In the world of printed circuit boards (PCBs), the choice of laminate material plays a crucial role in determining the performance and reliability of electronic devices. Among the top contenders in the market, Nelco N5000-30/32 BT stands out as an exceptional choice for high-frequency applications. With its advanced properties and exceptional characteristics, this laminate offers engineers and manufacturers a reliable solution for their demanding PCB designs.
Nelco N5000-30/32 BT is a high-performance laminate specifically engineered to meet the stringent requirements of high-frequency applications. Its unique composition and exceptional electrical properties make it an ideal choice for a wide range of industries, including telecommunications, aerospace, and automotive, where signal integrity and performance are paramount.
What Is Nelco N5000-30/32 BT PCB Laminates?
The Nelco N5000-30/32 BT is a type of PCB (Printed Circuit Board) laminate. PCB laminates are materials used in the construction of printed circuit boards, which are essential components in electronic devices. The N5000-30/32 BT laminate specifically refers to a high-speed, low hold time nitrocellulose epoxy package designed for medium to heavy-duty bonding applications.
This laminate utilizes a light-cured, no-mixing essential synthetic resin, making it convenient for dispensing and applying in an even coat by hand or with a standard glue gun. Once cured, the N5000-30/32 BT exhibits excellent adhesion to various substrates such as plastics, rubber, ceramics, and wood.
The N5000-30/32 BT laminate allows for standard hand gluing applications at room temperature, eliminating the need for extreme hot or cold temperatures. It is recommended to use a compatible adhesive dispenser system, such as the Nelco Z4000 Dispenser Gun with a nominal output of 90 mils/minute or less and a standard nozzle # NG18, for proper dispensing and application of this laminate.
Overall, the Nelco N5000-30/32 BT PCB laminate is a specialized material used in the construction of printed circuit boards for medium to heavy-duty bonding applications. It offers convenient dispensing, excellent adhesion, and can be applied at room temperature using a compatible adhesive dispenser system.
Features of Nelco N5000-30/32 BT PCB Substrate Materials
The Nelco N5000-30/32 BT PCB substrate materials offer several features that make them suitable for various electronic applications. Here are the key features of these materials:
1.High-Speed, Low Hold Time:
The N5000-30/32 BT laminates are designed for high-speed applications, providing efficient signal transmission and reduced signal loss. They have low hold time characteristics, allowing for fast and reliable circuit operation.
2.Excellent Electrical Properties:
The BT resin chemistry used in these laminates results in superior electrical properties. They exhibit low dielectric constant (Dk) and dissipation factor (Df), which contribute to minimal signal distortion and high signal integrity.
The N5000-30/32 BT laminates offer excellent reliability and performance. They are suitable for lead-free assembly applications and designs, ensuring compatibility with modern manufacturing processes. The laminates have a high glass transition temperature (Tg) of 205°C, indicating thermal stability and resistance to heat-related issues.
These laminates provide dimensional stability, reducing the risk of warping or distortion during the manufacturing and operation of printed circuit boards. The low coefficient of thermal expansion (CTE) in both the X/Y and Z-axes helps maintain the integrity of the circuitry over a wide temperature range.
The N5000-30/32 BT laminates exhibit excellent wire bondability, making them suitable for applications that require wire bonding techniques. This feature ensures secure and reliable connections between the circuit components.
6.Wide Processing Latitude:
The laminates offer a wide processing latitude, allowing for flexibility in manufacturing processes. They have robust drilling properties, enabling precise and reliable drilling operations during PCB fabrication.
7.Chip Packaging Options:
The N5000-30 is available as a prepreg, which can be used as a build-up material in multilayer applications. It is a natural color, high-performance BT material that provides dimensional stability. The N5000-32 is a black laminate specifically designed for double-sided PBGA applications and multilayer packages when used in conjunction with the N5000-30 prepreg.
8.Compliance and Safety:
The N5000-30/32 BT laminates meet JEDEC standards, ensuring excellent electromigration and insulation resistance. They also meet UL 94V-0 and IPC-4101/30 specifications, indicating compliance with safety and performance standards. Additionally, all Nelco® materials, including the N5000-30/32 BT laminates, are RoHS compliant, indicating they are free from hazardous substances.
These features collectively make the Nelco N5000-30/32 BT PCB substrate materials reliable, high-performance options for a wide range of electronic applications.
Properties for Nelco N5000-30/32 BT PCB Materials
The Nelco N5000-30/32 BT PCB materials possess various properties that contribute to their performance in electronic applications. Here are the properties of the Nelco N5000-30/32 BT PCB materials:
1. Thermal Properties:
●Glass Transition Temperature (Tg): The Tg of the Nelco N5000-30/32 BT PCB materials is typically around 205 °C. This temperature represents the point at which the material transitions from a rigid to a more flexible state.
●Decomposition Temperature: The decomposition temperature of the Nelco N5000-30/32 BT PCB materials is approximately 344 °C. This temperature indicates the point at which the material starts to degrade under high temperatures.
●Coefficient of Thermal Expansion (CTE): The CTE of the Nelco N5000-30/32 BT PCB materials is around 211.3 x 10^-6 K^-1. This value represents the material’s expansion or contraction with changes in temperature.
2. Mechanical Properties:
●Modulus of Elasticity: The modulus of elasticity of the cured Nelco N5000-30/32 BT PCB materials is approximately 3,300 ksi. This property reflects the material’s stiffness and ability to resist deformation under applied loads.
●Poisson’s Ratio: The Poisson’s ratio of the cured Nelco N5000-30/32 BT PCB materials is typically around 0.21. This value describes the material’s ability to “trap” motion and reduce movement rates in an applied joint without compromising bond strength.
●Shear Modulus: The shear modulus of the cured Nelco N5000-30/32 BT PCB materials is typically in the range of 551370-1400 ksi. This property indicates the material’s ability to resist shear loads on an applied joint without experiencing a significant decrease in bond strength.
●Peel Strength: The cured Nelco N5000-30/32 BT PCB materials exhibit a peel strength of approximately 1.53 kN/m. This value represents the force required to peel apart the bonded materials.
3. Electrical Properties:
●Volume Resistivity: The volume resistivity of the cured Nelco N5000-30/32 BT PCB materials is around 1.00e+15 ohm-cm. This property reflects the material’s resistance to the flow of electrical current through its volume.
●Dielectric Constant: The dielectric constant of the cured Nelco N5000-30/32 BT PCB materials is typically around 4.1 at a frequency of 1.00e+9 Hz. This value represents the material’s ability to store electrical energy in an electric field.
●Surface Resistance: The surface resistance of the cured Nelco N5000-30/32 BT PCB materials is approximately 1.00e+14 ohm. This property describes the material’s resistance to the flow of electrical current across its surface.
●Dielectric Strength: The dielectric strength of the cured Nelco N5000-30/32 BT PCB materials is around 68.9 kV/mm. This property indicates the maximum electric field strength the material can withstand without experiencing electrical breakdown.
●Dielectric Breakdown: The dielectric breakdown voltage of the cured Nelco N5000-30/32 BT PCB materials is typically equal to or greater than 50,000 V. This value represents the voltage at which the material experiences electrical breakdown and loses its insulating properties.
Dissipation Factor: The dissipation factor of the cured Nelco N5000-30/32 BT PCB materials is around 0.0090 at a frequency of 1.00e+6 Hz. This property describes the material’s ability to dissipate electrical energy as heat.
4. Other Properties:
●Water Absorption: The Nelco N5000-30/32 BT PCB materials absorb approximately 0.05% of their weight in water at room temperature.
●Flammability (UL94): The cured Nelco N5000-30/32 BT PCB materials are classified as non-flammable according to the UL94 flammability rating.
●Biological Properties: The Nelco N5000-30/32 BT PCB materials are synthetic biologic materials and are not considered hazardous in concentrations up to 50% by weight of the dry blend.
●Optical Properties: The cured Nelco N5000-30/32 BT PCB materials have a density of approximately 1.23 g/cm^3.
These properties collectively contribute to the performance, reliability, and suitability of the Nelco N5000-30/32 BT PCB materials in various electronic applications, including bonding and assembly processes.
Storage Instructions for Nelco N5000-30/32 Laminates
To maintain the shelf life of the N5000-30/32 BT, it is important to store the package in a cool and dry area. Storing it in direct sunlight or scorching locations should be avoided. It is recommended to store the package in a cool, clean container with a tightly fitting lid.
The specific storage conditions for the N5000-30/32 BT are as follows:
1.Temperature: The package should be stored at temperatures equal to or below 5 °C. This ensures that the material remains in a stable condition and is not subjected to excessive heat.
2.Relative Humidity (RH): The relative humidity should be maintained below 95%. High humidity can potentially impact the integrity and performance of the material.
For the maximum shelf life, it is ideal to store the N5000-30/32 BT at room temperature (around 25 °C) and 50% relative humidity. These conditions help to maintain the stability and quality of the material over an extended period.
Regarding packing and storage, it is recommended to tightly seal the adhesive in a moisture-proof container. This helps to prevent moisture absorption and prolongs the shelf life of the material. Avoiding direct sunlight and extremely hot locations is important to prevent any potential degradation or adverse effects on the adhesive properties.
In terms of biological safety, the N5000-30/32 BT is considered a synthetic biologic material. In concentrations up to 50% by weight of the dry blend, it is not considered hazardous. This indicates that the material does not pose significant biological risks when handled and stored properly.
By following the recommended storage conditions and precautions, you can ensure the longevity and performance of the N5000-30/32 BT PCB materials.
Nelco N5000-30/32 BT: Applications
The Nelco N5000-30/32 BT PCB substrate materials are well-suited for several applications, including:
1. BGA Multilayers: BGA (Ball Grid Array) multilayer packages require reliable and high-performance substrates to ensure proper signal transmission and thermal management. The N5000-30/32 BT laminates can be used as build-up materials in BGA multilayer applications, providing excellent electrical properties, dimensional stability, and thermal resistance.
2. PBGA (Plastic Ball Grid Array): PBGA packages, which are widely used in electronic devices, benefit from the features of the N5000-30/32 BT laminates. The N5000-32 black laminate, in particular, is suitable for double-sided PBGA applications. These laminates offer excellent wire bondability and dimensional stability, ensuring reliable connections and minimizing warping or distortion.
3. LG (Land Grid Array): LG packages, which are commonly used in microprocessors and high-performance integrated circuits, can benefit from the use of the N5000-30/32 BT laminates. These laminates provide high-speed performance, low hold time, and excellent electrical properties, making them suitable for LG applications.
4. PCMCIA (Personal Computer Memory Card International Association): PCMCIA cards, which are used in various portable electronic devices, require reliable and durable substrates. The N5000-30/32 BT laminates offer excellent reliability, dimensional stability, and electrical properties, making them suitable for PCMCIA applications.
5. MCM-Ls (Multi-Chip Modules – Laminate-based): MCM-Ls integrate multiple chips into a single package, requiring advanced substrate materials. The N5000-30/32 BT laminates provide the necessary electrical performance, thermal stability, and wire bondability for MCM-L applications, ensuring reliable interconnections between the chips.
6. Direct Chip Attach: Direct Chip Attach (DCA) is a packaging technique where chips are directly attached to the substrate without the use of wire bonding or other interconnection methods. The N5000-30/32 BT laminates, with their excellent wire bondability and dimensional stability, can be used in DCA applications to ensure secure and reliable chip attachment.
7. JEDEC Conforming Packages: The N5000-30/32 BT laminates meet JEDEC standards, making them suitable for various JEDEC conforming packages. These packages include a wide range of integrated circuit packages used in the electronics industry, such as QFN (Quad Flat No-Lead) and SOIC (Small Outline Integrated Circuit) packages.
Overall, the Nelco N5000-30/32 BT PCB substrate materials find applications in BGA multilayers, PBGA packages, LG, PCMCIA, MCM-Ls, direct chip attach, and JEDEC conforming packages. These materials offer the necessary electrical properties, reliability, and performance required for these applications, ensuring the successful operation of electronic devices.
Nelco N5000-30/32 BT is a game-changer in the world of PCB laminates, offering unparalleled performance and reliability for high-frequency applications. Its advanced composition, exceptional electrical properties, and proven track record make it a go-to choice for engineers and manufacturers seeking the highest level of signal integrity and performance. With Nelco N5000-30/32 BT, you can confidently design and produce cutting-edge electronic devices that meet the demands of today’s fast-paced technological landscape.