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10 Layer PCB

Jarnistech > Multilayer PCB > 10 Layer PCB
10 Layer HDI PCB

A Printed Circuit Board (PCB) serves as an essential electronic element, constituting the backbone for numerous electronic apparatus. Over recent years, the escalating demand for compact yet intricate electronic devices has catalyzed the advent of 10 Layer PCBs.

For electronic appliances necessitating six routing layers, design engineers in PCB domain often recommend using a ten-layer PCB, owing to its distinct advantages. Typically, a ten-layer PCB encompasses six signal layers and four plane layers. The recommendation against designing a ten-layer board with more than six signal layers is grounded in manufacturing convenience, as ten layers mark the utmost limit that can be comfortably manufactured on a board with a thickness of 0.062 inches. Although rare, some PCB manufacturers can fabricate a 12-layer board from 0.062-inch thick boards.

Collaborating with a distinguished PCB manufacturer is a wise move if you are embarking on a 10-layer PCB project. Prestigious firms like JarnisTech deliver superior solutions and PCB production services, maintaining quality control throughout the comprehensive production cycle. With our proficiency and experience, we craft reliable, resilient, and high-performing ten-layer PCBs tailored to your requirements. Reach out to JarnisTech for your 10-layer PCB, and experience our exceptional service.

What is a 10 Layer PCB?

A 10 Layer PCB is a type of multi-layered printed circuit board that has ten layers of conductive material separated by insulating layers. Its design caters to intricate electrical circuits, making it a preferred choice for applications demanding high performance. This encompasses platforms like smartphones, computing devices, automobile electronics, and aerospace equipment.

The integration of multiple layers equips designers with the capacity to route circuit traces in a more streamlined and condensed manner, thereby shrinking the dimensions of the PCB whilst augmenting its functionality. Resorting to a 10 Layer PCB potentially furnishes superior signal fidelity, heightened reliability, optimal thermal administration, and improved electromagnetic compatibility (EMC) performance when compared with single or double-sided PCBs.

PCB Design Considerations for 10 Layer PCBs

When designing a 10 Layer PCB, some important considerations to keep in mind include:

● Layer stack-up configuration: Careful selection of the stack-up configuration is crucial to ensure the integrity and performance of the PCB, as it determines the distribution of power planes, ground planes, and signal layers.

● Trace Routing: Careful placement of signal traces is crucial to circumvent issues of signal crosstalk and interference. High-velocity signals are ideally directed on internal layers, whereas low-velocity signals can appropriately be navigated on outer layers.

● Power delivery: Proper distribution of power planes is critical to prevent voltage drops and ensure reliable power delivery. It is important to ensure that high current traces have adequate copper thickness, trace width, and clearance from other components.

● Ground planes: Proper grounding is critical to ensure the integrity of the signals and to reduce EMI. Ground planes should be designed with low impedance, and all components should have a clear path to ground.

● Thermal management: The high density of components and the power dissipated in a 10 Layer PCB can lead to heat buildup, which can damage components and affect performance. Thermal vias, heat sinks, and other cooling techniques should be used to manage heat dissipation.

● Design Rules: Compliance with the design directives stipulated by the manufacturer is fundamental to ascertain the manufacturability and dependability of the PCB.

● Inspection and verification: The necessity for thorough examination and validation of the PCB cannot be overstated, as it guarantees both its dependability and operational efficiency. Implementing a testing procedure at each stage of the design process helps to confirm that the design fulfills anticipated performance standards and facilitates the identification and rectification of potential issues

Testing and Inspection of 10 Layer PCBs

The execution of meticulous testing and inspection protocols for 10 Layer PCBs is essential for verifying that the end product aligns with anticipated specifications, is dependable, and functions as predicted. The commonly employed testing and inspection techniques include:

● Visual Inspection: This involves an overt examination to ensure the absence of noticeable flaws or harm to the PCB.

● Automated optical inspection (AOI): It is a testing technique that involves using cameras and specialized software to examine printed circuit boards (PCBs) for issues like, out of place components, absent solder connections and solder bridges.

● X-ray inspection: This represents a non-destructive technique employed to scrutinize the inner formation of the PCB, which covers the examination of solder joint quality and fluidity, in addition to detecting the existence of any voids or fissures in the components or solder.

 In-circuit testing (ICT): ICT is a functional testing method that involves the use of a test fixture to check and verify the connectivity, resistance, and capacitance of the components on the PCB.

● Flying probe testing: Flying probe testing is a form of ICT that uses a fixture with probes to test the connectivity and functionality of the PCB.

● Environmental testing: Environmental testing is conducted to ensure that the PCB can function under extreme conditions such as temperature changes, humidity, and vibration.

● Electrical performance testing: Electrical performance testing involves verifying the power delivery, signal integrity, and thermal management of the PCB using various testing equipment such as oscilloscopes and thermal cameras.

As a result, proper testing and inspection of 10 Layer PCBs ensure that they meet design specifications, are reliable, and perform as expected before being placed in service.

Advantages of Opting for a 10 Layer PCB

Utilizing a 10 layer PCB offers advantages, such as:

Higher circuit density
Enhanced signal integrity
Improved thermal regulation
Better EMC performance
Decreased size and weight
Increased dependability
Simplified compliance, with design specifications
Lowered interference levels
Improved manufacturing oversight

Examples of Applications for 10 Layer PCBs

10 layer PCBs are commonly utilized across applications that necessitate intricate high density and high performing circuitry. Lets delve into some scenarios where 10 layer PCBs are extensively employed:

Telecommunications industry
Medical devices sector
Aerospace and Defense field
Industrial equipment manufacturing
Consumer electronics market
Automotive industry sector

Choosing the Right Vendor for Multilayer PCBs

Manufacturing multilayer printed circuit boards (PCBs) requires special equipment, skilled workers and significant financial resources. These aspects often cause certain manufacturers to approach the multilayer sector with caution compared to others.

At JarnisTech, we have the capabilities and expertise to support advanced printed circuit board designs with challenging requirements. Our manufacturing processes include laser-drilled microvias and cavity boards, heavy copper up to 20 oz, via-in pad, microwave and radio boards, and production of up to 60 layers.

Our team is vested with cutting-edge facilities and harnesses progressive manufacturing techniques to deliver superior-quality, high-performance PCBs for our esteemed clientele. We boast a cadre of competent operators who regularly partake in training, keeping pace with the most recent industry advances, hence ensuring the exceptional quality and reliable nature of our products.

Regardless of the intricacy of your multilayer PCB board or the complexity of your design prerequisites, our dedicated team is focused on offering unparallel service and bespoke solutions that mirror your specific necessities. Now , please contact with us to gain more insights into how we can can help with your multilayer PCB project.

Rigid Multilayer 10 Layer PCB Manufacturer: JarnisTech

High-Density Interconnect (HDI) technology is commonly employed in the crafting of Printed Circuit Boards (PCBs) encompassing either 10 or 20 layers. HDI boards are distinguished by their compact dimensions, high interconnection densities, and bespoke microvia design standards.

It’s important to recognize that not every 10 layer or 20 layer PCB falls under the category of HDI boards. Some PCBs might have trace widths, more spacing and holes with a diameter exceeding 0.3mm. With our expertise, in PCB manufacturing we are equipped to generate both HDI and non-HDI boards customizing them to meet the unique requirements of our clients regardless of whether they prefer a 10 layer or 20 layer PCB circuit boards.

Rigid Multilayer 10 Layer PCB

At JarnisTech, our team is profoundly skilled in the design, production, and PCB assembly, irrespective of their complexity or layer count. Thanks to our advanced facilities and seasoned team, we’re able to offer dependable, superior-quality, and cost-effective PCBs.

Our offerings to accommodate clients with diverse needs. Be it an HDI board or a non-HDI board, our team is devoted to delivering top-tier solutions and sterling service. Please Contact us to explore how we can contribute to your success now!

Advanced Technology From JarnisTech:

● We leverage advanced PCB manufacturing technologies to produce PCBs of up to 60 layers, achieving a minimum trace and space of 2.5/2.5mil. Our capabilities include a maximum board thickness to hole diameter ratio of 12/1.

● To meet the design requirements of photoelectric communication products, we have developed long and short gold finger processing techniques and high-density trace precision control. Our high-precision back drilling technology minimizes equivalent series inductance vias to enhance signal transmission integrity.

● For high heat-dissipating power products, we use ultra-thick copper and advanced metal-based manufacturing processes. We apply laser depth control technology and high-precision mechanical engineering to create multi-level step groove products, meeting various assembling requirements.

● Our mature mixed pressure process can combine FR-4 and high-frequency materials, resulting in reduced material costs while meeting high-frequency performance standards. We have also applied advanced Anti-Caf technology to increase PCB reliability and service life.

● Advanced buried capacitor and resistor technology improves PCB product performance, while our advanced inner layer exposed technology meets high-frequency circuit information transmission requirements.

At Jarnistech, we diligently ensure to stay in sync with industry trends and advancements. This empowers us to provide leading-edge PCB solutions, tailored specifically to align with our clients’ product designs and requisites. We cordially invite you to reach out to us for a detailed explanation on how we can support you in producing high-standard PCBs, specifically engineered to fulfill your requirements.

Strict Quality Control:

● Recognising the significance of adhering to industry standards and certifications in our PCB production methods, we have secured several acknowledgments. These include UL accreditation, ISO/TS1694:2009 validation, and the quality standard ISO9001:2008 endorsement.

● We also prioritize the confidentiality of our clients’ information and have implemented strict management policies to ensure its protection.

● Our production process follows IPC 6012 II/III standards along with customer-specific requirements, enterprise standards, and industry practices. We emphasize the use of quality materials, advanced manufacturing equipment, and strict quality control measures to produce custom products that meet our clients’ exact specifications.

● Lastly, our primary is to present PCB solutions conformed to the utmost quality benchmarks for our esteemed clients. We encourage you to initiate a conversation with us to delve into how we can facilitate you in achieving your PCB production goals, whilst conforming to the required standards and certifications.

Layer Stack-up Configuration for 10 Layer PCB

The layer stack up configuration for a 10 Layer PCB is crucial as it varies according to the requirements of the application and several common layouts are widely used:

● Standard layer stack up:

The typical layer arrangement consists of four signal layers (top, bottom, inner 1 and inner 2) two power planes ( 3 and inner 8) two ground planes (inner 4 and inner 7) and two split planes (inner 5 and inner 6).

● Power/Ground layer stack up:

This setup comprises four signal layers (top, bottom, inner 1 and inner 2) two power planes (inner 3 and inner 8) along, with four ground planes (inner 4 inner 5 inner 6 and inner7).

● Mixed power and ground layer stack-up:

The layer arrangement includes four signal layers (top, bottom, inner1 andinner2) three power planes(inner3,inners7 andinners8)andthreegroundplanes(inner4,inners5 andinners6). This configuration integrates layers that work together seamlessly.

Standard 10 Layer PCB Stack–Up

For designers of printed circuit boards (PCBs), utilizing a 10-layer stack-up is a popular and practical choice. A standard stack-up of 10 layers serves as a common option applicable in most PCB designs.

This configuration of a 10-layer stack-up confers benefits in design versatility, signal integrity, and power distribution. It’s crafted to meet a broad spectrum of design needs and is compatible with a myriad of applications.
Standard 10 Layer PCB Stack Up 1.33MM and 1.6MM

     Standard 10L Stacks Up 1.6MM                                                Standard 10L stacks up 1.33MM


Standard 10 Layer PCB Stack Up 2.0MM and 2.4MM
      Standard 10L Stacks Up to 2.0MM                                       Standard 10L Stacks Up 2.4MM


Standard 10 Layer PCB Stack Up 3.0MM
                                                          Standard 10L Stacks Up To 3.00mm

The standard 10-layer PCB buildup depicted above is based on the best manufacturing features in terms of both quality and cost. However, to ensure optimal quality and prevent potential issues during the PCB assembly process for designs with six or more layers, we highly recommend using Tg170 laminate material.

Our typical 10-layer structure incorporates a 1/1/1/1/1/1/1/1/1/1 oz copper thickness, establishing it as the perfect solution for fabricating multilayer rigid PCBs.

At JarnisTech, we also offer the option to customize our stack-up configurations to align with your specific PCB design needs.

For example, if your needs involve a custom stack-up with impedance control on a 10-layer circuit, or perhaps a PCB demanding greater copper thickness, such as a 3-ounce copper stack-up, we invite you to contact us at [email protected] for additional information and support. Our team of experts stands ready guide you through the entire process and aid in selecting the optimal stack-up configuration tailored for your desired results.

Using High-quality Raw Materials: Multilayer PCB

In relation to selecting substrate materials for printed circuit boards (PCBs), it becomes crucial to opt for brands that hold a validated reputation for superior quality and performance. Some of the forerunners in the industry comprise Shengyi, Rogers, Arlon, Taconic, among others.

These reputable brands provide an assortment of material options encompassing laminates, prepregs, and diverse substrates, exhibiting varied traits such as flexibility, thermal conductivity, and dielectric constant. By incorporating these superior-quality materials, we affirm the durability and longevity of our PCBs.

In addition to substrate materials, the auxiliary materials used in PCB manufacturing are also crucial to achieving high-quality and durable results.

We use trusted brands like Taiyo ink, Hitachi dry film and Noda resin, known for their quality and consistency in the PCB industry.

At JarnisTech, we recognize the significance of employing premium-grade materials to fabricate PCBs that cater to our clients’ precise requirements. Our accomplished team of professionals possess an abundance of experience in picking and managing the top-notch brands and materials prevalent in the industry, which enables us to deliver superior outcomes.

10-Layer Board Lead Time

The expense incurred in the fabrication of a printed circuit board (PCB) hinges on the quantity of boards demanded, the specific process prerequisites, and the pricing framework. To acquire a cost estimate, clients can submit a Gerber file to us, encompassing the pertinent design specifications.

Typically, a 10-layer PCB manufactured in a general factory takes approximately 10-15 days to produce. Nonetheless, at JarnisTech, we recognize our clients’ occasional need for a swifter production process to align with their project’s timelines. Subsequently, we propose an expedited service for clients requiring their orders to be finalized within a reduced timeframe. This ensures orders can be fulfilled in as minimal as a week’s time, upholding our constant pledge to quality and performance.

At JarnisTech, we are committed to meeting our clients’ needs and providing exceptional service and products. Our team of experts utilizes advanced manufacturing technologies and techniques to deliver high-quality PCBs that meet our clients’ exact specifications while also offering competitive pricing and timely delivery.

10 Layer Prototype PCB


Do you need someone to manufacture your PCB ? JarnisTech can help !

10 Layer PCBs are essential in modern electronic devices that require high-density, complex, and high-performance circuitry. A careful consideration of various design factors such as layer stack-up configuration, trace routing, power delivery, ground planes, thermal management, design rules, and testing and verification is necessary to ensure their proper functionality and performance.

The fabrication process for a 10 layer PCB involves several steps such as designing, layer stack-up, drilling, electroless deposition, plating, lamination, etching, solder mask and silk screen, surface finish, and electrical testing. Testing and inspection of the final product are critical to ensure the final PCB meets the desired specifications, reliability, and performs as expected. 10 Layer PCBs find diverse applications in various industries such as telecommunications, aviation, defense, medical, automotive, industrial equipment, and consumer electronics.

The fabrication of Printed Circuit Boards (PCBs) necessitates conscientious precision and profound expertise. Consequently, it is integral to choose a manufacturer who consistently underscores the criticality of quality at all stages of the manufacturing process. This commitment underlines the assurance that your PCBs will align seamlessly with your specific criteria.

Jarnistech has held a position at the forefront of custom PCB providers in China for over two decades. Our accomplishment is gauged by the successes of our clients, which commits us to diligently supervise every step of the PCB fabrication process. We certify that your order is securely packaged and dispatched to avert any transit damages. Being a reliable supplier, we cater to clients across 100 countries, fabricating circuit boards for enterprises of diverse scales. As we look ahead, our dedication lies in ensuring the delivery of our PCBs to every global extremity.

We specialize in producing quick-turn prototypes and mass production of PCBs, as well as providing assembly services. Our team offers a fast and free quotation to help you make informed decisions.

At Jarnistech, we understand that our clients’ success is our success, so we take great care to manufacture high-quality PCBs that meet your requirements. Contact us today to discuss how we can help you achieve your PCB manufacturing goals.

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