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6 Layer Rigid-flex PCB

Jarnistech > Rigid-flex PCB > 6 Layer Rigid-flex PCB
6 Layer Rigid-flex PCB

Rigid-flex PCBs offer a remarkable solution for seamlessly integrating multiple rigid PCBs through flexible circuits within a single assembly. This innovative approach, combining rigid and flexible materials on a single board, enables the realization of three-dimensional packaging and enhanced component density within electronic devices.

A 6-layer rigid-flex PCB, as the name suggests, involves a stackup configuration comprising six conductive copper layers. This article aims to provide a comprehensive overview of the technology behind 6-layer rigid-flex PCBs, encompassing various essential aspects.

What Is 6-Layer Rigid-Flex PCB Circuit Board?

A 6-layer rigid-flex PCB circuit board is a specialized type of printed circuit board that combines both rigid and flexible materials to create a multi-layered structure. It consists of six conductive copper layers, providing electrical connectivity and component mounting points.

The rigid sections of the PCB are typically made of traditional FR-4 or high-frequency materials, offering stability and mechanical support for components. These sections are rigid and cannot be bent or flexed.

In contrast, the flexible sections of the PCB are created using flexible materials such as polyimide. These flexible materials allow the PCB to bend, fold, or flex as needed, enabling the integration of the rigid sections into three-dimensional configurations. The flexible sections provide connectivity between different rigid layers and facilitate movement within electronic devices.

The layers of the 6-layer rigid-flex PCB are stacked together, with the rigid layers and flexible layers interleaved. Vias and interconnections are created through drilling and copper plating processes, ensuring electrical continuity between the layers. Copper traces are selectively etched to form circuit patterns, and the layers are laminated together under heat and pressure.

The combination of rigid and flexible sections in a 6-layer rigid-flex PCB allows for compact and intricate designs that can overcome the limitations of traditional rigid PCBs. It enables efficient utilization of space within electronic devices, enhances reliability by reducing the need for connectors and cables, and improves signal integrity by minimizing signal loss and electromagnetic interference.

Construction and Materials of 6 Layer Rigid-flex PCB

The construction of a 6-layer rigid-flex PCB involves the use of specific materials that combine rigid and flexible elements. Here is an overview of the construction and materials involved in a typical 6-layer rigid-flex PCB:

Rigid Layers:

Core Material: The rigid layers of the PCB are typically made of FR-4 (Flame Retardant-4) or other high-frequency laminates. FR-4 is a widely used epoxy-based material known for its excellent electrical insulation properties and mechanical stability.

Copper Foil: A thin layer of copper foil is bonded to the surfaces of the rigid layers. The copper foil serves as the conductive material for forming circuit traces and creating electrical connections.

Flexible Layers:

Polyimide (PI): The flexible layers of the PCB are typically constructed using polyimide (PI) film. Polyimide is a durable and flexible material that can withstand bending and flexing without losing its electrical properties.

Adhesive: A heat-resistant adhesive is applied to bond the copper foil to the polyimide layers. This adhesive layer ensures the mechanical integrity of the flexible sections.

Adhesive Layers:

Prepreg: Prepreg, or pre-impregnated resin, is a composite material consisting of a resin matrix impregnated with glass fibers. It is used as an adhesive layer to bond the rigid and flexible layers together during the lamination process.

Bonding Sheets: Bonding sheets are often employed to provide additional adhesion and stability between the layers. These sheets are usually made of epoxy-based materials that can withstand high temperatures and ensure reliable bonding.

Copper Interconnections:

Vias: Vias are small holes drilled through the layers of the PCB, connecting different conductor layers. These vias are plated with copper to establish electrical connections between the layers.

Plated Through-Holes (PTH): Plated through-holes are larger vias used to connect components and provide interconnections between different layers of the PCB.

These construction materials and layers are carefully selected and combined to create a 6-layer rigid-flex PCB that offers both mechanical stability and flexible functionality. The layers are stacked together, and during the manufacturing process, they undergo drilling, plating, etching, and lamination steps to form the final rigid-flex PCB structure.

Common of 6 Layer Rigid-flex PCB Stack-up

6 Layer Rigid-flex Construction

A common six-layer rigid-flex PCB stack-up typically includes alternating layers of rigid and flexible materials. Here’s an example of a common six-layer rigid-flex PCB stack-up:

1. Layer 1: Rigid Layer – This is the bottom layer of the stack-up and typically consists of a rigid substrate material, such as FR4. It may contain signal traces, power planes, and ground planes.

2. Layer 2: Flex Layer 1 – This layer is made of a flexible material, such as polyimide (PI), that allows for bending and flexing. It may contain additional signal traces or power planes.

3. Layer 3: Rigid Layer – This layer is another rigid layer, similar to Layer 1. It provides structural support and protects the underlying flex layers. It may contain signal traces, power planes, and ground planes.

4. Layer 4: Flex Layer 2 – Another layer of flexible material, similar to Layer 2, is added for additional flexibility. It may contain signal traces or power planes.

5. Layer 5: Rigid Layer – This layer is another rigid layer, similar to Layer 1 and Layer 3. It provides additional structural support and may contain signal traces, power planes, and ground planes.

6. Layer 6: Rigid Layer – This is the top layer of the stack-up and is typically a rigid layer, similar to Layer 1 and Layer 3. It provides the final structural support and may contain signal traces, power planes, and ground planes.

It’s important to note that the specific materials, thicknesses, and order of layers in a rigid-flex PCB stack-up can vary depending on the application, design requirements, and manufacturer’s capabilities. Complex designs may include additional layers of rigid and flexible materials. It’s recommended to work closely with a PCB manufacturer or design engineer to determine the optimal stack-up for your specific project.

6 Layer Rigid Flex PCB Fabrication Process

The fabrication process for a 6-layer rigid-flex PCB involves several key steps to create the layered structure and interconnections between the rigid and flexible sections. Here is a general overview of the fabrication process:

Layer Stacking:

Preparing Rigid and Flexible Layers: The rigid and flexible layers, made of FR-4 and polyimide respectively, are prepared with copper foil attached to their surfaces.

Aligning and Stacking Layers: The layers are carefully aligned, ensuring that the copper traces and vias align properly for interconnections between layers.

Drilling and Plating:

Drilling: Small holes, known as vias, are drilled through the stacked layers at specific locations to establish electrical connections between the layers.

Desmear and Plating: The drilled vias are treated to remove any debris or smear caused by the drilling process. They are then plated with a conductive material, usually copper, to create electrical pathways.

Etching and Lamination:

Etching: Copper traces and circuit patterns are formed by selectively etching away excess copper from the surface using a chemical process. This creates the desired circuitry on each layer.

Lamination: The etched layers, along with prepreg layers, are stacked and pressed together under heat and pressure. The heat activates the adhesive properties of the prepreg, bonding the layers together to form a solid structure.

Surface Finishing:

Solder Mask Application: A solder mask layer is applied to the surface of the PCB, covering the copper traces and leaving only the desired areas exposed for soldering components.

Copper Plating and Outer Layer Etching: Outer layers are copper-plated to provide a protective and conductive surface. Excess copper is then etched away to reveal the desired circuitry and patterns.

Surface Finish: A surface finish is applied to protect the exposed copper and provide a solderable surface. Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and immersion silver.

Throughout the fabrication process, quality control measures, including inspections and tests, are performed to ensure the integrity of the PCB and adherence to design specifications.

It is important to note that the specific details of the fabrication process may vary depending on factors such as the PCB manufacturer’s capabilities, design requirements, and industry standards.

6 Layer Rigid-flex PCB Board Design Guidelines

Designing a 6-layer rigid-flex PCB requires careful consideration of various factors to ensure optimal performance, reliability, and manufacturability. Here are some key design guidelines to keep in mind for 6-layer rigid-flex PCB boards:

Bend Radius Considerations:

Determine Minimum Bend Radius: Identify the minimum allowable bend radius for the flexible sections of the PCB. This ensures that the flexible material can withstand repeated bending without damage.

Avoid Sharp Corners: Minimize the use of sharp corners in the flexible sections as they can weaken the material and lead to failure over time.

Provide Sufficient Clearance: Ensure that there is adequate clearance between components and the bend areas to avoid interference during bending.

Trace Routing Techniques:

Differential Pair Routing: If your design involves high-speed signals, consider routing differential pairs to maintain signal integrity and minimize crosstalk.

Controlled Impedance Routing: For impedance-controlled signals, use appropriate trace widths and spacing to achieve the desired impedance values and ensure signal integrity.

Avoid Right-Angle Traces: Minimize the use of right-angle traces as they can cause signal reflection and impedance mismatch. Instead, use gradual curves or mitered corners.

Component Placement Strategies:

Flexible vs. Rigid Placement: Determine which components should be placed on the flexible sections and which should be on the rigid sections based on mechanical and electrical considerations. Components on flexible areas should be able to withstand bending and flexing.

Keep Components Away from Bend Areas: Place sensitive or delicate components away from the bend areas to avoid mechanical stress or damage during flexing.

Thermal Management: Consider the thermal characteristics of components and ensure that heat dissipation is properly managed, especially in areas where rigid and flexible sections are in close proximity.

Signal Integrity and EMI Considerations:

Ground Plane Placement: Utilize dedicated ground planes to provide proper grounding and minimize noise.

Signal Layer Arrangement: Arrange signal layers in a way that minimizes cross talk and interference between adjacent layers, especially in the flexible areas.

Shielding and EMI Protection: Incorporate shielding techniques and ground planes to protect sensitive signals from electromagnetic interference (EMI).

Testability and Accessibility:

Test Points: Include appropriate test points for ease of testing and troubleshooting during production and maintenance.

Connector Placement: Ensure that connectors or test points are accessible and can be easily connected or probed for testing purposes.

Design for Manufacturability:

Design Rule Check (DRC): Perform a design rule check to ensure that the design complies with the manufacturing capabilities and tolerances of the PCB manufacturer.

Layer Stacking Considerations: Plan the layer stackup carefully, considering the thickness and arrangement of the rigid and flexible layers to achieve desired flexibility and mechanical stability.

Keep Traces Symmetrical: Maintain symmetrical trace routing in flexible areas to distribute stress evenly during bending.

By following these design guidelines, you can optimize the functionality, reliability, and manufacturability of your 6-layer rigid-flex PCB design. However, it’s important to consult with your PCB manufacturer and consider specific design rules and guidelines provided by them for best results.

Assembly Considerations For 6 Layer Rigid-flex PCBs

Flex-to-Rigid Connection: The assembly process requires specialized techniques to establish reliable connections between the flexible and rigid sections.

Component Compatibility: Components chosen for rigid-flex PCB assemblies should be suitable for the bending and flexing movements of the board.

Testing and Inspection: Rigorous testing and inspection procedures are necessary to ensure the reliability and functionality of the assembled PCB.

What Factors Cost Impact On 6 Layer Rigid Flex?

The cost of a 6-layer rigid-flex PCB can be influenced by several factors. Here are some key aspects that can impact the cost:

Material Selection: The choice of materials for the rigid and flexible layers can significantly affect the cost. FR-4 is a commonly used and cost-effective material for rigid sections, while polyimide is often used for flexible areas but tends to be more expensive. Higher-grade materials or specialized laminates can also increase the cost.

Layer Count: The number of layers in the PCB has a direct impact on the cost. As the layer count increases, the complexity of fabrication and the amount of material required also increase, leading to higher costs.

PCB Size and Complexity: Larger PCBs generally require more material and longer manufacturing times, resulting in higher costs. Additionally, complex designs with intricate routing, multiple components, and fine pitch components can increase the manufacturing complexity and, consequently, the cost.

Manufacturing Processes: Certain manufacturing processes, such as drilling, plating, lamination, and specialized techniques for rigid-flex PCBs, can add to the overall cost. For example, the drilling and plating of vias in multiple layers can increase costs compared to simpler PCB designs.

Design Specifications: Specific design requirements, such as controlled impedance, high-speed signaling, and tight tolerances, can impact the cost. These requirements may necessitate additional manufacturing steps, specialized materials, or stricter quality control measures, which can add to the overall cost.

Quantity and Lead Time: The quantity of PCBs ordered and the desired lead time can influence the cost. Ordering a larger quantity can often result in volume discounts, while shorter lead times may incur additional charges for expedited manufacturing.

Manufacturer and Location: The choice of PCB manufacturer and their location can affect the cost. Different manufacturers have varying pricing structures, capabilities, and overhead costs that can impact the overall cost of the 6-layer rigid-flex PCB.

Rigid-flex PCBs generally involve more complex manufacturing processes and specialized materials, which can impact the overall cost compared to traditional rigid PCBs.

However, considering the benefits and increased functionality offered by rigid-flex technology, the cost is often justified in applications where space constraints, reliability, and performance are critical factors.

Benefits and Applications of 6 layer Rigid-flex Circuit Board

Enhanced Design Flexibility: Rigid-flex PCBs enable intricate and compact designs, overcoming the limitations imposed by traditional rigid PCBs.

Increased Reliability: The elimination of connectors and cables reduces the risk of failure due to mechanical stress or vibration.

Space Savings: The ability to fold or bend the flexible sections allows for efficient space utilization within electronic devices.

Improved Signal Integrity: Rigid-flex technology minimizes signal loss and electromagnetic interference, enhancing overall performance.

Diverse Applications: 6-layer rigid-flex PCBs find applications in aerospace, medical devices, consumer electronics, and other industries demanding compact and reliable electronic assemblies.

Why Choose Us

One of the Most Exceptional Rigid-flex PCB Manufacturers

JarnisTech has earned a strong reputation as a trusted and reliable supplier of rigid-flex circuit boards, satisfying the diverse manufacturing requirements of our valued customers. Our unwavering dedication to advanced rigid-flex PCB technology sets us apart in the industry.

With a team of highly skilled professionals specializing in rigid-flex circuits, we possess the expertise to comprehend your design swiftly, eliminating the need for repetitive explanations. This streamlined approach saves you valuable time, particularly during cross-timezone conversations. As our client, you can count on us to provide comprehensive Design for Manufacturability (DFM) support at the early stages of your project, ensuring smooth communication throughout, and delivering your order punctually.

Our most esteemed service is the provision of quick-turn rigid-flex PCBs. Whether you require a single-layer rigid-flex circuit, a double-sided rigid-flex circuit, or a multilayer rigid-flex board featuring blind or buried vias, we guarantee superior quality and timely production. Our manufacturing capabilities extend to 36-layer rigid-flex PCBs, enabling us to fulfill projects of varying complexity.

If you have a time-sensitive project necessitating rapid prototyping to validate a new concept, our expedited service is tailored to meet your needs. We are committed to delivering your “first-build” prototypes promptly and at a competitive cost, allowing you to progress swiftly with your product development.

For inquiries regarding the cost of rigid-flex PCBs, we encourage you to contact us without delay at [email protected]. By reaching out to us, you will engage with one of the foremost rigid-flex PCB manufacturers in China, ensuring exceptional service and superior product quality.

In summary

6-layer rigid-flex PCB technology offers unique advantages, allowing for compact, reliable, and multifunctional electronic assemblies. By understanding the benefits, construction, fabrication process, design guidelines, assembly considerations, and cost impact, PCB manufacturers can harness the potential of this advanced technology to meet the evolving demands of various industries.

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