RO3035™ has a dielectric constant of 3.50±0.05 in the z-axis at 10 GHz/23°C, which makes it suitable for high frequency applications.
Low Loss: The laminate has a loss tangent of 0.0013 in the z-axis at 10 GHz/23°C, making it an ideal choice for applications where signal integrity is crucial.
Dimensional Stability: The RO3035™ exhibits excellent dimensional stability. The typical X/Y expansion coefficient is 8.7/8.2 ppm/°C. This feature makes it particularly useful in environments where temperature fluctuations occur and precision is required.
Low Moisture Absorption: With a moisture absorption rate of typically 0.04%, the laminate can maintain stable performance in humid conditions.
Thermal Conductivity: It has a thermal conductivity of 0.62 W/m/K, which aids in managing the heat dissipation in high frequency electronic applications.
Thanks to these performance characteristics, RO3035™ laminates find applications in a wide range of areas.
Antenna Systems: The material is commonly used in antenna systems such as GPS devices, satellite TV receivers, and automotive radar systems. Its low dielectric constant and loss tangent ensure signal integrity, crucial for these applications.
Microwave components: The RO3035™ is suitable for use in microwave active and passive components where low loss and dielectric constant stability are required.
RF/Microwave systems: The laminate is also used in various radio frequency (RF) and microwave systems, including power amplifiers and filters.
Aerospace & Defense: The RO3035™ finds application in aerospace and defense systems, where high frequency performance and dimensional stability are important.
Please note that the specific performance characteristics and application areas of RO3035™ laminates can slightly vary based on the specific requirements of the application. Therefore, it is always advisable to consult the manufacturer’s datasheet or technical support for precise information tailored to your particular needs.
Factors Affecting Rogers RO3035 Performance
Several factors can impact the performance of Rogers RO3035, a high-frequency laminate material. These factors include:
Frequency: The performance of RO3035 can vary at different frequencies. As a high-frequency laminate, it is specifically designed to excel in applications operating within a particular frequency range. Its electrical characteristics, such as dielectric constant and loss tangent, may vary with frequency, so it is important to consider the intended operating frequency range when assessing its performance.
Thickness: The thickness of the RO3035 material can influence its performance. Thicker laminates may exhibit different electrical properties compared to thinner ones. It is crucial to select the appropriate thickness to achieve the desired electrical performance for a specific application.
Temperature: Temperature can significantly affect the performance of RO3035. Like other materials, its electrical and mechanical properties can change with temperature variations. It is important to consider the expected temperature range in the application environment and ensure that the chosen RO3035 laminate can maintain its performance under those conditions.
Copper Cladding: The type and quality of the copper cladding used with RO3035 can impact its performance. Copper foils with different surface treatments, roughness, and thicknesses can influence the signal integrity and impedance characteristics of the PCB. It is important to select the appropriate copper cladding for the specific application requirements.
Manufacturing Process: The manufacturing process used to fabricate the PCBs with RO3035 can affect its performance. Factors such as lamination temperature, press cycle, and curing conditions can impact the material’s electrical and mechanical properties. Adhering to recommended manufacturing processes and specifications is essential to achieve optimal performance.
Environmental Factors: The operating environment, including humidity, moisture, and exposure to chemicals, can affect the performance of RO3035. It is important to consider the environmental conditions in which the PCB will be deployed and ensure that the material is suitable for those conditions.
Considering these factors and selecting appropriate design parameters, manufacturing processes, and environmental considerations will help ensure the optimal performance of Rogers RO3035 in high-frequency applications.
What Are The Advantages Of Rogers 3035?
Rogers 3035 PCB laminate offers significant advantages across various aspects, making it a highly desirable choice for electronic applications. The following are the key benefits of this laminate:
High-Frequency Compatibility: Rogers 3035 exhibits a low dissipation factor in electric circuits, making it ideal for high-frequency applications. Its reliable performance at high frequencies ensures signal integrity and transmission reliability.
Multilayer PCB Design: With impressive thermal resistivity and heat conduction properties, Rogers 3035 is well-suited for multilayer PCB assembly. Its low dielectric constant allows for proper implementation of thermal vias, while maintaining consistent electrical properties is crucial for successful multilayer PCB stackup.
Noise-Free Signal Transmission: The constant dielectric constant of Rogers 3035 promotes impedance stability and minimizes temperature changes in PCB components. This enables the use of low-pass filters and oscillators, effectively reducing noise in signal transmission.
Wide Operating Temperature Range: Rogers 3035 operates reliably across a wide range of temperatures, making it suitable for temperature-sensitive applications. Its low thermal coefficient and high volume resistivity enhance the performance of temperature-sensitive components such as power amplifiers.
Environmentally Friendly: Rogers 3035 is eco-friendly and does not pose significant harm to the environment. It is free from harmful halogens and can be used in lead-free processes, maintaining functionality while adhering to environmental regulations.
Cost-Effectiveness: Rogers 3035 provides optimum device performance at a reasonable cost. Its longevity and high robustness contribute to its overall cost-effectiveness, making it a preferred choice for cost-conscious projects.
Durability: The outstanding dielectric strength of RO3035 makes it highly suitable for high-density PCB applications. This property enhances the durability of devices, while its robustness makes it compatible with microstrip patch antennas.
Rogers 3035 is the leading PCB solution for versatile electronic projects today. Contact us to explore the most effective PCB laminates from the RO3000 series, ensuring optimal performance and reliability for your electronic applications.
What are the Limitations of the RO3035?
While Rogers RO3035 is a high-performance laminate material, it does have certain limitations that should be taken into account. These limitations include:
Cost: RO3035 is generally more expensive compared to standard PCB materials such as FR4. The specialized formulation and performance characteristics of RO3035 contribute to its higher cost. Therefore, budget considerations may be a limitation when choosing RO3035 for certain applications.
Processing Temperature: RO3035 has a relatively high processing temperature compared to other laminates. This can pose challenges during the manufacturing process, as it requires careful control and monitoring of temperature to prevent damage or distortion to the material.
Thickness Limitations: RO3035 may have limitations on the available thickness options compared to other laminates. This can restrict its use in applications where specific thickness requirements must be met.
Mechanical Strength: While RO3035 offers excellent electrical performance, it may have slightly lower mechanical strength compared to some other laminate materials. This can impact its suitability for applications requiring high mechanical stability or resistance to physical stress.
Environmental Considerations: RO3035, like other PTFE-based laminates, may exhibit some sensitivity to moisture absorption. Therefore, it is important to consider the operating environment and take appropriate precautions to protect the material from excessive moisture exposure.
Surface Finish Compatibility: Certain surface finishes used in PCB assembly, such as immersion silver or organic solderability preservatives (OSPs), may not be fully compatible with RO3035. It is essential to consult with the material manufacturer or PCB assembly experts to ensure proper surface finish selection for compatibility with RO3035.
Understanding these limitations is crucial when evaluating the suitability of RO3035 for a particular application. Careful consideration of cost, processing requirements, mechanical strength, environmental factors, and surface finish compatibility will help determine whether RO3035 is the right choice for a given project.
How Rogers Ro3035 Compares to Other RO3000 Series Laminates?
Rogers 3035, a part of the RO3000 series PCB laminates, stands out as an exceptional choice for modern technology applications. When compared to other laminates in the series, it exhibits distinct advantages, making it a preferred material for a wide range of electronic devices. Let’s delve into a comparative analysis of Rogers 3035 and its counterparts, highlighting its key attributes:
Low Dielectric Constant: Rogers 3035 boasts a significantly low design dielectric constant of 3.6, outperforming laminates such as RO3006 (6.5) and RO3010 (11.2). This property ensures high impedance stability and minimizes dispersion rates, enabling electronic devices to achieve superior performance in high-frequency applications.
Low Loss Tangent: With a loss tangent of 0.0015, Rogers 3035 demonstrates a lower value compared to other PCB laminates in the RO3000 series. This characteristic translates to reduced signal loss and improved signal integrity, making it highly suitable for high-frequency applications where minimal loss is crucial.
Low Thermal Coefficient: Rogers 3035 exhibits a low thermal coefficient, ensuring stability in the face of temperature variations. This characteristic enhances the reliability and performance of electronic devices, particularly in environments with fluctuating temperatures.
Low Moisture Absorption: Known for its remarkable durability, Rogers 3035 boasts a low moisture absorption rate of 0.04%. In highly dense conditions, this property becomes especially valuable, as it minimizes the negative impact of moisture on the laminate’s performance. In comparison, RO3010 has a relatively higher moisture absorption rate of 0.05%.
Superior Copper Peel Strength: Rogers 3035 surpasses RO3006 and RO3010 in terms of copper peel strength. This attribute contributes to enhanced robustness and reliability in electronic applications based on RO3035 PCBs, ensuring secure adhesion of copper traces and improved overall performance.
Effective Resistivity: Rogers 3035 exhibits superior surface and volume resistivity compared to other PCB laminates. This characteristic enables reliable electrical insulation and contributes to the overall performance and longevity of electronic devices utilizing RO3035.
Considering these notable properties, Rogers 3035 emerges as a superior choice among contemporary laminates in the RO3000 series. Its low dielectric constant, low loss tangent, low moisture absorption, high copper peel strength, and effective resistivity make it a preferred material for high-frequency applications, offering outstanding performance, durability, and reliability.
Is Rogers 3035 Suitable for Multilayer PCB Stackups?
Yes, Rogers 3035 is well-suited for multilayer PCB stackup. It offers several properties that make it a favorable choice for this application:
Thermal Resistivity and Heat Conduction: Rogers 3035 exhibits impressive thermal resistivity and heat conduction properties. This is crucial for multilayer PCBs where heat dissipation and management are essential. The material efficiently conducts heat away from critical components, helping to maintain optimal operating temperatures.
Low Dielectric Constant: Rogers 3035 has a low dielectric constant, which is desirable for multilayer PCB stackup. The low dielectric constant enables proper implementation of thermal vias and facilitates consistent electrical performance throughout the stackup. It helps maintain stable impedance characteristics and reduces signal distortion between layers.
Consistent Electric Properties: Rogers 3035 provides consistent electric properties across the laminate, which is essential for multilayer PCBs. Consistency in dielectric constant, loss tangent, and other electrical characteristics ensures predictable performance and reliable signal transmission across different layers of the stackup.
Durability: Rogers 3035 offers excellent dielectric strength, making it suitable for high-density multilayer PCB applications. The material’s durability allows it to withstand the mechanical stresses associated with the layering and fabrication processes involved in multilayer PCB stackup.
Considering these factors, Rogers 3035 is a reliable choice for multilayer PCB stackup. Its thermal properties, low dielectric constant, consistent electrical performance, and durability contribute to the successful implementation of complex multilayer designs while maintaining signal integrity and overall reliability.
Why Thin Rogers 3035 Laminates Are Used for High-Frequency PCBs
Thin RO3035 laminates are highly suitable for fabricating PCBs used in applications requiring high-frequency performance due to the following reasons:
Low Dielectric Constant: Thin RO3035 laminates have a low dielectric constant, which is a critical factor in high-frequency applications. The low dielectric constant ensures minimal signal loss and distortion, allowing for efficient transmission of high-frequency signals across the PCB.
Consistent Electrical Performance: Thin RO3035 laminates offer consistent electrical performance throughout the material. This consistency is crucial in high-frequency applications, where maintaining impedance control and signal integrity is essential. The uniform electrical properties of thin RO3035 laminates enable reliable and predictable performance at high frequencies.
Controlled Impedance: Thin RO3035 laminates allow for precise control of impedance in high-frequency PCB designs. Impedance matching is critical for minimizing signal reflections and maximizing power transfer in high-frequency circuits. The controlled impedance characteristics of thin RO3035 laminates contribute to improved signal quality and overall performance.
Reduced Propagation Delay: Thin RO3035 laminates exhibit low propagation delay, which is advantageous in high-frequency applications. The reduced propagation delay ensures that signals travel quickly through the PCB, minimizing timing issues and signal skew in fast-switching circuits.
Miniaturization and Flexibility: Thin RO3035 laminates offer the advantage of being thin and lightweight, allowing for the fabrication of compact and miniaturized PCB designs. This is particularly beneficial in high-frequency applications, where space constraints and signal path lengths are critical factors. The flexibility of thin RO3035 laminates enables the implementation of intricate PCB layouts with optimized signal paths.
By utilizing thin RO3035 laminates, PCBs used in high-frequency applications can achieve superior performance, reduced signal loss, controlled impedance, and efficient signal transmission. These laminates contribute to the overall success of high-frequency electronic systems by enabling reliable and optimized operation at higher frequencies.
Key Factor of Lead-Free Processing Techniques for Fabricating Rogers 3035 Laminates
Rogers 3035 laminates are commonly used in high-frequency applications due to their excellent electrical properties. When it comes to lead-free processing techniques for fabricating Rogers 3035 laminates, there are a few considerations to keep in mind. Here are some general guidelines:
Soldering: Lead-free soldering is a common requirement in many industries due to environmental concerns. When soldering components onto Rogers 3035 laminates, it is important to use lead-free solder alloys that are compatible with the laminate material. Common lead-free solder alloys include tin-silver-copper (Sn-Ag-Cu) and tin-bismuth-silver (Sn-Bi-Ag). Ensure that the soldering temperature is within the recommended range for the laminate material to avoid any damage.
Surface Finish: The choice of surface finish is crucial when working with lead-free processes. Immersion silver, organic solderability preservatives (OSP), immersion tin, and electroless nickel immersion gold (ENIG) are some commonly used lead-free surface finishes. The selection of the surface finish should take into account the specific requirements of your application and the compatibility with the Rogers 3035 laminate.
Reflow Profile: When using lead-free soldering techniques, it is essential to optimize the reflow profile to prevent excessive thermal stress on the Rogers 3035 laminate. Follow the recommended reflow profile provided by the solder paste or solder manufacturer, ensuring that the peak temperature and time above liquidus (TAL) are suitable for the laminate material.
Cleaning: Proper cleaning is crucial after the soldering process to remove any flux residues or contaminants. Choose a cleaning method that is compatible with the Rogers 3035 laminate and the specific soldering process used. Avoid aggressive cleaning agents that may damage the laminate.
Material Handling: When handling lead-free laminates, it is important to follow proper ESD (electrostatic discharge) precautions to prevent any damage to the material. Use ESD-safe workstations, tools, and equipment to minimize the risk of electrostatic discharge.
Remember to consult the specific guidelines and recommendations provided by Rogers Corporation, the manufacturer of Rogers 3035 laminates, as they may have specific instructions on lead-free processing techniques for their materials.
How to Select the Best Rogers 3035 Manufacturer?
When selecting a manufacturer for Rogers 3035, it is essential to consider several factors to ensure the best choice:
Manufacturing Ability: Look for a manufacturer with a strong manufacturing ability in producing PCBs that meet IPC standards. This demonstrates their commitment to quality and adherence to industry standards.
PCB Assembly Experience: Choose a manufacturer with a reliable and long-term experience in PCB assembly. Their expertise in assembling PCBs using Rogers 3035 will contribute to the overall quality and performance of the final product.
High-Quality Materials: Ensure that the manufacturer utilizes high-quality materials to manufacture Rogers 3035. The use of genuine and reputable materials will result in a reliable and durable PCB laminate.
Technical Support: Opt for a manufacturer that offers full-time technical support from professional technicians. This ensures that you have access to knowledgeable experts who can provide assistance and guidance throughout the manufacturing process.
RoHS Certification: Verify that the manufacturer holds RoHS certification. This certification indicates compliance with environmental regulations and the use of environmentally friendly processes and materials.
Customer Care Service: Consider the level of customer care service provided by the manufacturer. A responsive and attentive customer care team will be able to address any queries or concerns promptly and efficiently.
At JarnisTech, we have been manufacturing Rogers 3035 PCB laminate for over two decades. We are proud to offer IPC Class 2 standard PCBs and provide skilled technical support to our customers. Our commitment to quality and compliance is reflected in our RoHS certification. Contact us to experience the best and RoHS-certified Rogers 3035 and benefit from our dedicated customer care service.
Rogers 3035 is specifically designed to address the limitations encountered in PCB applications operating in the 30 to 40 GHz frequency range. Its exceptional benefits and performance characteristics make it highly compatible with the mass production of electronic devices. As a supremely effective PCB laminate, it enables users to achieve optimum performance in their PCB applications.
As a leading manufacturer in the industry, JarnisTech takes pride in producing high-quality Rogers 3035 laminates. We understand the challenges faced by PCB designers and engineers, and we are dedicated to providing solutions to their PCB-related issues. This FAQ guide aims to offer clear and concise explanations to assist you in understanding the benefits and applications of Rogers 3035. For any inquiries or information regarding the manufacturing of Rogers 3035, please feel free to contact us. We are here to assist you with your PCB needs.